Inventor · disambiguated record
Nagraj Shankar
Also filed as: SHANKAR NAGRAJ
31 granted patents·3 pending applications·660 citations·filing 2012–2024
97Inventor score
Top patents by PatentIndex Score
34 records- 0198US10002787B2Staircase encapsulation in 3D NAND fabricationLAM RES CORP·Filed 2017·Granted Jun 19, 2018·28 cites·18 claims
- 0298US9399228B2Method and apparatus for purging and plasma suppression in a process chamberNOVELLUS SYSTEMS INC·Filed 2013·Granted Jul 26, 2016·428 cites·8 claims
- 0397US10665501B2Deposition of Aluminum oxide etch stop layersLAM RES CORP·Filed 2017·Granted May 26, 2020·22 cites·16 claims
- 0497US10580690B2Staircase encapsulation in 3D NAND fabricationLAM RES CORP·Filed 2018·Granted Mar 3, 2020·15 cites·14 claims
- 0597US9214334B2High growth rate process for conformal aluminum nitrideLAM RES CORP·Filed 2014·Granted Dec 15, 2015·38 cites·15 claims
- 0696US9859153B1Deposition of aluminum oxide etch stop layersLAM RES CORP·Filed 2016·Granted Jan 2, 2018·19 cites·20 claims
- 0796US9190489B1Sacrificial pre-metal dielectric for self-aligned contact schemeLAM RES CORP·Filed 2014·Granted Nov 17, 2015·31 cites·24 claims
- 0894US10559461B2Selective deposition with atomic layer etch resetLAM RES CORP·Filed 2017·Granted Feb 11, 2020·10 cites·7 claims
- 0993US10566194B2Selective deposition of etch-stop layer for enhanced patterningLAM RES CORP·Filed 2018·Granted Feb 18, 2020·5 cites·20 claims
- 1092US9633896B1Methods for formation of low-k aluminum-containing etch stop filmsLAM RES CORP·Filed 2015·Granted Apr 25, 2017·11 cites·20 claims
- 1192US9418889B2Selective formation of dielectric barriers for metal interconnects in semiconductor devicesLAM RES CORP·Filed 2015·Granted Aug 16, 2016·8 cites·20 claims
- 1292US9153482B2Methods and apparatus for selective deposition of cobalt in semiconductor processingLAM RES CORP·Filed 2014·Granted Oct 6, 2015·14 cites·18 claims
- 1391US9379210B2Sacrificial pre-metal dielectric for self-aligned contact schemeLAM RES CORP·Filed 2015·Granted Jun 28, 2016·7 cites·7 claims
- 1487US11427908B2Manifold valve for multiple precursorsLAM RES CORP·Filed 2019·Granted Aug 30, 2022·2 cites·19 claims
- 1587US11094542B2Selective deposition of etch-stop layer for enhanced patterningLAM RES CORP·Filed 2020·Granted Aug 17, 2021·2 cites·20 claims
- 1686US10049869B2Composite dielectric interface layers for interconnect structuresLAM RES CORP·Filed 2016·Granted Aug 14, 2018·4 cites·11 claims
- 1784US10472716B1Showerhead with air-gapped plenums and overhead isolation gas distributorLAM RES CORP·Filed 2018·Granted Nov 12, 2019·4 cites·20 claims
- 1884US10418236B2Composite dielectric interface layers for interconnect structuresLAM RES CORP·Filed 2018·Granted Sep 17, 2019·3 cites·20 claims
- 1981US10998187B2Selective deposition with atomic layer etch resetLAM RES CORP·Filed 2019·Granted May 4, 2021·2 cites·9 claims
- 2078US11859282B2Manifold valve for controlling multiple gasesLAM RES CORP·Filed 2022·Granted Jan 2, 2024·0 cites·16 claims
- 2177US10199235B2Liner and barrier applications for subtractive metal integrationLAM RES CORP·Filed 2018·Granted Feb 5, 2019·2 cites·12 claims
- 2274US10643889B2Pre-treatment method to improve selectivity in a selective deposition processLAM RES CORP·Filed 2018·Granted May 5, 2020·2 cites·19 claims
- 2371US11869770B2Selective deposition of etch-stop layer for enhanced patterningLAM RES CORP·Filed 2021·Granted Jan 9, 2024·0 cites·20 claims
- 2471US2024387258A1Film stack simplification for high aspect ratio patterning and vertical scalingLAM RES CORP·Filed 2024·Application pending·0 cites
- 2570US8753978B2Metal and silicon containing capping layers for interconnectsYU JENGYI·Filed 2012·Granted Jun 17, 2014·2 cites·21 claims
- 2669US10804144B2Deposition of aluminum oxide etch stop layersLAM RES CORP·Filed 2020·Granted Oct 13, 2020·0 cites·14 claims
- 2763US9899234B2Liner and barrier applications for subtractive metal integrationLAM RES CORP·Filed 2014·Granted Feb 20, 2018·1 cites·17 claims
- 2857US10745806B2Showerhead with air-gapped plenums and overhead isolation gas distributorLAM RES CORP·Filed 2019·Granted Aug 18, 2020·0 cites·20 claims
- 2954US12080592B2Film stack simplification for high aspect ratio patterning and vertical scalingLAM RES CORP·Filed 2019·Granted Sep 3, 2024·0 cites·8 claims
- 3053US2014216336A1Metal and silicon containing capping layers for interconnectsNOVELLUS SYSTEMS INC·Filed 2014·Application pending·0 cites
- 3147US2016064211A1High growth rate process for conformal aluminum nitrideLAM RES CORP·Filed 2015·Application pending·0 cites
- 3242US10900124B2Substrate processing chamber with showerhead having cooled faceplateLAM RES CORP·Filed 2018·Granted Jan 26, 2021·0 cites·19 claims
- 3341US12040180B2Nitride films with improved etch selectivity for 3D NAND integrationLAM RES CORP·Filed 2019·Granted Jul 16, 2024·0 cites·16 claims
- 3439US10651080B2Oxidizing treatment of aluminum nitride films in semiconductor device manufacturingLAM RES CORP·Filed 2016·Granted May 12, 2020·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →