High growth rate process for conformal aluminum nitride

Abstract

Methods of depositing conformal aluminum nitride films on semiconductor substrates are provided. Disclosed methods involve (a) exposing a substrate to an aluminum-containing precursor, (b) purging the aluminum-containing precursor for a duration insufficient to remove substantially all of the aluminum-containing precursor in gas phase, (c) exposing the substrate to a nitrogen-containing precursor to form aluminum nitride, (d) purging the nitrogen-containing precursor, and (e) repeating (a) through (d). Increased growth rate and 100% step coverage and conformality are attained.

What is claimed is: 
     
         1 . A method of processing a semiconductor substrate having features in a reaction chamber, the method comprising:
 (a) exposing the substrate to a metal-containing precursor for a duration sufficient to substantially adsorb to a surface of the substrate, the metal-containing precursor comprising a metal selected from the group consisting of titanium, hafnium, zirconium, manganese, tungsten, and tantalum;   (b) purging the metal-containing precursor from the reaction chamber for a duration insufficient to remove substantially all of the metal-containing precursor from the gas phase;   (c) exposing the substrate to a nitrogen-containing precursor for a duration sufficient to drive a thermally mediated reaction to form a layer of metal nitride on the surface of the substrate, wherein the layer of metal nitride is substantially conformal to the substrate and has a thickness of about 1.5 Å or greater;   (d) purging the nitrogen-containing precursor in gas phase from the reaction chamber; and   (e) repeating (a) through (d).   
     
     
         2 . The method of  claim 1 , wherein the layer of metal nitride has step coverage of at least about 80%. 
     
     
         3 . The method of  claim 1 , wherein the substrate is processed at a process temperature between about 250° C. and about 450° C. 
     
     
         4 . The method of  claim 1 , wherein the substrate is processed at a pressure between about 0.01 Torr and about 10 Torr. 
     
     
         5 . The method of  claim 1 , wherein the nitrogen-containing precursor is ammonia (NH 3 ). 
     
     
         6 . The method of  claim 1 , wherein purging the metal-containing precursor further comprises flowing nitrogen (N 2 ) and purging the nitrogen-containing precursor further comprises flowing nitrogen (N 2 ). 
     
     
         7 . The method of  claim 1 , wherein the metal-containing precursor is purged for about 2 seconds. 
     
     
         8 . The method of  claim 1 , wherein the substrate is exposed to the metal-containing precursor for about 7.5 seconds to about 30 seconds. 
     
     
         9 . The method of  claim 1 , wherein the ratio of the time the substrate is exposed to the metal-containing precursor to the time the metal-containing precursor is purged is between about 3.75:1 and about 15:1. 
     
     
         10 . The method of  claim 1 , wherein processing exhibits substantially no pattern loading. 
     
     
         11 . The method of  claim 1 , wherein the amount of metal nitride deposited during a cycle of (a) through (d) is at least about 2 Å. 
     
     
         12 . The method of  claim 1 , wherein the amount of metal nitride deposited during a cycle of (a) through (d) is at least about 5 Å. 
     
     
         13 . The method of  claim 1 , wherein the features of the substrate have aspect ratios of at least about 2:1. 
     
     
         14 . The method of  claim 1 , wherein the features of the substrate have openings of less than about 100 nm.