Inventor · disambiguated record
Norman Nakashima
Also filed as: NAKASHIMA NORMAN · NAKASHIMA NORMAN M
12 granted patents·4 pending applications·834 citations·filing 2001–2024
93Inventor score
Top patents by PatentIndex Score
16 records- 0198US6916398B2Gas delivery apparatus and method for atomic layer depositionAPPLIED MATERIALS INC·Filed 2001·Granted Jul 12, 2005·646 cites·21 claims
- 0296US8668776B2Gas delivery apparatus and method for atomic layer depositionCHEN LING·Filed 2010·Granted Mar 11, 2014·21 cites·14 claims
- 0396US7699023B2Gas delivery apparatus for atomic layer depositionAPPLIED MATERIALS INC·Filed 2007·Granted Apr 20, 2010·34 cites·20 claims
- 0494US7562672B2Chemical delivery apparatus for CVD or ALDAPPLIED MATERIALS INC·Filed 2006·Granted Jul 21, 2009·15 cites·16 claims
- 0593US7780785B2Gas delivery apparatus for atomic layer depositionAPPLIED MATERIALS INC·Filed 2002·Granted Aug 24, 2010·61 cites·26 claims
- 0693US7780788B2Gas delivery apparatus for atomic layer depositionAPPLIED MATERIALS INC·Filed 2005·Granted Aug 24, 2010·17 cites·62 claims
- 0783US8951478B2Ampoule with a thermally conductive coatingCHU SCHUBERT S·Filed 2007·Granted Feb 10, 2015·7 cites·19 claims
- 0883US8491967B2In-situ chamber treatment and deposition processMA PAUL F·Filed 2008·Granted Jul 23, 2013·12 cites·2 claims
- 0983US7568495B2Chemical delivery apparatus for CVD or ALDAPPLIED MATERIALS INC·Filed 2007·Granted Aug 4, 2009·9 cites·20 claims
- 1082US7748400B2Chemical delivery apparatus for CVD or ALDAPPLIED MATERIALS INC·Filed 2009·Granted Jul 6, 2010·8 cites·25 claims
- 1179US11996301B2Modular-component system for gas deliveryLAM RES CORP·Filed 2020·Granted May 28, 2024·1 cites·23 claims
- 1271US2024347349A1Modular-component system for gas deliveryLAM RES CORP·Filed 2024·Application pending·0 cites
- 1369US7832432B2Chemical delivery apparatus for CVD or ALDAPPLIED MATERIALS INC·Filed 2009·Granted Nov 16, 2010·3 cites·25 claims
- 1454US2008038463A1Atomic layer deposition processAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 1552US2007099415A1Integration process of tungsten atomic layer deposition for metallization applicationCHEN LING·Filed 2006·Application pending·0 cites
- 1641US2003124262A1Integration of ALD tantalum nitride and alpha-phase tantalum for copper metallization applicationFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →