Inventor · disambiguated record
Prayudi Lianto
Also filed as: LIANTO PRAYUDI
17 granted patents·14 pending applications·9 citations·filing 2016–2024
87Inventor score
Files withAPPLIED MATERIALS INC31
Top patents by PatentIndex Score
31 records- 0178US10002771B1Methods for chemical mechanical polishing (CMP) processing with ozoneAPPLIED MATERIALS INC·Filed 2017·Granted Jun 19, 2018·3 cites·20 claims
- 0275US10515927B2Methods and apparatus for semiconductor package processingAPPLIED MATERIALS INC·Filed 2017·Granted Dec 24, 2019·2 cites·17 claims
- 0370US11355358B2Methods of thinning silicon on epoxy mold compound for radio frequency (RF) applicationsAPPLIED MATERIALS INC·Filed 2019·Granted Jun 7, 2022·1 cites·19 claims
- 0470US10319601B2Slurry for polishing of integrated circuit packagingAPPLIED MATERIALS INC·Filed 2017·Granted Jun 11, 2019·1 cites·15 claims
- 0567US11421316B2Methods and apparatus for controlling warpage in wafer level packaging processesAPPLIED MATERIALS INC·Filed 2019·Granted Aug 23, 2022·1 cites·15 claims
- 0666US2025121472A1Polishing articles for hybrid bonding applicationsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0765US11309278B2Methods for bonding substratesAPPLIED MATERIALS INC·Filed 2019·Granted Apr 19, 2022·1 cites·18 claims
- 0864US12424446B2Silicon (Si) dry etch for die-to-wafer thinningAPPLIED MATERIALS INC·Filed 2022·Granted Sep 23, 2025·0 cites·18 claims
- 0964US2025273392A1Formation of Inductor Core Stacks Using Self-Assembled MonolayersAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1061US2025149474A1Selective Dielectric Capping for Hybrid BondingAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1158US2024390950A1Method and apparatus for substrate cleaning in stack-die hybrid bonding processAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1256US12138742B2Methods and apparatus for processing a substrateAPPLIED MATERIALS INC·Filed 2021·Granted Nov 12, 2024·0 cites·20 claims
- 1356US2024110284A1Selective Deposition of Thin Films with Improved StabilityAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1455US11901225B2Diffusion layers in metal interconnectsAPPLIED MATERIALS INC·Filed 2021·Granted Feb 13, 2024·0 cites·14 claims
- 1555US2024332005A1Methods for depositing dielectric films with increased stabilityAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1654US11899376B1Methods for forming alignment marksAPPLIED MATERIALS INC·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 1754US2025062129A1DIE BACKSIDE PROFILE for SEMICONDUCTOR DEVICESAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1851US12020992B2Methods and apparatus for processing a substrateAPPLIED MATERIALS INC·Filed 2022·Granted Jun 25, 2024·0 cites·20 claims
- 1950US12469683B2Water vapor plasma to enhance surface hydrophilicityAPPLIED MATERIALS INC·Filed 2021·Granted Nov 11, 2025·0 cites·16 claims
- 2050US10636696B1Methods for forming vias in polymer layersAPPLIED MATERIALS INC·Filed 2019·Granted Apr 28, 2020·0 cites·20 claims
- 2147US11931855B2Planarization methods for packaging substratesAPPLIED MATERIALS INC·Filed 2020·Granted Mar 19, 2024·0 cites·20 claims
- 2245US11289387B2Methods and apparatus for backside via reveal processingAPPLIED MATERIALS INC·Filed 2020·Granted Mar 29, 2022·0 cites·18 claims
- 2344US11342256B2Method of fine redistribution interconnect formation for advanced packaging applicationsAPPLIED MATERIALS INC·Filed 2019·Granted May 24, 2022·0 cites·18 claims
- 2443US2024330671A1Automation method for defect characterization for hybrid bonding applicationAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2540US2021202334A1Methods and apparatus for wafer-level packaging using direct writingAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 2639US2024331131A1Pre-bonding automatic optical inspection defect classificationAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2739US2021057238A1Methods and apparatus for contactless substrate warpage correctionAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 2838US2021035795A1Methods and apparatus for substrate warpage correctionAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 2936US2020306931A1Methods and apparatus for removing abrasive particlesAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 3035US9922874B2Methods of enhancing polymer adhesion to copperAPPLIED MATERIALS INC·Filed 2016·Granted Mar 20, 2018·0 cites·20 claims
- 3132US2021057292A1Methods and apparatus for determining endpoints for chemical mechanical planarization in wafer-level packaging applicationsAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →