Inventor · disambiguated record
Pradeep Subrahmanyan
Also filed as: SUBRAHMANYAN PRADEEP · SUBRAHMANYAN PRADEEP K · SUBRAHMANYAN PRADEEP KUMAR
16 granted patents·40 pending applications·77 citations·filing 2000–2025
91Inventor score
Top patents by PatentIndex Score
56 records- 0191US6898042B2Slider level microactuator with integrated fly controlSEAGATE TECHNOLOGY LLC·Filed 2002·Granted May 24, 2005·41 cites·15 claims
- 0285US10409171B2Overlay control with non-zero offset predictionKLA TENCOR CORP·Filed 2018·Granted Sep 10, 2019·3 cites·39 claims
- 0384US2024266231A1Cylindric decomposition for efficient mitigation of substrate deformation with film deposition and ion implantationAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0484US2024266233A1Influence function-based mitigation of substrate deformation with film deposition and ion implantationAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0584US2024266230A1Optimized film deposition and ion implantation for mitigation of stress and deformation in substratesAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0684US2024266186A1Stress management for precise substrate -to- substrate bondingAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0784US2024266174A1Mitigation of saddle deformation of substrates using film deposition and edge ion implantationAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0881US10670393B1Construction of three-dimensional profiles of high aspect ratio structures using top down imagingAPPLIED MATERIALS INC·Filed 2018·Granted Jun 2, 2020·2 cites·20 claims
- 0979US10209627B2Systems and methods for focus-sensitive metrology targetsKLA TENCOR CORP·Filed 2017·Granted Feb 19, 2019·2 cites·35 claims
- 1078US10216096B2Process-sensitive metrology systems and methodsKLA TENCOR CORP·Filed 2016·Granted Feb 26, 2019·2 cites·19 claims
- 1176US8772731B2Apparatus and method for synchronizing sample stage motion with a time delay integration charge-couple device in a semiconductor inspection toolKLA TENCOR CORP·Filed 2013·Granted Jul 8, 2014·2 cites·19 claims
- 1276US7031116B2Moving magnet voice coil motor using Halbach arraysSEAGATE TECHNOLOGY LLC·Filed 2001·Granted Apr 18, 2006·11 cites·19 claims
- 1376US2025300095A1Stress and overlay management for semiconductor processingAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1475US8779635B2Arrangement of reticle positioning device for actinic inspection of EUV reticlesKLA TENCOR CORP·Filed 2013·Granted Jul 15, 2014·2 cites·15 claims
- 1575US2025056871A1Methods of forming bottom dielectric isolation layersAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1674US2024365545A1Wordline contact formation for nand deviceAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1774US2024363150A1Wordline contact formation for nand deviceAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1873US12354973B2Stress and overlay management for semiconductor processingAPPLIED MATERIALS INC·Filed 2022·Granted Jul 8, 2025·0 cites·13 claims
- 1973US2025089345A1Materials and methods for complementary field-effect transistors having middle dielectric isolation layerAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2073US2025089355A1Multi-threshold voltage integration scheme for complementary field-effect transistorsAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2172US2024268108A1V-nand stacks with dipole regionsAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2270US2025298321A1Multiscale control of substrate deformation in device manufacturingAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 2368US6999909B1Process for designing an optimal vibration isolation mount for a disc driveSEAGATE TECHNOLOGY LLC·Filed 2000·Granted Feb 14, 2006·7 cites·8 claims
- 2466US12217974B2Localized stress modulation by implant to back of waferAPPLIED MATERIALS INC·Filed 2021·Granted Feb 4, 2025·0 cites·14 claims
- 2566US11997849B2V-NAND stacks with dipole regionsAPPLIED MATERIALS INC·Filed 2021·Granted May 28, 2024·0 cites·19 claims
- 2665US12170230B2Methods of forming bottom dielectric isolation layersAPPLIED MATERIALS INC·Filed 2021·Granted Dec 17, 2024·0 cites·15 claims
- 2764US2023380170A1Epitaxial silicon channel growthAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2864US2023413569A1Epitaxial silicon channel growthAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2963US11092433B2Construction of three-dimensional profiles of high aspect ratio structures using top down imagingAPPLIED MATERIALS INC·Filed 2020·Granted Aug 17, 2021·0 cites·20 claims
- 3063US2025140569A1Localized stress modulation by implant to back of waferAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 3162US2025234573A1Source/drain (s/d) epitaxial growth in gate-all-around (gaa) nanosheet deviceAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3260US10381256B2Apparatus and method for chucking warped wafersKLA TENCOR CORP·Filed 2016·Granted Aug 13, 2019·1 cites·10 claims
- 3360US7372660B1Disc storage system with adaptive PID controlSEAGATE TECHNOLOGY LLC·Filed 2001·Granted May 13, 2008·4 cites·14 claims
- 3460US2024387286A1Multi-threshold voltage integration scheme for complementary field effect transistorsAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3560US2024395879A1Contact integration in complementary field effect transistor (cfet) devicesAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3659US2024401189A1Formation of memory device channel holes using doped film layerAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3759US2025254973A1Contact integration in complementary field effect transistor (cfet) devicesAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3858US2025307499A1Mitigation of substrate deformation in device manufacturing using machine learning systems and techniquesAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 3958US2025194165A1Unification of backside stress mitigation with frontside protection in semiconductor manufacturing processingAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 4058US2025140567A1Multi-parameter implantation for managing wafer distortionAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4157US2024105641A1Correction of global curvature during stress managementAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4256US2023369014A1Dose mapping and substrate rotation for substrate curvature control with improved resolutionAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4356US2023367941A1Dose mapping using substrate curvature to compensate for out-of-plane distortionAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4455US2025054757A1Deformation control of manufacturing devices using front-side irradiationAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 4555US2024103385A1Frequency and Amplitude Modulation of Implant Dose for Stress ManagementAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4654US2024188300A13d memory including hollow epitaxial channelsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4754US2024185893A1Wordline contact formation for nand deviceAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4853US2024081063A1Memory devices having improved memory state retentionAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4951US2025246557A1Control of substrate deformation during manufacturing processesAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 5051US2024186178A1Wordline contact formation for nand deviceAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
Showing the top 50 of 56 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →