Inventor · disambiguated record
Rabindra N. Das
Also filed as: DAS RABINDRA · DAS RABINDRA N
47 granted patents·9 pending applications·523 citations·filing 2005–2024
98Inventor score
Files withDAS RABINDRA N17MASSACHUSETTS INST TECHNOLOGY17ENDICOTT INTERCONNECT TECH INC13MARKOVICH VOYA3MARKOVICH VOYA R3
Top patents by PatentIndex Score
56 records- 0197US10134972B2Qubit and coupler circuit structures and coupling techniquesMASSACHUSETTS INST TECHNOLOGY·Filed 2016·Granted Nov 20, 2018·57 cites·21 claims
- 0297US7025607B1Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Apr 11, 2006·51 cites·18 claims
- 0396US10381541B2Cryogenic electronic packages and methods for fabricating cryogenic electronic packagesMASSACHUSETTS INST TECHNOLOGY·Filed 2017·Granted Aug 13, 2019·26 cites·19 claims
- 0496US10199553B1Shielded through via structures and methods for fabricating shielded through via structuresMASSACHUSETTS INST TECHNOLOGY·Filed 2016·Granted Feb 5, 2019·17 cites·10 claims
- 0596US10121754B2Interconnect structures and methods for fabricating interconnect structuresMASSACHUSETTS INST TECHNOLOGY·Filed 2016·Granted Nov 6, 2018·20 cites·21 claims
- 0696US8446707B1Circuitized substrate with low loss capacitive material and method of making sameDAS RABINDRA N·Filed 2011·Granted May 21, 2013·18 cites·11 claims
- 0795US10229897B2Multi-layer semiconductor structure and methods for fabricating multi-layer semiconductor structuresMASSACHUSETTS INST TECHNOLOGY·Filed 2016·Granted Mar 12, 2019·10 cites·27 claims
- 0894US10586909B2Cryogenic electronic packages and assembliesMASSACHUSETTS INST TECHNOLOGY·Filed 2017·Granted Mar 10, 2020·21 cites·10 claims
- 0994US10418350B2Semiconductor structures for assembly in multi-layer semiconductor devices including at least one semiconductor structureMASSACHUSETTS INST TECHNOLOGY·Filed 2015·Granted Sep 17, 2019·12 cites·20 claims
- 1094US10396269B2Interconnect structures for assembly of semiconductor structures including superconducting integrated circuitsMASSACHUSETTS INST TECHNOLOGY·Filed 2016·Granted Aug 27, 2019·12 cites·12 claims
- 1194US8143530B1Liquid crystal polymer layer for encapsulation and improved hermiticity of circuitized substratesDAS RABINDRA N·Filed 2010·Granted Mar 27, 2012·18 cites·10 claims
- 1293US9812429B2Interconnect structures for assembly of multi-layer semiconductor devicesMASSACHUSETTS INST TECHNOLOGY·Filed 2015·Granted Nov 7, 2017·17 cites·15 claims
- 1392US10242968B2Interconnect structure and semiconductor structures for assembly of cryogenic electronic packagesMASSACHUSETTS INST TECHNOLOGY·Filed 2017·Granted Mar 26, 2019·12 cites·22 claims
- 1492US9881904B2Multi-layer semiconductor devices fabricated using a combination of substrate and via structures and fabrication techniquesMASSACHUSETTS INST TECHNOLOGY·Filed 2015·Granted Jan 30, 2018·12 cites·28 claims
- 1592US8288857B2Anti-tamper microchip package based on thermal nanofluids or fluidsDAS RABINDRA N·Filed 2010·Granted Oct 16, 2012·16 cites·25 claims
- 1691US8607445B1Substrate having internal capacitor and method of making sameDAS RABINDRA N·Filed 2012·Granted Dec 17, 2013·12 cites·19 claims
- 1790US9780075B2Interconnect structures for assembly of multi-layer semiconductor devicesMASSACHUSETTS INST TECHNOLOGY·Filed 2015·Granted Oct 3, 2017·7 cites·20 claims
- 1890US8063315B2Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrateDAS RABINDRA N·Filed 2007·Granted Nov 22, 2011·15 cites·17 claims
- 1990US7442879B2Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrateENDICOTT INTERCONECT TECHNOLOG·Filed 2005·Granted Oct 28, 2008·23 cites·40 claims
- 2090US7235745B2Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing said ciruitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Jun 26, 2007·15 cites·10 claims
- 2188US10658424B2Superconducting integrated circuitMASSACHUSETTS INST TECHNOLOGY·Filed 2016·Granted May 19, 2020·14 cites·14 claims
- 2288US7791897B2Multi-layer embedded capacitance and resistance substrate coreENDICOTT INTERCONNECT TECH INC·Filed 2008·Granted Sep 7, 2010·15 cites·14 claims
- 2387US7429510B2Method of making a capacitive substrate using photoimageable dielectric for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Sep 30, 2008·15 cites·16 claims
- 2486US8558374B2Electronic package with thermal interposer and method of making sameMARKOVICH VOYA R·Filed 2011·Granted Oct 15, 2013·10 cites·22 claims
- 2586US7384856B2Method of making an internal capacitive substrate for use in a circuitized substrate and method of making said circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Jun 10, 2008·16 cites·19 claims
- 2684US7541265B2Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Jun 2, 2009·12 cites·16 claims
- 2783US7687724B2Circuitized substrate with internal resistor, method of making said circuitized substrate, and electrical assembly utilizing said circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Mar 30, 2010·11 cites·10 claims
- 2881US10079224B2Interconnect structures for assembly of semiconductor structures including at least one integrated circuit structureMASSACHUSETTS INST TECHNOLOGY·Filed 2015·Granted Sep 18, 2018·3 cites·16 claims
- 2981US7449381B2Method of making a capacitive substrate for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrateENDICOTT INTERCONECT TECHNOLOG·Filed 2006·Granted Nov 11, 2008·10 cites·19 claims
- 3076US9451693B2Electrically conductive adhesive (ECA) for multilayer device interconnectsDAS RABINDRA N·Filed 2011·Granted Sep 20, 2016·2 cites·43 claims
- 3175US8247703B2Method of making circuitized substrate with resistor including material with metal component and electrical assembly and information handling system utilizing said circuitized substrateDAS RABINDRA N·Filed 2010·Granted Aug 21, 2012·2 cites·12 claims
- 3275US7897877B2Capacitive substrateENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Mar 1, 2011·5 cites·11 claims
- 3374US8541687B2Coreless layer buildup structureMARKOVICH VOYA·Filed 2010·Granted Sep 24, 2013·3 cites·18 claims
- 3470US8501575B2Method of forming multilayer capacitors in a printed circuit substrateDAS RABINDRA N·Filed 2010·Granted Aug 6, 2013·2 cites·4 claims
- 3568US8536459B2Coreless layer buildup structure with LGAMARKOVICH VOYA·Filed 2010·Granted Sep 17, 2013·2 cites·18 claims
- 3666US8499445B1Method of forming an electrically conductive printed lineDAS RABINDRA N·Filed 2011·Granted Aug 6, 2013·1 cites·26 claims
- 3766US8144480B2Multi-layer embedded capacitance and resistance substrate coreDAS RABINDRA N·Filed 2010·Granted Mar 27, 2012·2 cites·6 claims
- 3866US7870664B2Method of making circuitized substrate with a resistorENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Jan 18, 2011·4 cites·23 claims
- 3962US9420689B2Method of making a circuitized substrateDAS RABINDRA N·Filed 2009·Granted Aug 16, 2016·1 cites·8 claims
- 4062US2025159983A1Active Wafer-Scale Reconfigurable Logic Fabric for AI and High-Performance Embedded ComputingMASSACHUSETTS INST TECHNOLOGY·Filed 2024·Application pending·0 cites
- 4159US7803688B2Capacitive substrate and method of making sameENDICOTT INTERCONNECT TECH INC·Filed 2009·Granted Sep 28, 2010·1 cites·10 claims
- 4256US2025300146A1Extremely Large Area Integrated CircuitMASSACHUSETTS INST TECHNOLOGY·Filed 2023·Application pending·0 cites
- 4352US9756724B2Method of making a circuitized substrateDAS RABINDRA N·Filed 2011·Granted Sep 5, 2017·0 cites·9 claims
- 4451US9786633B2Interconnect structures for fine pitch assembly of semiconductor structures and related techniquesMASSACHUSETTS INST TECHNOLOGY·Filed 2015·Granted Oct 10, 2017·1 cites·26 claims
- 4551US2006154501A1Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2006·Application pending·0 cites
- 4648US2007177331A1Non-flaking capacitor material, capacitive substrate having an internal capacitor therein including said non-flaking capacitor material, and method of making a capacitor member for use in a capacitive substrateENDICOTT INTERCONNECT TECH INC·Filed 2007·Application pending·0 cites
- 4748US2008248596A1Method of making a circuitized substrate having at least one capacitor thereinENDICOTT INTERCONNECT TECH INC·Filed 2007·Application pending·0 cites
- 4847US8299371B2Circuitized substrate with dielectric interposer assembly and methodDAS RABINDRA N·Filed 2010·Granted Oct 30, 2012·0 cites·10 claims
- 4944US2012228014A1Circuitized substrate with internal thin film capacitor and method of making sameDAS RABINDRA N·Filed 2011·Application pending·0 cites
- 5043US9351408B2Coreless layer buildup structure with LGA and joining layerMARKOVICH VOYA·Filed 2010·Granted May 24, 2016·0 cites·27 claims
Showing the top 50 of 56 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →