Inventor · disambiguated record
Renhe Jia
Also filed as: JIA RENHE
18 granted patents·20 pending applications·69 citations·filing 2004–2017
92Inventor score
Files withAPPLIED MATERIALS INC18CABOT MICROELECTRONICS CORP11JIA RENHE5MAO DAXIN2APPLIED MATERIAL INC1
Top patents by PatentIndex Score
38 records- 0192US9505952B2Polishing composition containing ceria abrasiveCABOT MICROELECTRONICS CORP·Filed 2015·Granted Nov 29, 2016·14 cites·15 claims
- 0291US7390744B2Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2005·Granted Jun 24, 2008·17 cites·14 claims
- 0383US9434859B2Chemical-mechanical planarization of polymer filmsCABOT MICROELECTRONICS CORP·Filed 2013·Granted Sep 6, 2016·3 cites·13 claims
- 0483US7582564B2Process and composition for conductive material removal by electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Sep 1, 2009·9 cites·20 claims
- 0582US7210988B2Method and apparatus for reduced wear polishing pad conditioningAPPLIED MATERIALS INC·Filed 2005·Granted May 1, 2007·9 cites·35 claims
- 0681US8906252B1CMP compositions selective for oxide and nitride with high removal rate and low defectivityCABOT MICROELECTRONICS CORP·Filed 2013·Granted Dec 9, 2014·4 cites·23 claims
- 0774US8864915B2Cleaning methods for improved photovoltaic module efficiencyJIA RENHE·Filed 2011·Granted Oct 21, 2014·2 cites·8 claims
- 0872US9422455B2CMP compositions exhibiting reduced dishing in STI wafer polishingCABOT MICROELECTRONICS CORP·Filed 2014·Granted Aug 23, 2016·3 cites·21 claims
- 0970US9165489B2CMP compositions selective for oxide over polysilicon and nitride with high removal rate and low defectivityCABOT MICROELECTRONICS CORP·Filed 2014·Granted Oct 20, 2015·2 cites·21 claims
- 1066US7344432B2Conductive pad with ion exchange membrane for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Granted Mar 18, 2008·3 cites·30 claims
- 1163US7879255B2Method and composition for electrochemically polishing a conductive material on a substrateAPPLIED MATERIALS INC·Filed 2006·Granted Feb 1, 2011·1 cites·2 claims
- 1262US7504018B2Electrochemical method for Ecmp polishing pad conditioningAPPLIED MATERIALS INC·Filed 2006·Granted Mar 17, 2009·1 cites·2 claims
- 1358US9850402B2CMP compositions and methods for selective removal of silicon nitrideCABOT MICROELECTRONICS CORP·Filed 2013·Granted Dec 26, 2017·1 cites·18 claims
- 1455US2010313929A1Cell isolation on photovoltaic modules for hot spot reductionJIA RENHE·Filed 2009·Application pending·0 cites
- 1554US2010132759A1Cell isolation on photovoltaic modules for hot spot reductionJIA RENHE·Filed 2009·Application pending·0 cites
- 1647US9828528B2Polishing composition containing ceria abrasiveCABOT MICROELECTRONICS CORP·Filed 2016·Granted Nov 28, 2017·0 cites·14 claims
- 1747US2007153453A1Fully conductive pad for electrochemical mechanical processingAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 1847US2009008600A1Method and composition for polishing a substrateJIA RENHE·Filed 2007·Application pending·0 cites
- 1946US10414947B2Polishing composition containing ceria particles and method of useCABOT MICROELECTRONICS CORP·Filed 2016·Granted Sep 17, 2019·0 cites·20 claims
- 2046US2006249394A1Process and composition for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 2146US2007151866A1Substrate polishing with surface pretreatmentAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 2245US9340706B2Mixed abrasive polishing compositionsCABOT MICROELECTRONICS CORP·Filed 2013·Granted May 17, 2016·0 cites·16 claims
- 2344US7576007B2Method for electrochemically mechanically polishing a conductive material on a substrateAPPLIED MATERIALS INC·Filed 2006·Granted Aug 18, 2009·0 cites·16 claims
- 2444US2007181442A1Method and apparatus for foam removal in an electrochemical mechanical substrate polishing processAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 2544US2006249395A1Process and composition for electrochemical mechanical polishingAPPLIED MATERIAL INC·Filed 2006·Application pending·0 cites
- 2644US2007158207A1Methods for electrochemical processing with pre-biased cellsAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 2743US2007144915A1Process and composition for passivating a substrate during electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 2843US2005077188A1Endpoint for electrochemical processingAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
- 2943US2007254485A1Abrasive composition for electrochemical mechanical polishingMAO DAXIN·Filed 2007·Application pending·0 cites
- 3042US2007235344A1Process for high copper removal rate with good planarization and surface finishAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 3142US2006219663A1Metal CMP process on one or more polishing stations using slurries with oxidizersAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 3240US2008020682A1Method for conditioning a polishing padAPPLIED MATERILAS INC·Filed 2006·Application pending·0 cites
- 3340US2007062815A1Method for stabilized polishing processAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 3440US2006021974A1Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
- 3539US2006169674A1Method and composition for polishing a substrateMAO DAXIN·Filed 2006·Application pending·0 cites
- 3638US2006196778A1Tungsten electroprocessingJIA RENHE·Filed 2006·Application pending·0 cites
- 3734US2017194160A1Method of polishing a low-k substrateCABOT MICROELECTRONICS CORP·Filed 2017·Application pending·0 cites
- 3832US9758697B2Polishing composition containing cationic polymer additiveCABOT MICROELECTRONICS CORP·Filed 2015·Granted Sep 12, 2017·0 cites·34 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →