Inventor · disambiguated record
Robert Shinagawa
Also filed as: SHINAGAWA ROBERT · SHINAGAWA ROBERT T
11 granted patents·1 pending application·200 citations·filing 1994–2011
93Inventor score
Top patents by PatentIndex Score
12 records- 0198US8010222B2Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or toolKLA TENCOR TECH CORP·Filed 2008·Granted Aug 30, 2011·29 cites·10 claims
- 0293US6866559B2Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing padKLA TENCOR TECHNOLOGIES·Filed 2003·Granted Mar 15, 2005·31 cites·90 claims
- 0392US7332438B2Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or toolKLA TENCOR TECH CORP·Filed 2006·Granted Feb 19, 2008·11 cites·9 claims
- 0492US6884146B2Systems and methods for characterizing a polishing processKLA TENCOR TECH CORP·Filed 2003·Granted Apr 26, 2005·24 cites·39 claims
- 0590US7230703B2Apparatus and method for measuring overlay by diffraction gratingsTOKYO ELECTRON LTD·Filed 2004·Granted Jun 12, 2007·38 cites·20 claims
- 0686US6935922B2Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishingKLA TENCOR TECH CORP·Filed 2003·Granted Aug 30, 2005·16 cites·100 claims
- 0784US8831767B2Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or toolLEHMAN KURT·Filed 2011·Granted Sep 9, 2014·3 cites·19 claims
- 0884US7030018B2Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or toolKLA TENCOR TECH CORP·Filed 2003·Granted Apr 18, 2006·14 cites·23 claims
- 0980US7175503B2Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current deviceKLA TENCOR TECH CORP·Filed 2003·Granted Feb 13, 2007·11 cites·47 claims
- 1079US7052369B2Methods and systems for detecting a presence of blobs on a specimen during a polishing processKLA TENCOR TECH CORP·Filed 2003·Granted May 30, 2006·10 cites·38 claims
- 1151US2006148383A1Methods and systems for detecting a presence of blobs on a specimen during a polishing processKLA TENCOR TECHNOLOGIES·Filed 2006·Application pending·0 cites
- 1245US5500095AHigh efficiency chemical processingATHENS CORP·Filed 1994·Granted Mar 19, 1996·13 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →