Inventor · disambiguated record
Robert Vacassy
Also filed as: VACASSY ROBERT
9 granted patents·13 pending applications·108 citations·filing 1997–2022
88Inventor score
Top patents by PatentIndex Score
22 records- 0192US7582127B2Polishing composition for a tungsten-containing substrateCABOT MICROELECTRONICS CORP·Filed 2007·Granted Sep 1, 2009·21 cites·13 claims
- 0288US9951054B2CMP porous pad with particles in a polymeric matrixLI SHOUTIAN·Filed 2010·Granted Apr 24, 2018·15 cites·20 claims
- 0380US7294576B1Tunable selectivity slurries in CMP applicationsCABOT MICROELECTRONICS CORP·Filed 2006·Granted Nov 13, 2007·9 cites·13 claims
- 0475US7247567B2Method of polishing a tungsten-containing substrateCABOT MICROELECTRONICS CORP·Filed 2004·Granted Jul 24, 2007·18 cites·20 claims
- 0572US6682575B2Methanol-containing silica-based CMP compositionsCABOT MICROELECTRONICS CORP·Filed 2002·Granted Jan 27, 2004·6 cites·15 claims
- 0661US6458335B1Production of powdersCALCITECH LTD·Filed 1997·Granted Oct 1, 2002·35 cites·19 claims
- 0760US9074118B2CMP method for metal-containing substratesVACASSY ROBERT·Filed 2007·Granted Jul 7, 2015·2 cites·20 claims
- 0858US9463551B2Polishing pad with porous interface and solid core, and related apparatus and methodsCABOT MICROELECTRONICS CORP·Filed 2014·Granted Oct 11, 2016·0 cites·11 claims
- 0954US2024425723A1Pad-in-a-bottle chemical mechanical planarization polishing with cost-effective non-porous solid polishing padsVERSUM MAT US LLC·Filed 2022·Application pending·0 cites
- 1054US2025014911A1Pad-in-a-bottle and single platen chemical mechanical-planarization for back-end applicationsVERSUM MAT US LLC·Filed 2022·Application pending·0 cites
- 1154US2009191710A1CMP method for improved oxide removal rateCABOT MICROELECTRONICS CORP·Filed 2009·Application pending·0 cites
- 1253US2024352279A1Pad-in-a-bottle (pib) technology for copper barrier slurriesVERSUM MAT US LLC·Filed 2022·Application pending·0 cites
- 1351US2007266641A1Method of polishing a tungsten-containing substrateCABOT MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 1449US2024006189A1Chemical Mechanical Planarization (CMP) For Copper And Through-Silicon Via (TSV)VERSUM MAT US LLC·Filed 2021·Application pending·0 cites
- 1547US2005150173A1Methanol-containing silica-based cmp compositionsFiled 2003·Application pending·0 cites
- 1644US2015056895A1Ultra high void volume polishing pad with closed pore structureCABOT MICROELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 1743US7677956B2Compositions and methods for dielectric CMPCABOT MICROELECTRONICS CORP·Filed 2002·Granted Mar 16, 2010·2 cites·22 claims
- 1843US2010190339A1Compositions and methods for chemical-mechanical polishing of phase change materialsCHEN ZHAN·Filed 2008·Application pending·0 cites
- 1942US2007209287A1Composition and method to polish silicon nitrideCABOT MICROELECTRONICS CORP·Filed 2006·Application pending·0 cites
- 2042US2005279733A1CMP composition for improved oxide removal rateCABOT MICROELECTRONICS CORP·Filed 2004·Application pending·0 cites
- 2141US2008220610A1Silicon oxide polishing method utilizing colloidal silicaCABOT MICROELECTRONICS CORP·Filed 2006·Application pending·0 cites
- 2241US2008020680A1Rate-enhanced CMP compositions for dielectric filmsCABOT MICROELECTRONICS CORP·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →