Inventor · disambiguated record
Ryo Oishi
Also filed as: OISHI RYO
23 granted patents·12 pending applications·97 citations·filing 1998–2023
93Inventor score
Files withNIPPON MICROMETAL CORP28MATSUSHITA ELECTRIC INDUSTRIAL CO LTD2NICHIA CORP2IGARASHI TAKAYUKI1NIPPON MICROMETAL COPORATION1
Top patents by PatentIndex Score
35 records- 0189US10137534B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2015·Granted Nov 27, 2018·5 cites·8 claims
- 0289US9887172B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2015·Granted Feb 6, 2018·6 cites·9 claims
- 0389US9773748B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2015·Granted Sep 26, 2017·5 cites·7 claims
- 0488US11721660B2Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Granted Aug 8, 2023·1 cites·13 claims
- 0587US11929343B2Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Granted Mar 12, 2024·1 cites·13 claims
- 0685US10610976B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2017·Granted Apr 7, 2020·1 cites·22 claims
- 0784US6241942B1Lead-free solder alloysMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Jun 5, 2001·51 cites·28 claims
- 0876US6488888B2Lead-free solder alloysMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Dec 3, 2002·18 cites·7 claims
- 0974USD661262SLight emitting diodeIGARASHI TAKAYUKI·Filed 2010·Granted Jun 5, 2012·3 cites·1 claims
- 1072US9543266B2Bonding wire for semiconductor device use and method of production of sameNIPPON MICROMETAL CORP·Filed 2015·Granted Jan 10, 2017·2 cites·5 claims
- 1171US10737356B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2016·Granted Aug 11, 2020·1 cites·9 claims
- 1271US10414002B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2016·Granted Sep 17, 2019·1 cites·10 claims
- 1369US2023387066A1Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2023·Application pending·0 cites
- 1468US2024290745A1Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2023·Application pending·0 cites
- 1568US2023335528A1Bonding wire for semiconductor devicesNIPPON MICROMETAL COPORATION·Filed 2023·Application pending·0 cites
- 1666US10468370B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2015·Granted Nov 5, 2019·1 cites·7 claims
- 1763US2024297142A1Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Application pending·0 cites
- 1861US8815019B2Bonding wire for semiconductorUNO TOMOHIRO·Filed 2010·Granted Aug 26, 2014·1 cites·21 claims
- 1959US12290883B2Bonding wireNIPPON MICROMETAL CORP·Filed 2023·Granted May 6, 2025·0 cites·16 claims
- 2058USD743918SLight emitting diodeNICHIA CORP·Filed 2014·Granted Nov 24, 2015·0 cites·1 claims
- 2158US2020013748A1Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2019·Application pending·0 cites
- 2256US2015115294A2Light emitting device including resin-molded body with white portion and black portionNICHIA CORP·Filed 2014·Application pending·0 cites
- 2355US10121758B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2017·Granted Nov 6, 2018·0 cites·9 claims
- 2454US12463172B2AG alloy bonding wire for semiconductor devices and semiconductor deviceNIPPON MICROMETAL CORP·Filed 2021·Granted Nov 4, 2025·0 cites·8 claims
- 2554US12325901B2AI wiring materialNIPPON MICROMETAL CORP·Filed 2020·Granted Jun 10, 2025·0 cites·8 claims
- 2652US2024290744A1Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Application pending·0 cites
- 2751US2024290743A1Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Application pending·0 cites
- 2849US12463171B2Copper bonding wire for semiconductor devices and semiconductor deviceNIPPON MICROMETAL CORP·Filed 2020·Granted Nov 4, 2025·0 cites·5 claims
- 2948US2024105668A1Ai wiring materialNIPPON MICROMETAL CORP·Filed 2022·Application pending·0 cites
- 3045US10032741B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2015·Granted Jul 24, 2018·0 cites·8 claims
- 3145US2023299037A1Al WIRING MATERIALNIPPON MICROMETAL CORP·Filed 2021·Application pending·0 cites
- 3245US2024312946A1Ai bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Application pending·0 cites
- 3344US10121764B2Method for forming ball in bonding wireNIPPON MICROMETAL CORP·Filed 2016·Granted Nov 6, 2018·0 cites·11 claims
- 3443US2023302584A1Al WIRING MATERIALNIPPON MICROMETAL CORP·Filed 2021·Application pending·0 cites
- 3540US9536854B2Bonding wire for semiconductor device use and method of production of sameNIPPON MICROMETAL CORP·Filed 2015·Granted Jan 3, 2017·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →