Inventor · disambiguated record
Saket Chadda
Also filed as: CHADDA SAKET
23 granted patents·16 pending applications·837 citations·filing 1997–2025
96Inventor score
Top patents by PatentIndex Score
39 records- 0197US6736952B2Method and apparatus for electrochemical planarization of a workpieceSPEEDFAM IPEC CORP·Filed 2001·Granted May 18, 2004·155 cites·74 claims
- 0293US6464855B1Method and apparatus for electrochemical planarization of a workpieceSPEEDFAM IPEC CORP·Filed 2000·Granted Oct 15, 2002·74 cites·27 claims
- 0393US6111634AMethod and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishingLAM RES CORP·Filed 1997·Granted Aug 29, 2000·155 cites·21 claims
- 0491US6621584B2Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishingLAM RES CORP·Filed 2000·Granted Sep 16, 2003·36 cites·22 claims
- 0591US6146248AMethod and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisherLAM RES CORP·Filed 1997·Granted Nov 14, 2000·114 cites·37 claims
- 0691US6108091AMethod and apparatus for in-situ monitoring of thickness during chemical-mechanical polishingLAM RES CORP·Filed 1997·Granted Aug 22, 2000·86 cites·27 claims
- 0788US6261155B1Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisherLAM RES CORP·Filed 2000·Granted Jul 17, 2001·42 cites·20 claims
- 0887US6572755B2Method and apparatus for electrochemically depositing a material onto a workpiece surfaceSPEEDFAM IPEC CORP·Filed 2001·Granted Jun 3, 2003·33 cites·79 claims
- 0984US7998877B1Diffraction grating in conjunction with reduced thickness to increase efficiency of solar cellsCHADDA SAKET·Filed 2008·Granted Aug 16, 2011·11 cites·31 claims
- 1084US6793565B1Orbiting indexable belt polishing station for chemical mechanical polishingSPEEDFAM IPEC CORP·Filed 2000·Granted Sep 21, 2004·23 cites·35 claims
- 1184US6328642B1Integrated pad and belt for chemical mechanical polishingLAM RES CORP·Filed 1997·Granted Dec 11, 2001·66 cites·19 claims
- 1282US7033464B2Apparatus for electrochemically depositing a material onto a workpiece surfaceSPEEDFAM IPEC CORP·Filed 2002·Granted Apr 25, 2006·23 cites·18 claims
- 1380US12439757B2Subpixel light emitting diodes for direct view display and methods of making the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Oct 7, 2025·0 cites·7 claims
- 1475US2024421246A1Light emitting diode containing pinhole masking layer and method of making thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1565US6974525B2Method and apparatus for electrochemical planarization of a workpieceSPEEDFAM IPEC CORP·Filed 2004·Granted Dec 13, 2005·7 cites·10 claims
- 1664US11973172B2Subpixel light emitting diodes for direct view display and methods of making the sameGLO AB·Filed 2021·Granted Apr 30, 2024·0 cites·18 claims
- 1761US2021257510A1Light emitting diode containing pinhole masking layer and method of making thereofGLO AB·Filed 2021·Application pending·0 cites
- 1859US12074251B2Semiconductor device containing stress relaxation layer and method of making thereofGLO AB·Filed 2021·Granted Aug 27, 2024·0 cites·19 claims
- 1958US8268135B2Method and apparatus for electrochemical planarization of a workpieceEMESH ISMAIL·Filed 2005·Granted Sep 18, 2012·1 cites·10 claims
- 2057US6656025B2Integrated pad and belt for chemical mechanical polishingLAM RES CORP·Filed 2001·Granted Dec 2, 2003·5 cites·13 claims
- 2156US7025860B2Method and apparatus for the electrochemical deposition and removal of a material on a workpiece surfaceNOVELLUS SYSTEMS INC·Filed 2003·Granted Apr 11, 2006·5 cites·22 claims
- 2256US2023223494A1Light emitting diodes and method of making thereof by selectively growing active layers from trench separated areasNANOSYS INC·Filed 2023·Application pending·0 cites
- 2356US2025379184A1Self-alignment for bonding of semiconductor devicesYIELD ENG SYSTEMS INC·Filed 2025·Application pending·0 cites
- 2454US12159964B2Light-emitting diode device containing microlenses and method of making the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 3, 2024·0 cites·17 claims
- 2554US2023155075A1Light emitting devices including a quantum dot color conversion material and method of making thereofNANOSYS INC·Filed 2022·Application pending·0 cites
- 2652US2025255078A1Light emitting devices including a quantum dot color conversion material and method of making thereofSHOEI CHEMICAL IND CO·Filed 2023·Application pending·0 cites
- 2751US2023132423A1Light emitting diode array with inactive implanted isolation regions and methods of forming the sameNANOSYS INC·Filed 2022·Application pending·0 cites
- 2849US9318466B2Method for electronic circuit assembly on a paper substrateGLOBALFOUNDRIES INC·Filed 2014·Granted Apr 19, 2016·0 cites·10 claims
- 2947US6849547B2Apparatus and process for polishing a workpieceSPEEDFAM IPEC CORP·Filed 2001·Granted Feb 1, 2005·1 cites·56 claims
- 3042US7229343B2Orbiting indexable belt polishing station for chemical mechanical polishingSPEEDFAM IPEC CORP·Filed 2004·Granted Jun 12, 2007·0 cites·17 claims
- 3142US2006255016A1Method for polishing copper on a workpiece surfaceNOVELLUS SYSTEMS INC·Filed 2006·Application pending·0 cites
- 3241US2007084527A1High-strength mechanical and structural components, and methods of making high-strength componentsFERRASSE STEPHANE·Filed 2005·Application pending·0 cites
- 3340US2005118936A1Integrated pad and belt for chemical mechanical polishingLAM RES CORP·Filed 2003·Application pending·0 cites
- 3440US2016165729A1Electronic circuit assembly substrate and device thereofGLOBALFOUNDRIES INC·Filed 2016·Application pending·0 cites
- 3537US2003134576A1Method for polishing copper on a workpiece surfaceFiled 2002·Application pending·0 cites
- 3636US2002098784A1Abrasive free polishing in copper damascene applicationsFiled 2001·Application pending·0 cites
- 3731US2018254239A1FORMING METAL CAP LAYER OVER THROUGH-GLASS-VIAS (TGVs)GLOBALFOUNDRIES INC·Filed 2017·Application pending·0 cites
- 3831US2002151255A1Chemical mechanical polishing method and apparatus for removing material from a surface of a workpiece that includes low-k materialFiled 2001·Application pending·0 cites
- 3930US2001051431A1Fabrication process for dishing-free cu damascene structuresFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →