Inventor · disambiguated record
Sang-Uk Han
Also filed as: HAN SANG-UK
39 granted patents·11 pending applications·164 citations·filing 2007–2023
97Inventor score
Top patents by PatentIndex Score
50 records- 0196US10026724B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 17, 2018·23 cites·20 claims
- 0294US10199319B2Printed circuit board and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 5, 2019·11 cites·12 claims
- 0394US8853694B2Chip on film package including test pads and semiconductor devices including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Oct 7, 2014·20 cites·11 claims
- 0493US11637140B2Image sensor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 25, 2023·2 cites·20 claims
- 0592US10361170B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 23, 2019·11 cites·18 claims
- 0692US9177904B2Chip-on-film package and device assembly including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 3, 2015·16 cites·12 claims
- 0791US9113545B2Tape wiring substrate and chip-on-film package including the sameHAN SANG-UK·Filed 2012·Granted Aug 18, 2015·15 cites·16 claims
- 0890US9054228B2Semiconductor packages including a heat spreader and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 9, 2015·12 cites·20 claims
- 0987US10971535B2Image sensor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 6, 2021·4 cites·19 claims
- 1087US9905550B2Semiconductor package and method of fabricating the sameHAN SANG UK·Filed 2015·Granted Feb 27, 2018·7 cites·20 claims
- 1186US10680025B2Semiconductor package and image sensorSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 9, 2020·4 cites·19 claims
- 1285US9818732B2Chip-on-film package and device assembly including the sameJUNG JAE-MIN·Filed 2015·Granted Nov 14, 2017·6 cites·13 claims
- 1382US9721926B2Semiconductor device having stacked semiconductor chips interconnected via TSV and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Aug 1, 2017·4 cites·27 claims
- 1480US9241407B2Tape film packages and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 19, 2016·4 cites·11 claims
- 1579US11152416B2Semiconductor package including a redistribution lineSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 19, 2021·2 cites·18 claims
- 1678US10750112B2Substrate structures for image sensor modules and image sensor modules including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 18, 2020·2 cites·18 claims
- 1777US12113087B2Image sensor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 1877US10510737B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Dec 17, 2019·2 cites·12 claims
- 1977US8940557B2Method of fabricating wafer level packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 27, 2015·4 cites·17 claims
- 2072US12191246B2Chip-on-film package having redistribution pattern between semiconductor chip and connection terminalSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 7, 2025·0 cites·20 claims
- 2172US10985152B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 20, 2021·1 cites·20 claims
- 2272US8980689B2Method of fabricating semiconductor multi-chip stack packagesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Mar 17, 2015·3 cites·20 claims
- 2371US10651224B2Semiconductor package including a redistribution lineSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 12, 2020·1 cites·19 claims
- 2469US10978431B2Semiconductor package with connection substrate and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 13, 2021·1 cites·18 claims
- 2569US10020290B2Semiconductor device having stacked semiconductor chips interconnected via TSVCHOE YEONG HWAN·Filed 2017·Granted Jul 10, 2018·2 cites·20 claims
- 2668US11600608B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 7, 2023·0 cites·20 claims
- 2768US11569201B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 31, 2023·0 cites·20 claims
- 2868US8184449B2Electronic device having stack-type semiconductor package and method of forming the sameLEE JUNG-DO·Filed 2008·Granted May 22, 2012·5 cites·20 claims
- 2967US9620389B2Methods of fabricating tape film packagesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Apr 11, 2017·1 cites·10 claims
- 3066US11830803B2Chip-on-film package having redistribution pattern between semiconductor chip and connection terminalSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 28, 2023·0 cites·19 claims
- 3154US11600556B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 7, 2023·0 cites·20 claims
- 3254US11158603B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 26, 2021·0 cites·18 claims
- 3353US8304876B2Semiconductor package and method for manufacturing the sameBYUN HAK-KYOON·Filed 2009·Granted Nov 6, 2012·1 cites·13 claims
- 3453US2023176108A1Semiconductor package and method of testing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3552US11710757B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 25, 2023·0 cites·19 claims
- 3651US11764140B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 19, 2023·0 cites·20 claims
- 3751US2019259733A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 3848US12086106B2Method and apparatus for providing metadata sharing serviceSAMSUNG SDS CO LTD·Filed 2021·Granted Sep 10, 2024·0 cites·19 claims
- 3945US2015137345A1Semiconductor package having heat spreaderSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 4044US8940621B2Methods of forming semiconductor modules including flexible panelsHAN SANG-UK·Filed 2012·Granted Jan 27, 2015·0 cites·10 claims
- 4144US2014252605A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 4242US2009085185A1Stack-type semiconductor package, method of forming the same and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 4342US2014239478A1Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 4441US2008111224A1Multi stack package and method of fabricating the sameBYUN HAK-KYOON·Filed 2007·Application pending·0 cites
- 4541US2013240917A1Semiconductor package having a conductive layer for electrostatic discharge and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 4641US2012199964A1Electronic device having stack-type semiconductor package and method of forming the sameLEE JUNG-DO·Filed 2012·Application pending·0 cites
- 4740US12235724B2Method and apparatus for processing transactionSAMSUNG SDS CO LTD·Filed 2022·Granted Feb 25, 2025·0 cites·17 claims
- 4840US9431272B2Printed circuit board including through region and semiconductor package formed by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 30, 2016·0 cites·20 claims
- 4937US2012021600A1Method of fabricating film circuit substrate and method of fabricating chip package including the sameHAN SANG-UK·Filed 2011·Application pending·0 cites
- 5035US2016225721A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →