Inventor · disambiguated record
Sang-Hyeob Lee
Also filed as: LEE SANG HYEOB
33 granted patents·7 pending applications·1,420 citations·filing 1997–2025
97Inventor score
Top patents by PatentIndex Score
40 records- 0198US6635965B1Method for producing ultra-thin tungsten layers with improved step coverageNOVELLUS SYSTEMS INC·Filed 2001·Granted Oct 21, 2003·245 cites·39 claims
- 0297US9583385B2Method for producing ultra-thin tungsten layers with improved step coverageNOVELLUS SYSTEMS INC·Filed 2015·Granted Feb 28, 2017·31 cites·27 claims
- 0397US8900999B1Low temperature high pressure high H2/WF6 ratio W process for 3D NAND applicationAPPLIED MATERIALS INC·Filed 2013·Granted Dec 2, 2014·423 cites·15 claims
- 0497US7141494B2Method for reducing tungsten film roughness and improving step coverageNOVELLUS SYSTEMS INC·Filed 2003·Granted Nov 28, 2006·147 cites·32 claims
- 0597US6844258B1Selective refractory metal and nitride cappingNOVELLUS SYSTEMS INC·Filed 2003·Granted Jan 18, 2005·260 cites·55 claims
- 0695US9076843B2Method for producing ultra-thin tungsten layers with improved step coverageNOVELLUS SYSTEMS INC·Filed 2012·Granted Jul 7, 2015·23 cites·18 claims
- 0794US7732327B2Vapor deposition of tungsten materialsAPPLIED MATERIALS INC·Filed 2008·Granted Jun 8, 2010·58 cites·25 claims
- 0893US9169556B2Tungsten growth modulation by controlling surface compositionAPPLIED MATERIALS INC·Filed 2013·Granted Oct 27, 2015·9 cites·20 claims
- 0993US7157798B1Selective refractory metal and nitride cappingNOVELLUS SYSTEMS INC·Filed 2004·Granted Jan 2, 2007·68 cites·13 claims
- 1090US8637390B2Metal gate structures and methods for forming thereofGANGULI SESHADRI·Filed 2011·Granted Jan 28, 2014·12 cites·13 claims
- 1189US8865594B2Formation of liner and barrier for tungsten as gate electrode and as contact plug to reduce resistance and enhance device performanceLEE SANG-HYEOB·Filed 2012·Granted Oct 21, 2014·12 cites·17 claims
- 1288US9129945B2Formation of liner and barrier for tungsten as gate electrode and as contact plug to reduce resistance and enhance device performanceLEE SANG-HYEOB·Filed 2010·Granted Sep 8, 2015·10 cites·14 claims
- 1386US8617985B2High temperature tungsten metallization processAPPLIED MATERIALS INC·Filed 2012·Granted Dec 31, 2013·7 cites·19 claims
- 1485US10793951B2Apparatus to improve substrate temperature uniformityAPPLIED MATERIALS INC·Filed 2018·Granted Oct 6, 2020·3 cites·8 claims
- 1585US10157787B2Method and apparatus for depositing cobalt in a featureAPPLIED MATERIALS INC·Filed 2016·Granted Dec 18, 2018·4 cites·5 claims
- 1681US9957615B2Apparatus to improve substrate temperature uniformityAPPLIED MATERIALS INC·Filed 2014·Granted May 1, 2018·4 cites·5 claims
- 1780US8835311B2High temperature tungsten metallization processAPPLIED MATERIAL INC·Filed 2013·Granted Sep 16, 2014·4 cites·19 claims
- 1874US6258725B1Method for forming metal line of semiconductor device by (TiA1)N anti-reflective coating layerHYUNDAI ELECTRONICS IND·Filed 1999·Granted Jul 10, 2001·46 cites·1 claims
- 1970US8821637B2Temperature controlled lid assembly for tungsten nitride depositionGELATOS AVGERINOS V·Filed 2008·Granted Sep 2, 2014·3 cites·14 claims
- 2068US8350124B2Root Specific expression promoter from Capsicum annuum aquaporin gene and uses thereofJOUNG YOUNG HEE·Filed 2009·Granted Jan 8, 2013·2 cites·7 claims
- 2166US11948836B2Deposition of metal films with tungsten linerAPPLIED MATERIALS INC·Filed 2021·Granted Apr 2, 2024·0 cites·18 claims
- 2266US6887781B2Method for the formation of diffusion barrierNOVELLUS SYSTEMS INC·Filed 2003·Granted May 3, 2005·9 cites·4 claims
- 2363US6358789B2Method for manufacturing a semiconductor device having a capacitorHYUNDAI ELECTRONICS IND·Filed 2000·Granted Mar 19, 2002·9 cites·10 claims
- 2462US2025305118A1Methods and systems for forming highly conformal and low resistivity vanadium nitride thin filmsEUGENUS INC·Filed 2025·Application pending·0 cites
- 2560US2025167044A1Diffusion barrier including metal silicide and titanium silicon nitrideEUGENUS INC·Filed 2024·Application pending·0 cites
- 2657US11171045B2Deposition of metal films with tungsten linerAPPLIED MATERIALS INC·Filed 2019·Granted Nov 9, 2021·0 cites·9 claims
- 2757US2025246434A1Metal silicide contact formationLAM RES CORP·Filed 2023·Application pending·0 cites
- 2856US10714388B2Method and apparatus for depositing cobalt in a featureAPPLIED MATERIALS INC·Filed 2018·Granted Jul 14, 2020·0 cites·13 claims
- 2955US2025022751A1Gradient liner in metal fillLAM RES CORP·Filed 2022·Application pending·0 cites
- 3051US2013146468A1Chemical vapor deposition (cvd) of ruthenium films and applications for sameKIM HOON·Filed 2011·Application pending·0 cites
- 3141US9926639B2Methods for forming barrier/seed layers for copper interconnect structuresKIM HOON·Filed 2011·Granted Mar 27, 2018·0 cites·11 claims
- 3241US8729340B2Solanum lycopersicum histidine decarboxylase gene-derived fruit-specific expression promoter and uses thereofJOUNG YOUNG HEE·Filed 2010·Granted May 20, 2014·0 cites·12 claims
- 3341US6171941B1Method for fabricating capacitor of semiconductor memory device using titanium aluminum nitride as diffusion-inhibiting layerHYUNDAI ELECTRONICS IND·Filed 1999·Granted Jan 9, 2001·8 cites·15 claims
- 3440US6184113B1Method of manufacturing a gate electrode in a semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1999·Granted Feb 6, 2001·9 cites·12 claims
- 3538US6087259AMethod for forming bit lines of semiconductor devicesHYUNDAI ELECTRONICS IND·Filed 1997·Granted Jul 11, 2000·7 cites·6 claims
- 3638US2002081845A1Method for the formation of diffusion barrierNOVELLUS SYSTEMS INC·Filed 2000·Application pending·0 cites
- 3738US2011312148A1Chemical vapor deposition of ruthenium films containing oxygen or carbonKIM HOON·Filed 2011·Application pending·0 cites
- 3837US9458455B2High efficiency plant expression promoter from Capsicum annuum serine hydroxymethyl transferase gene and uses thereofCHOI DO IL·Filed 2010·Granted Oct 4, 2016·0 cites·7 claims
- 3936US6323083B1Method for forming lower electrode structure of capacitor of semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1999·Granted Nov 27, 2001·5 cites·13 claims
- 4032US5918142AMethod for fabricating a semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1997·Granted Jun 29, 1999·2 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →