Inventor · disambiguated record
Saravuth Sirinorakul
Also filed as: SIRINORAKUL SARAVUTH
76 granted patents·3 pending applications·657 citations·filing 2003–2022
99Inventor score
Files withUTAC HEADQUARTERS PTE LTD26UTAC THAI LTD20SIRINORAKUL SARAVUTH16NONDHASITTHICHAI SOMCHAI10NS ELECTRONICS BANGKOK 1993 LT5
Top patents by PatentIndex Score
79 records- 0196US8063470B1Method and apparatus for no lead semiconductor packageSIRINORAKUL SARAVUTH·Filed 2008·Granted Nov 22, 2011·41 cites·16 claims
- 0295US7060535B1Flat no-lead semiconductor die package including stud terminalsNS ELECTRONICS BANGKOK 1993 LT·Filed 2003·Granted Jun 13, 2006·179 cites·37 claims
- 0394US9006034B1Post-mold for semiconductor package having exposed tracesSIRINORAKUL SARAVUTH·Filed 2012·Granted Apr 14, 2015·16 cites·12 claims
- 0494US7327017B2Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compoundUTAC THAI LTD·Filed 2005·Granted Feb 5, 2008·40 cites·22 claims
- 0593US8129229B1Method of manufacturing semiconductor package containing flip-chip arrangementSIRINORAKUL SARAVUTH·Filed 2010·Granted Mar 6, 2012·18 cites·14 claims
- 0691US9805955B1Semiconductor package with multiple molding routing layers and a method of manufacturing the sameUTAC HEADQUARTERS PTE LTD·Filed 2016·Granted Oct 31, 2017·5 cites·15 claims
- 0791US7205180B1Process of fabricating semiconductor packages using leadframes roughened with chemical etchantNS ELECTRONICS BANGKOK 1993 LT·Filed 2004·Granted Apr 17, 2007·60 cites·76 claims
- 0890US9741642B1Semiconductor package with partial plating on contact side surfacesUTAC HEADQUARTERS PTE LTD·Filed 2016·Granted Aug 22, 2017·8 cites·21 claims
- 0989US10242934B1Semiconductor package with full plating on contact side surfaces and methods thereofUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Mar 26, 2019·6 cites·20 claims
- 1088US8648474B2Lead frame land grid arrayNONDHASITTHICHAI SOMCHAI·Filed 2012·Granted Feb 11, 2014·10 cites·13 claims
- 1188US7790512B1Molded leadframe substrate semiconductor packageUTAC THAI LTD·Filed 2008·Granted Sep 7, 2010·14 cites·21 claims
- 1287US8338922B1Molded leadframe substrate semiconductor packageSIRINORAKUL SARAVUTH·Filed 2010·Granted Dec 25, 2012·8 cites·9 claims
- 1386US9922843B1Semiconductor package with multiple molding routing layers and a method of manufacturing the sameUTAC HEADQUARTERS PTE LTD·Filed 2016·Granted Mar 20, 2018·3 cites·16 claims
- 1486US7049683B1Semiconductor package including organo-metallic coating formed on surface of leadframe roughened using chemical etchant to prevent separation between leadframe and molding compoundNS ELECTRONICS BANGKOK 1993 LT·Filed 2003·Granted May 23, 2006·40 cites·30 claims
- 1586US6943061B1Method of fabricating semiconductor chip package using screen printing of epoxy on waferNS ELECTRONICS BANGKOK 1993 LT·Filed 2004·Granted Sep 13, 2005·72 cites·17 claims
- 1685US10242953B1Semiconductor package with plated metal shielding and a method thereofUTAC HEADQUARTERS PTE LTD·Filed 2016·Granted Mar 26, 2019·7 cites·20 claims
- 1785US8461694B1Lead frame ball grid array with traces under die having interlocking featuresUTAC THAI LTD·Filed 2012·Granted Jun 11, 2013·7 cites·13 claims
- 1885US8460970B1Lead frame ball grid array with traces under die having interlocking featuresUTAC THAI LTD·Filed 2012·Granted Jun 11, 2013·7 cites·7 claims
- 1983US8310060B1Lead frame land grid arrayNONDHASITTICHAI SOMCHAI·Filed 2007·Granted Nov 13, 2012·13 cites·36 claims
- 2082US10515878B1Semiconductor package with partial plating on contact side surfacesUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Dec 24, 2019·3 cites·16 claims
- 2182US9773722B1Semiconductor package with partial plating on contact side surfacesUTAC HEADQUARTERS PTE LTD·Filed 2015·Granted Sep 26, 2017·4 cites·20 claims
- 2280US9082607B1Molded leadframe substrate semiconductor packageNONDHASITTHICHAI SOMCHAI·Filed 2007·Granted Jul 14, 2015·4 cites·16 claims
- 2380US8013437B1Package with heat transferUTAC THAI LTD·Filed 2007·Granted Sep 6, 2011·9 cites·20 claims
- 2480US7153724B1Method of fabricating no-lead package for semiconductor die with half-etched leadframeNS ELECTRONICS BANGKOK 1993 LT·Filed 2003·Granted Dec 26, 2006·36 cites·10 claims
- 2579US8871571B2Apparatus for and methods of attaching heat slugs to package topsSIRINORAKUL SARAVUTH·Filed 2011·Granted Oct 28, 2014·5 cites·27 claims
- 2676US11227818B2Stacked dies electrically connected to a package substrate by lead terminalsUTAC HEADQUARTERS PTE LTD·Filed 2020·Granted Jan 18, 2022·1 cites·19 claims
- 2776US10163658B2Semiconductor package with multiple molding routing layers and a method of manufacturing the sameUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Dec 25, 2018·1 cites·13 claims
- 2875US9099317B2Method for forming lead frame land grid arrayNONDHASITTHICHAI SOMCHAI·Filed 2009·Granted Aug 4, 2015·4 cites·25 claims
- 2975US8575762B2Very extremely thin semiconductor packageNONDHASITTHICHAI SOMCHAI·Filed 2007·Granted Nov 5, 2013·4 cites·20 claims
- 3074US9349679B2Singulation method for semiconductor package with plating on side of connectorsSIRINORAKUL SARAVUTH·Filed 2011·Granted May 24, 2016·3 cites·19 claims
- 3174US8071426B2Method and apparatus for no lead semiconductor packageSIRINORAKUL SARAVUTH·Filed 2010·Granted Dec 6, 2011·3 cites·20 claims
- 3271US8125077B2Package with heat transferSIRINORAKUL SARAVUTH·Filed 2010·Granted Feb 28, 2012·3 cites·21 claims
- 3370US9449900B2Leadframe feature to minimize flip-chip semiconductor die collapse during flip-chip reflowSIRINORAKUL SARAVUTH·Filed 2010·Granted Sep 20, 2016·3 cites·13 claims
- 3469US9761435B1Flip chip cavity packageSIRINORAKUL SARAVUTH·Filed 2008·Granted Sep 12, 2017·4 cites·16 claims
- 3569US8575732B2Leadframe based multi terminal IC packageSIRINORAKUL SARAVUTH·Filed 2011·Granted Nov 5, 2013·2 cites·11 claims
- 3667US9711343B1Molded leadframe substrate semiconductor packageNONDHASITTHICHAI SOMCHAI·Filed 2007·Granted Jul 18, 2017·1 cites·21 claims
- 3767US9564387B2Semiconductor package having routing traces thereinUTAC HEADQUARTERS PTE LTD·Filed 2015·Granted Feb 7, 2017·1 cites·19 claims
- 3867US8704381B2Very extremely thin semiconductor packageUTAC THAI LTD·Filed 2013·Granted Apr 22, 2014·1 cites·12 claims
- 3966US8487451B2Lead frame land grid array with routing connector trace under unitNONDHASITTHICHAI SOMCHAI·Filed 2011·Granted Jul 16, 2013·2 cites·24 claims
- 4065US8492906B2Lead frame ball grid array with traces under dieNONDHASITTHICHAI SOMCHAI·Filed 2011·Granted Jul 23, 2013·2 cites·13 claims
- 4164US8816482B2Flip-chip leadframe semiconductor packageSIRINORAKUL SARAVUTH·Filed 2008·Granted Aug 26, 2014·3 cites·19 claims
- 4263US9397031B2Post-mold for semiconductor package having exposed tracesSIRINORAKUL SARAVUTH·Filed 2012·Granted Jul 19, 2016·1 cites·15 claims
- 4362US8368189B2Auxiliary leadframe member for stabilizing the bond wire processUTAC THAI LTD·Filed 2010·Granted Feb 5, 2013·1 cites·17 claims
- 4461US10734247B2Semiconductor package with multiple molding routing layers and a method of manufacturing the sameUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Aug 4, 2020·0 cites·17 claims
- 4561US10325782B2Semiconductor package with multiple molding routing layers and a method of manufacturing the sameUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Jun 18, 2019·0 cites·16 claims
- 4660US10096490B2Semiconductor package with multiple molding routing layers and a method of manufacturing the sameUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Oct 9, 2018·0 cites·14 claims
- 4760US10032645B1Semiconductor package with multiple molding routing layers and a method of manufacturing the sameUTAC HEADQUARTERS PTE LTD·Filed 2016·Granted Jul 24, 2018·0 cites·16 claims
- 4860US9917038B1Semiconductor package with multiple molding routing layers and a method of manufacturing the sameUTAC HEADQUARTERS PTE LTD·Filed 2016·Granted Mar 13, 2018·0 cites·15 claims
- 4960US8652879B2Lead frame ball grid array with traces under dieUTAC THAI LTD·Filed 2013·Granted Feb 18, 2014·1 cites·18 claims
- 5058US9093486B2Molded leadframe substrate semiconductor packageUTAC THAI LTD·Filed 2013·Granted Jul 28, 2015·0 cites·5 claims
Showing the top 50 of 79 patent records by PatentIndex Score.
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