Inventor · disambiguated record
Sameer S. Vadhavkar
Also filed as: VADHAVKAR SAMEER S · VADHAVKAR SAMEER SUNIL · Vadhavkar Sameer
42 granted patents·8 pending applications·106 citations·filing 2011–2024
97Inventor score
Files withMICRON TECHNOLOGY INC34QUALCOMM INC12VADHAVKAR SAMEER S2LODESTAR LICENSING GROUP LLC1RF360 SINGAPORE PTE LTD1
Top patents by PatentIndex Score
50 records- 0198US9768149B2Semiconductor device assembly with heat transfer structure formed from semiconductor materialMICRON TECHNOLOGY INC·Filed 2015·Granted Sep 19, 2017·24 cites·29 claims
- 0297US9397078B1Semiconductor device assembly with underfill containment cavityMICRON TECHNOLOGY INC·Filed 2015·Granted Jul 19, 2016·24 cites·36 claims
- 0392US9691746B2Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal pathsMICRON TECHNOLOGY INC·Filed 2014·Granted Jun 27, 2017·9 cites·16 claims
- 0491US9515002B2Bonding pads with thermal pathwaysMICRON TECHNOLOGY INC·Filed 2015·Granted Dec 6, 2016·6 cites·20 claims
- 0589US11515247B2Capacitance fine tuning by fin capacitor designQUALCOMM INC·Filed 2021·Granted Nov 29, 2022·2 cites·20 claims
- 0689US9337119B2Stacked semiconductor die assemblies with high efficiency thermal paths and associated systemsMICRON TECHNOLOGY INC·Filed 2014·Granted May 10, 2016·10 cites·28 claims
- 0786US11081460B2Methods and systems for manufacturing pillar structures on semiconductor devicesMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 3, 2021·5 cites·22 claims
- 0886US10163830B2Bonding pads with thermal pathwaysMICRON TECHNOLOGY INC·Filed 2016·Granted Dec 25, 2018·3 cites·20 claims
- 0983US10916527B2Apparatuses and methods for semiconductor die heat dissipationMICRON TECHNOLOGY INC·Filed 2020·Granted Feb 9, 2021·1 cites·19 claims
- 1083US8952402B2Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methodsVADHAVKAR SAMEER S·Filed 2011·Granted Feb 10, 2015·5 cites·18 claims
- 1181US2023395463A1Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal pathsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1280US9647167B2Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2015·Granted May 9, 2017·2 cites·20 claims
- 1379US9780052B2Collars for under-bump metal structures and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2015·Granted Oct 3, 2017·3 cites·24 claims
- 1478US10541229B2Apparatuses and methods for semiconductor die heat dissipationMICRON TECHNOLOGY INC·Filed 2015·Granted Jan 21, 2020·2 cites·24 claims
- 1577US11658403B2Device, package and/or substrate comprising curved antennaQUALCOMM INC·Filed 2020·Granted May 23, 2023·1 cites·37 claims
- 1677US10580746B2Bonding pads with thermal pathwaysMICRON TECHNOLOGY INC·Filed 2018·Granted Mar 3, 2020·1 cites·19 claims
- 1776US10573612B2Bonding pads with thermal pathwaysMICRON TECHNOLOGY INC·Filed 2018·Granted Feb 25, 2020·1 cites·17 claims
- 1875US10079333B2Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Sep 18, 2018·1 cites·12 claims
- 1974US11776877B2Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal pathsMICRON TECHNOLOGY INC·Filed 2021·Granted Oct 3, 2023·0 cites·20 claims
- 2074US10886244B2Collars for under-bump metal structures and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Jan 5, 2021·2 cites·11 claims
- 2173US10163755B2Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal pathsMICRON TECHNOLOGY INC·Filed 2017·Granted Dec 25, 2018·1 cites·5 claims
- 2272US11139258B2Bonding pads with thermal pathwaysMICRON TECHNOLOGY INC·Filed 2020·Granted Oct 5, 2021·0 cites·21 claims
- 2371US10957625B2Pillar-last methods for forming semiconductor devicesMICRON TECHNOLOGY INC·Filed 2017·Granted Mar 23, 2021·1 cites·14 claims
- 2470US9443744B2Stacked semiconductor die assemblies with high efficiency thermal paths and associated methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Sep 13, 2016·2 cites·26 claims
- 2567US10748878B2Semiconductor device assembly with heat transfer structure formed from semiconductor materialMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 18, 2020·0 cites·19 claims
- 2666US11631630B2Pillar-last methods for forming semiconductor devicesMICRON TECHNOLOGY INC·Filed 2021·Granted Apr 18, 2023·0 cites·20 claims
- 2766US10559551B2Semiconductor device assembly with heat transfer structure formed from semiconductor materialMICRON TECHNOLOGY INC·Filed 2019·Granted Feb 11, 2020·0 cites·17 claims
- 2865US11929456B2Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methodsLODESTAR LICENSING GROUP LLC·Filed 2019·Granted Mar 12, 2024·0 cites·20 claims
- 2964US11735549B2Methods and systems for manufacturing pillar structures on semiconductor devicesMICRON TECHNOLOGY INC·Filed 2021·Granted Aug 22, 2023·0 cites·18 claims
- 3063US10770435B2Apparatuses and methods for semiconductor die heat dissipationMICRON TECHNOLOGY INC·Filed 2019·Granted Sep 8, 2020·0 cites·17 claims
- 3162US2021151400A1Collars for under-bump metal structures and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Application pending·0 cites
- 3261US10541355B2Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Jan 21, 2020·0 cites·20 claims
- 3361US10461061B2Apparatuses and methods for semiconductor die heat dissipationMICRON TECHNOLOGY INC·Filed 2019·Granted Oct 29, 2019·0 cites·15 claims
- 3461US10297577B2Semiconductor device assembly with heat transfer structure formed from semiconductor materialMICRON TECHNOLOGY INC·Filed 2017·Granted May 21, 2019·0 cites·18 claims
- 3559US2018308785A1Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal pathsMICRON TECHNOLOGY INC·Filed 2018·Application pending·0 cites
- 3659US2025359089A1Pillar with embedded capacitorQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3758US11239158B1Wire bond inductor structures for flip chip diesQUALCOMM INC·Filed 2020·Granted Feb 1, 2022·0 cites·20 claims
- 3858US10784224B2Semiconductor devices with underfill control features, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Sep 22, 2020·0 cites·18 claims
- 3956US12009292B2Metal-insulator-metal (MIM) capacitor structure for layer count reduction and lower capacitance variationQUALCOMM INC·Filed 2021·Granted Jun 11, 2024·0 cites·18 claims
- 4054US12016247B2Package comprising an integrated passive device configured as a cap for a filterQUALCOMM INC·Filed 2020·Granted Jun 18, 2024·0 cites·22 claims
- 4153US11728293B2Chip modules employing conductive pillars to couple a passive component device to conductive traces in a metallization structure to form a passive componentQUALCOMM INC·Filed 2021·Granted Aug 15, 2023·0 cites·14 claims
- 4252US12402332B2Integrated passive devicesRF360 SINGAPORE PTE LTD·Filed 2021·Granted Aug 26, 2025·0 cites·39 claims
- 4352US2024297165A1Double-sided redistribution layer (rdl) substrate with double-sided pillars for device integrationQUALCOMM INC·Filed 2023·Application pending·0 cites
- 4451US11502652B2Substrate comprising capacitor configured for power amplifier output matchQUALCOMM INC·Filed 2020·Granted Nov 15, 2022·0 cites·27 claims
- 4551US2023352423A1Die edge protection to eliminate die chippingQUALCOMM INC·Filed 2022·Application pending·0 cites
- 4650US9837396B2Stacked semiconductor die assemblies with high efficiency thermal paths and associated methodsMICRON TECHNOLOGY INC·Filed 2016·Granted Dec 5, 2017·0 cites·12 claims
- 4749US10424553B2Semiconductor devices with underfill control features, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2016·Granted Sep 24, 2019·0 cites·24 claims
- 4846US9039474B2Magnetically adjusting color-converting materials within a matrix and associated devices, systems, and methodsVADHAVKAR SAMEER S·Filed 2011·Granted May 26, 2015·0 cites·35 claims
- 4946US2022248541A1System in package (sip) socket connector interfaceQUALCOMM INC·Filed 2021·Application pending·0 cites
- 5045US2021375732A1Partial component embedding in a substrateQUALCOMM INC·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →