Inventor · disambiguated record
Seung H. Kang
Also filed as: KANG SEUNG H · KANG SEUNG HOON
20 granted patents·4 pending applications·118 citations·filing 2000–2023
94Inventor score
Files withAGERE SYSTEMS INC10SAMSUNG ELECTRO MECH3AGERE SYSTEMS LLC2KOREA ADVANCED INST SCI & TECH2AGERE SYST GUARDIAN CORP1
Top patents by PatentIndex Score
24 records- 0192US7952206B2Solder bump structure for flip chip semiconductor devices and method of manufacture thereforeAGERE SYSTEMS INC·Filed 2006·Granted May 31, 2011·20 cites·10 claims
- 0291US7429502B2Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sinkAGERE SYSTEMS INC·Filed 2007·Granted Sep 30, 2008·23 cites·10 claims
- 0385US11277118B2Variable gain phase shifterKOREA ADVANCED INST SCI & TECH·Filed 2020·Granted Mar 15, 2022·2 cites·13 claims
- 0483US11310940B2Electronic device including radiation structureSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 19, 2022·4 cites·10 claims
- 0582US8507317B2Solder bump structure for flip chip semiconductor devices and method of manufacturing thereforeBACHMAN MARK A·Filed 2011·Granted Aug 13, 2013·5 cites·7 claims
- 0682US8319343B2Routing under bond pad for the replacement of an interconnect layerARCHER III VANCE D·Filed 2006·Granted Nov 27, 2012·13 cites·10 claims
- 0781US7397103B2Semiconductor with damage detection circuitryAGERE SYSTEMS INC·Filed 2005·Granted Jul 8, 2008·11 cites·13 claims
- 0875US9979362B2Power amplifierSAMSUNG ELECTRO MECH·Filed 2016·Granted May 22, 2018·3 cites·19 claims
- 0975US7388395B2Test semiconductor device and method for determining Joule heating effects in such a deviceAGERE SYSTEMS INC·Filed 2006·Granted Jun 17, 2008·4 cites·6 claims
- 1072US7480874B2Reliability analysis of integrated circuitsAGERE SYSTEMS INC·Filed 2005·Granted Jan 20, 2009·9 cites·21 claims
- 1167US7061264B2Test semiconductor device and method for determining Joule heating effects in such a deviceAGERE SYSTEMS INC·Filed 2004·Granted Jun 13, 2006·9 cites·9 claims
- 1266US7327029B2Integrated circuit device incorporating metallurigical bond to enhance thermal conduction to a heat sinkAGERE SYSTEMS INC·Filed 2005·Granted Feb 5, 2008·3 cites·10 claims
- 1365US10848130B2Variable gain phase shifterKOREA ADVANCED INST SCI & TECH·Filed 2017·Granted Nov 24, 2020·1 cites·9 claims
- 1462US10411348B2Phase shifting deviceLG ELECTRONICS INC·Filed 2018·Granted Sep 10, 2019·1 cites·11 claims
- 1557US6365503B1Method of improving electromigration in semiconductor device manufacturing processesAGERE SYST GUARDIAN CORP·Filed 2000·Granted Apr 2, 2002·6 cites·24 claims
- 1653US7973544B2Thermal monitoring and management of integrated circuitsAGERE SYSTEMS INC·Filed 2008·Granted Jul 5, 2011·0 cites·20 claims
- 1753US7804291B2Semiconductor test device with heating circuitAGERE SYSTEMS INC·Filed 2007·Granted Sep 28, 2010·2 cites·11 claims
- 1852US2014015127A1Contact support pillar structure for flip chip semiconductor devices and method of manufacture thereforeAGERE SYSTEMS LLC·Filed 2013·Application pending·0 cites
- 1950US12507199B2System for providing precise position information on basis of machine learning, and provision method thereforKANG SEUNG HOON·Filed 2023·Granted Dec 23, 2025·0 cites·5 claims
- 2048US2013056868A1Routing under bond pad for the replacement of an interconnect layerAGERE SYSTEMS LLC·Filed 2012·Application pending·0 cites
- 2145US7566964B2Aluminum pad power bus and signal routing for integrated circuit devices utilizing copper technology interconnect structuresAGERE SYSTEMS INC·Filed 2003·Granted Jul 28, 2009·2 cites·7 claims
- 2237US10171048B2Power amplifierSAMSUNG ELECTRO MECH·Filed 2016·Granted Jan 1, 2019·0 cites·8 claims
- 2336US2015188500A1Power amplifierSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2435US2006066335A1Semiconductor test device with heating circuitKANG SEUNG H·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →