Inventor · disambiguated record
Seong Cheol Kim
Also filed as: KIM SEONG-CHEOL
37 granted patents·13 pending applications·172 citations·filing 1997–2024
96Inventor score
Files withKIM SEONG CHEOL14HYNIX SEMICONDUCTOR INC7SAMSUNG ELECTRONICS CO LTD6JO SEUNG HEE2LG DISPLAY CO LTD2
Top patents by PatentIndex Score
50 records- 0195US7795139B2Method for manufacturing semiconductor packageHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Sep 14, 2010·47 cites·18 claims
- 0291US7710377B2LCD panel including gate driversSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted May 4, 2010·15 cites·10 claims
- 0389US7898834B2Semiconductor chip with chip selection structure and stacked semiconductor package having the sameHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Mar 1, 2011·18 cites·23 claims
- 0488US8478292B2Wireless localization method based on an efficient multilateration algorithm over a wireless sensor network and a recording medium in which a program for the method is recordedKIM SEONG CHEOL·Filed 2011·Granted Jul 2, 2013·16 cites·12 claims
- 0584US7795073B2Method for manufacturing stack package using through-electrodesHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Sep 14, 2010·12 cites·18 claims
- 0681US7446405B2Wafer level chip scale package (WLCSP) with high reliability against thermal stressHYNIX SEMICONDUCTOR INC·Filed 2006·Granted Nov 4, 2008·9 cites·5 claims
- 0776US8592952B2Semiconductor chip and semiconductor package with stack chip structureJO SEUNG HEE·Filed 2011·Granted Nov 26, 2013·7 cites·15 claims
- 0875US11771159B2Modularized garment manufacturing method for small quantity batch production of garments and modularized garment manufacturing systemHOJEON LTD·Filed 2019·Granted Oct 3, 2023·2 cites·27 claims
- 0974US2024384084A1Eco-friendly eraser using epdm rubberYEUNGNAM UNIV INDUSTRY ACADEMIC COOPERATION FOUNDATION·Filed 2024·Application pending·0 cites
- 1072US8823161B2Semiconductor chip, semiconductor package, and method for manufacturing semiconductor chip for reducing open failuresKIM SEONG CHEOL·Filed 2011·Granted Sep 2, 2014·3 cites·8 claims
- 1171US8232642B2Printed circuit boardKIM SEONG CHEOL·Filed 2010·Granted Jul 31, 2012·3 cites·20 claims
- 1270US8395245B2Semiconductor package moduleKIM JONG HOON·Filed 2007·Granted Mar 12, 2013·4 cites·18 claims
- 1367US11892558B2Method and apparatus for estimating direction of arrival of radar reception signal using antenna array extrapolationSEOUL NAT UNIV R&DB FOUNDATION·Filed 2018·Granted Feb 6, 2024·2 cites·15 claims
- 1467US8803325B2Stacked semiconductor packageKIM SEONG CHEOL·Filed 2012·Granted Aug 12, 2014·2 cites·17 claims
- 1567US8237291B2Stack packageKIM SEONG CHEOL·Filed 2009·Granted Aug 7, 2012·3 cites·20 claims
- 1667US8198719B2Semiconductor chip and semiconductor package including the sameKIM SEONG CHEOL·Filed 2010·Granted Jun 12, 2012·2 cites·18 claims
- 1765US7595255B2Method for manufacturing strip level substrate without warpage and method for manufacturing semiconductor package using the sameHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Sep 29, 2009·2 cites·10 claims
- 1865US7355286B2Flip chip bonded package applicable to fine pitch technologyHYNIX SEMICONDUCTOR INC·Filed 2006·Granted Apr 8, 2008·3 cites·10 claims
- 1965US2023399489A1Heat stabilizer for polymer processing using phosphate with suppressed crystallinity, and method for preparing the sameINDUSTRY ACADEMIC COOPERATION FOUNDATION OF YEUNGNAM UNIV·Filed 2021·Application pending·0 cites
- 2064US10749132B2Electrode laminate and organic light emitting device elementLG DISPLAY CO LTD·Filed 2019·Granted Aug 18, 2020·0 cites·18 claims
- 2163US8766457B2Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor packageKIM SEONG CHEOL·Filed 2011·Granted Jul 1, 2014·1 cites·19 claims
- 2263US2024019567A1Server, operating method of the same, and systemSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2361US9577948B2Method and apparatus for connecting to server using trusted IP address of domainKIM BYOUNG HOON·Filed 2012·Granted Feb 21, 2017·1 cites·4 claims
- 2459US8399984B2Semiconductor packageKIM SEONG CHEOL·Filed 2009·Granted Mar 19, 2013·1 cites·18 claims
- 2558US7859102B2Multi-layer stacked wafer level semiconductor package moduleHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Dec 28, 2010·1 cites·13 claims
- 2656US9269670B2Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor packageSK HYNIX INC·Filed 2014·Granted Feb 23, 2016·0 cites·9 claims
- 2755US11636717B2Allophone inspection device and inspection method thereofHYUNDAI MOTOR CO LTD·Filed 2020·Granted Apr 25, 2023·0 cites·16 claims
- 2855US7333549B2Method and apparatus for estimating a signal sequence in a MIMO-OFDM mobile communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Feb 19, 2008·5 cites·36 claims
- 2955US7005791B2Flat panel for cathode-ray tubeSAMSUNG SDI CO LTD·Filed 2002·Granted Feb 28, 2006·4 cites·5 claims
- 3053US8681133B2Display driver integrated circuit which stores output mode of driving circuit control signal in non-volatile memory and method of outputting the driving circuit control signalBAE JONG-KON·Filed 2007·Granted Mar 25, 2014·0 cites·35 claims
- 3153US2012205802A1Printed circuit board and flip chip package using the same with improved bump joint reliabilityKIM SEONG CHEOL·Filed 2012·Application pending·0 cites
- 3252US8183689B2Printed circuit board and flip chip package using the same with improved bump joint reliabilityKIM SEONG CHEOL·Filed 2007·Granted May 22, 2012·0 cites·5 claims
- 3352US2009298229A1Flip chip package and method for manufacturing the sameKIM SEONG CHEOL·Filed 2009·Application pending·0 cites
- 3451US10381590B2Electrode laminate and organic light emitting device elementLG DISPLAY CO LTD·Filed 2014·Granted Aug 13, 2019·0 cites·26 claims
- 3551US9137691B2Method and apparatus for estimating long-term transfer rate of terminalSNU R&DB FOUNDATION·Filed 2013·Granted Sep 15, 2015·0 cites·20 claims
- 3651US2013078807A1Wafer level chip scale package having an enhanced heat exchange efficiency with an emf shield and a method for fabricating the sameSK HYNIX INC·Filed 2012·Application pending·0 cites
- 3750US8042020B2Data error correction circuit, integrated circuit for data error correction, and method of performing data error correctionSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 18, 2011·2 cites·19 claims
- 3850US2009184414A1Wafer level chip scale package having an enhanced heat exchange efficiency with an emf shield and a method for fabricating the samePARK CHANG JUN·Filed 2008·Application pending·0 cites
- 3949US10784706B2Wireless power transmitter and method for controlling the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 22, 2020·0 cites·22 claims
- 4049US8338921B2Wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield and a method for fabricating the samePARK CHANG JUN·Filed 2011·Granted Dec 25, 2012·0 cites·3 claims
- 4149US2008308949A1Flip chip package and method for manufacturing the sameKIM SEONG CHEOL·Filed 2007·Application pending·0 cites
- 4248US9029602B2Anti-microbial and anti-static surface treatment agent with quaternary ammonium salt as active ingredient and method for preventing static electricity in polymer fibers using sameKIM SEONG CHEOL·Filed 2011·Granted May 12, 2015·0 cites·1 claims
- 4346US2017115376A1Method for effectively estimating three-dimensional location by using trilateration in wireless network, and recording medium in which program is recorded for carrying out sameSNU R&DB FOUNDATION·Filed 2014·Application pending·0 cites
- 4445US2010217763A1Method for automatic clustering and method and apparatus for multipath clustering in wireless communication using the sameKOREA ELECTRONICS TELECOMM·Filed 2008·Application pending·0 cites
- 4541US12096237B2Method for predicting structure of indoor space using radio propagation channel analysis through deep learningSEOUL NAT UNIV R&DB FOUNDATION·Filed 2018·Granted Sep 17, 2024·0 cites·16 claims
- 4640US2013043739A1Apparatus for preventing corrosion of if connector in portable terminal and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
- 4739US12239806B2Peritoneal cavity-bladder connecting catheter for ascites drainageUNIV INJE IND ACAD COOP FOUND·Filed 2019·Granted Mar 4, 2025·0 cites·15 claims
- 4839US2012061842A1Stack package and method for manufacturing the sameKIM SEONG CHEOL·Filed 2011·Application pending·0 cites
- 4931US2012129341A1Method for fabricating via hole and through-silicon viaJO SEUNG HEE·Filed 2011·Application pending·0 cites
- 5030US5888056ADiaphragm pumpFiled 1997·Granted Mar 30, 1999·7 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →