Inventor · disambiguated record
Seon Goo Lee
Also filed as: LEE SEON G · LEE SEON GOO
46 granted patents·9 pending applications·3,506 citations·filing 1997–2015
99Inventor score
Files withSAMSUNG ELECTRO MECH29AMKOR TECHNOLOGY INC10LEE SEON GOO8SAMSUNG LED CO LTD5ANAM SEMICONDUCTOR INC2
Top patents by PatentIndex Score
55 records- 0199US8013352B2Chip coated light emitting diode package and manufacturing method thereofSAMSUNG LED CO LTD·Filed 2010·Granted Sep 6, 2011·479 cites·13 claims
- 0299US7790482B2Light emitting diode package with diffuser and method of manufacturing the sameSAMSUNG LED CO LTD·Filed 2009·Granted Sep 7, 2010·474 cites·3 claims
- 0399US7501656B2Light emitting diode package with diffuser and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2006·Granted Mar 10, 2009·486 cites·6 claims
- 0499US6303997B1Thin, stackable semiconductor packagesANAM SEMICONDUCTOR INC·Filed 1999·Granted Oct 16, 2001·528 cites·35 claims
- 0598US8324646B2Chip coated light emitting diode package and manufacturing method thereofLEE SEON GOO·Filed 2010·Granted Dec 4, 2012·479 cites·25 claims
- 0698US7208772B2High power light emitting diode packageSAMSUNG ELECTRO MECH·Filed 2005·Granted Apr 24, 2007·69 cites·29 claims
- 0797US7458703B2Light emitting diode package having dual lens structure for lateral light emissionSAMSUNG ELECTRO MECH·Filed 2006·Granted Dec 2, 2008·60 cites·12 claims
- 0896US7714342B2Chip coated light emitting diode package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2007·Granted May 11, 2010·41 cites·11 claims
- 0996US7683470B2LED packageSAMSUNG ELECTRO MECH·Filed 2007·Granted Mar 23, 2010·35 cites·2 claims
- 1096US6798049B1Semiconductor package and method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2000·Granted Sep 28, 2004·125 cites·30 claims
- 1194US8105854B2LED packageLEE SEON GOO·Filed 2009·Granted Jan 31, 2012·28 cites·5 claims
- 1293US7498610B2High power LED housing and fabrication method thereofSAMSUNG ELECTRO MECH·Filed 2006·Granted Mar 3, 2009·16 cites·9 claims
- 1393US7211900B2Thin semiconductor package including stacked diesAMKOR TECHNOLOGY INC·Filed 2005·Granted May 1, 2007·26 cites·20 claims
- 1493US6515356B1Semiconductor package and method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2000·Granted Feb 4, 2003·79 cites·12 claims
- 1592US7626250B2High power LED package and fabrication method thereofSAMSUNG ELECTRO MECH·Filed 2006·Granted Dec 1, 2009·19 cites·21 claims
- 1691US6982485B1Stacking structure for semiconductor chips and a semiconductor package using itAMKOR TECHNOLOGY INC·Filed 2002·Granted Jan 3, 2006·69 cites·19 claims
- 1790US7156538B2LED package for backlight unitSAMSUNG ELECTRO MECH·Filed 2004·Granted Jan 2, 2007·66 cites·5 claims
- 1889US7566912B2Light emitting diode packageSAMSUNG ELECTRO MECH·Filed 2007·Granted Jul 28, 2009·21 cites·17 claims
- 1989US7338823B2Side-emitting LED package and manufacturing method of the sameSAMSUNG ELECTRO MECH·Filed 2006·Granted Mar 4, 2008·16 cites·8 claims
- 2088US7833811B2Side-emitting LED package and method of manufacturing the sameSAMSUNG LED CO LTD·Filed 2008·Granted Nov 16, 2010·14 cites·4 claims
- 2187US7687292B2Light emitting diode package with metal reflective layer and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Granted Mar 30, 2010·12 cites·7 claims
- 2287USD512694SLight-emitting diodeSAMSUNG ELECTRO MECH·Filed 2004·Granted Dec 13, 2005·33 cites·1 claims
- 2387US6936922B1Semiconductor package structure reducing warpage and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2003·Granted Aug 30, 2005·49 cites·20 claims
- 2486US7462871B2Side-view light emitting diode having protective deviceSAMSUNG ELECTRO MECH·Filed 2006·Granted Dec 9, 2008·16 cites·10 claims
- 2583USD512029SLight-emitting diodeSAMSUNG ELECTRO MECH·Filed 2004·Granted Nov 29, 2005·27 cites·1 claims
- 2682US6717248B2Semiconductor package and method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2002·Granted Apr 6, 2004·27 cites·38 claims
- 2781US5986334ASemiconductor package having light, thin, simple and compact structureANAM SEMICONDUCTOR INC·Filed 1997·Granted Nov 16, 1999·65 cites·30 claims
- 2880US7663199B2High power light emitting diode package and fabrication method thereofSAMSUNG ELECTRO MECH·Filed 2006·Granted Feb 16, 2010·9 cites·43 claims
- 2979US6469258B1Circuit board for semiconductor packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Oct 22, 2002·35 cites·44 claims
- 3077US7875476B2High power LED package and fabrication method thereofSAMSUNG LED CO LTD·Filed 2009·Granted Jan 25, 2011·5 cites·10 claims
- 3177US7795052B2Chip coated light emitting diode package and manufacturing method thereofSAMSUNG LED CO LTD·Filed 2010·Granted Sep 14, 2010·3 cites·7 claims
- 3275USD568261SLight-emitting diodeSAMSUNG ELECTRO MECH·Filed 2007·Granted May 6, 2008·22 cites·1 claims
- 3374US8202746B2Method of manufacturing LED package for formation of molding memberLEE SEON GOO·Filed 2008·Granted Jun 19, 2012·7 cites·5 claims
- 3473US7678592B2LED housing and fabrication method thereofSAMSUNG ELECTRO MECH·Filed 2007·Granted Mar 16, 2010·4 cites·20 claims
- 3573US6995448B2Semiconductor package including passive elements and method of manufactureAMKOR TECHNOLOGY INC·Filed 2002·Granted Feb 7, 2006·33 cites·13 claims
- 3670US7190071B2Semiconductor package and method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2004·Granted Mar 13, 2007·13 cites·9 claims
- 3769USRE46851EHigh power light emitting diode packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 15, 2018·1 cites·42 claims
- 3869US7846752B2High power LED housing and fabrication method thereofSAMSUNG ELECTRO MECH·Filed 2008·Granted Dec 7, 2010·8 cites·14 claims
- 3968US7903410B2Package board and method for manufacturing thereofSAMSUNG ELECTRO MECH·Filed 2008·Granted Mar 8, 2011·4 cites·7 claims
- 4054USRE43200EHigh power light emitting diode packageLEE SEON GOO·Filed 2008·Granted Feb 21, 2012·0 cites·33 claims
- 4153USRE44811EHigh power light emitting diode packageLEE SEON GOO·Filed 2011·Granted Mar 18, 2014·0 cites·36 claims
- 4250US2005199884A1High power LED packageSAMSUNG ELECTRO MECH·Filed 2004·Application pending·0 cites
- 4350US2008128736A1Side-emitting LED package and manufacturing method of the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 4448US7560057B2Method for producing molding compound resin tablet for wavelength conversion, and method for manufacturing white light emitting diode by using the production methodSAMSUNG ELECTRO MECH·Filed 2006·Granted Jul 14, 2009·0 cites·14 claims
- 4547USRE45596EHigh power light emitting diode packageLEE SEON GOO·Filed 2011·Granted Jun 30, 2015·0 cites·30 claims
- 4647US2006180925A1LED housing and fabrication method thereofSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 4747US2006284207A1Light emitting diode package with metal reflective layer and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 4846US2006273337A1Side-emitting LED package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 4945US7157029B2Method for producing molding compound resin tablet for wavelength conversion, and method for manufacturing white light emitting diode by using the production methodSAMSUNG ELECTRO MECH·Filed 2004·Granted Jan 2, 2007·2 cites·16 claims
- 5044USRE40112ESemiconductor package and method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2004·Granted Feb 26, 2008·1 cites·35 claims
Showing the top 50 of 55 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Seon Goo Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →