Inventor · disambiguated record
Seung-Won Lim
Also filed as: IM SEUNGWON · LIM SEUNG-WON
20 granted patents·8 pending applications·317 citations·filing 2000–2013
95Inventor score
Top patents by PatentIndex Score
28 records- 0196US7675148B2Power module having stacked flip-chip and method of fabricating the power moduleFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2008·Granted Mar 9, 2010·42 cites·21 claims
- 0294US7706146B2Power system module and method of fabricating the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2007·Granted Apr 27, 2010·31 cites·18 claims
- 0391US7687903B2Power module and method of fabricating the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2008·Granted Mar 30, 2010·24 cites·21 claims
- 0491US6574107B2Stacked intelligent power module packageFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2001·Granted Jun 3, 2003·99 cites·18 claims
- 0590US8258622B2Power device package and semiconductor package mold for fabricating the sameLEE KEUN-HYUK·Filed 2008·Granted Sep 4, 2012·23 cites·25 claims
- 0686US8552541B2Power device packages having thermal electric modules using peltier effect and methods of fabricating the sameIM SEUNGWON·Filed 2011·Granted Oct 8, 2013·15 cites·20 claims
- 0783US7501700B2Semiconductor power module having an electrically insulating heat sink and method of manufacturing the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2006·Granted Mar 10, 2009·12 cites·9 claims
- 0881US7847395B2Package and package assembly of power deviceFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2007·Granted Dec 7, 2010·12 cites·16 claims
- 0978US7986531B2Power system module and method of fabricating the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2010·Granted Jul 26, 2011·4 cites·17 claims
- 1078US7786570B2Heat sink packageFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2009·Granted Aug 31, 2010·6 cites·7 claims
- 1174US8350369B2High power semiconductor packageFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2008·Granted Jan 8, 2013·7 cites·43 claims
- 1274US7863725B2Power device packages and methods of fabricating the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2008·Granted Jan 4, 2011·6 cites·16 claims
- 1374US7701048B2Power module for low thermal resistance and method of fabricating the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2007·Granted Apr 20, 2010·5 cites·21 claims
- 1472US8766419B2Power module having stacked flip-chip and method of fabricating the power moduleLIM SEUNG-WON·Filed 2009·Granted Jul 1, 2014·6 cites·9 claims
- 1570US8796831B2Complex semiconductor packages and methods of fabricating the sameYANG GWI-GYEON·Filed 2009·Granted Aug 5, 2014·4 cites·22 claims
- 1670US7449774B1Semiconductor power module having an electrically insulating heat sink and method of manufacturing the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2000·Granted Nov 11, 2008·17 cites·9 claims
- 1767US8604606B2Heat sink packageEOM JOO-YANG·Filed 2010·Granted Dec 10, 2013·2 cites·16 claims
- 1862US7951645B2Power module for low thermal resistance and method of fabricating the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2010·Granted May 31, 2011·1 cites·8 claims
- 1958US7714428B2High power semiconductor package and method of making the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2007·Granted May 11, 2010·1 cites·16 claims
- 2051US2014217572A1Heat Sink PackageFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2013·Application pending·0 cites
- 2151US2013207253A1Complex Semiconductor Packages and Methods of Fabricating the SameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2013·Application pending·0 cites
- 2247US7808103B2Leadless packageFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2009·Granted Oct 5, 2010·0 cites·18 claims
- 2346US2009127681A1Semiconductor package and method of fabricating the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2008·Application pending·0 cites
- 2445US2009243078A1Power Device Packages Having Thermal Electric Modules Using Peltier Effect and Methods of Fabricating the SameLIM SEUNG-WON·Filed 2009·Application pending·0 cites
- 2543US2010140786A1Semiconductor power module package having external bonding areaFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2009·Application pending·0 cites
- 2641US2011076804A1Power device packages and methods of fabricating the sameJONG MAN-KYO·Filed 2010·Application pending·0 cites
- 2740US2009243079A1Semiconductor device packageLIM SEUNG-WON·Filed 2009·Application pending·0 cites
- 2839US2009244848A1Power Device Substrates and Power Device Packages Including the SameLIM SEUNG-WON·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →