Inventor · disambiguated record
Sen Mao
Also filed as: MAO SEN
14 granted patents·3 pending applications·152 citations·filing 2001–2019
92Inventor score
Technology areasH10W
Top patents by PatentIndex Score
17 records- 0196US9589929B2Method for fabricating stack die packageVISHAY SILICONIX·Filed 2013·Granted Mar 7, 2017·28 cites·20 claims
- 0286US9966330B2Stack die packageVISHAY SILICONIX·Filed 2013·Granted May 8, 2018·8 cites·20 claims
- 0386US8471381B2Complete power management system implemented in a single surface mount packageOWYANG KING·Filed 2006·Granted Jun 25, 2013·13 cites·22 claims
- 0485US10546840B2Method for fabricating stack die packageVISHAY SILICONIX·Filed 2017·Granted Jan 28, 2020·4 cites·20 claims
- 0582US7394150B2Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleysSILICONIX INC·Filed 2004·Granted Jul 1, 2008·35 cites·17 claims
- 0682US7238551B2Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleysSILICONIX INC·Filed 2004·Granted Jul 3, 2007·37 cites·18 claims
- 0780US8586419B2Semiconductor packages including die and L-shaped lead and method of manufactureJAUNAY SERGE·Filed 2010·Granted Nov 19, 2013·9 cites·16 claims
- 0875US8928138B2Complete power management system implemented in a single surface mount packageOWYANG KING·Filed 2010·Granted Jan 6, 2015·3 cites·19 claims
- 0974US9997500B1Common-source packaging structureTAIWAN SEMICONDUCTOR CO LTD·Filed 2017·Granted Jun 12, 2018·2 cites·7 claims
- 1059US9093359B2Complete power management system implemented in a single surface mount packageOWYANG KING·Filed 2006·Granted Jul 28, 2015·1 cites·21 claims
- 1159US6744119B2Leadframe having slots in a die padSILICONIX TAIWAN LTD·Filed 2001·Granted Jun 1, 2004·11 cites·20 claims
- 1251US2015331438A1Complete power management system implemented in a single surface mount packageVISHAY SILICONIX·Filed 2015·Application pending·0 cites
- 1349US10056355B2Common-source packaging structureTAIWAN SEMICONDUCTOR CO LTD·Filed 2017·Granted Aug 21, 2018·0 cites·6 claims
- 1440US6414362B1Power semiconductor deviceSILICONX TAIWAN LTD·Filed 2001·Granted Jul 2, 2002·1 cites·1 claims
- 1539US2021082792A1Electrical device with terminal notches and method for manufacturing the sameTAIWAN SEMICONDUCTOR CO LTD·Filed 2019·Application pending·0 cites
- 1636US10090298B2Integrated packaging structureTAIWAN SEMICONDUCTOR CO LTD·Filed 2017·Granted Oct 2, 2018·0 cites·6 claims
- 1733US2001052641A1Power semiconductor deviceFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →