Inventor · disambiguated record
Seshasayee Varadarajan
Also filed as: VARADARAJAN SESHASAYEE
45 granted patents·10 pending applications·2,047 citations·filing 2001–2024
99Inventor score
Top patents by PatentIndex Score
55 records- 0199US9601693B1Method for encapsulating a chalcogenide materialLAM RES CORP·Filed 2015·Granted Mar 21, 2017·43 cites·19 claims
- 0298US11637037B2Method to create air gapsLAM RES CORP·Filed 2020·Granted Apr 25, 2023·12 cites·16 claims
- 0398US10347547B2Suppressing interfacial reactions by varying the wafer temperature throughout depositionLAM RES CORP·Filed 2016·Granted Jul 9, 2019·401 cites·20 claims
- 0498US9824884B1Method for depositing metals free ald silicon nitride films using halide-based precursorsLAM RES CORP·Filed 2016·Granted Nov 21, 2017·348 cites·16 claims
- 0598US7648899B1Interfacial layers for electromigration resistance improvement in damascene interconnectsNOVELLUS SYSTEMS INC·Filed 2008·Granted Jan 19, 2010·78 cites·27 claims
- 0698US6964792B1Methods and apparatus for controlling electrolyte flow for uniform platingNOVELLUS SYSTEMS INC·Filed 2001·Granted Nov 15, 2005·121 cites·58 claims
- 0797US12112980B2Method to create air gapsLAM RES CORP·Filed 2021·Granted Oct 8, 2024·4 cites·12 claims
- 0897US11970776B2Atomic layer deposition of metal filmsLAM RES CORP·Filed 2020·Granted Apr 30, 2024·9 cites·22 claims
- 0997US11549175B2Method of depositing tungsten and other metals in 3D NAND structuresLAM RES CORP·Filed 2019·Granted Jan 10, 2023·17 cites·22 claims
- 1097US11088019B2Method to create air gapsLAM RES CORP·Filed 2018·Granted Aug 10, 2021·17 cites·18 claims
- 1197US8377268B2Electroplating cup assemblyNOVELLUS SYSTEMS INC·Filed 2011·Granted Feb 19, 2013·19 cites·23 claims
- 1297US7985325B2Closed contact electroplating cup assemblyNOVELLUS SYSTEMS INC·Filed 2007·Granted Jul 26, 2011·36 cites·24 claims
- 1397US7935231B2Rapidly cleanable electroplating cup assemblyNOVELLUS SYSTEMS INC·Filed 2007·Granted May 3, 2011·36 cites·24 claims
- 1497US7858510B1Interfacial layers for electromigration resistance improvement in damascene interconnectsNOVELLUS SYSTEMS INC·Filed 2010·Granted Dec 28, 2010·50 cites·22 claims
- 1597US7854828B2Method and apparatus for electroplating including remotely positioned second cathodeNOVELLUS SYSTEMS INC·Filed 2006·Granted Dec 21, 2010·50 cites·20 claims
- 1697US6551487B1Methods and apparatus for controlled-angle wafer immersionNOVELLUS SYSTEMS INC·Filed 2001·Granted Apr 22, 2003·145 cites·16 claims
- 1796US8128791B1Control of electrolyte composition in a copper electroplating apparatusBUCKALEW BRYAN·Filed 2006·Granted Mar 6, 2012·39 cites·24 claims
- 1896US7906817B1High compressive stress carbon liners for MOS devicesNOVELLUS SYSTEMS INC·Filed 2008·Granted Mar 15, 2011·40 cites·8 claims
- 1995US12351914B2Deposition of films using molybdenum precursorsLAM RES CORP·Filed 2022·Granted Jul 8, 2025·2 cites·16 claims
- 2095US10378107B2Low volume showerhead with faceplate holes for improved flow uniformityLAM RES CORP·Filed 2015·Granted Aug 13, 2019·11 cites·26 claims
- 2195US9309604B2Method and apparatus for electroplatingNOVELLUS SYSTEMS INC·Filed 2013·Granted Apr 12, 2016·18 cites·20 claims
- 2295US8475644B2Method and apparatus for electroplatingMAYER STEVEN·Filed 2009·Granted Jul 2, 2013·36 cites·20 claims
- 2395US7686927B1Methods and apparatus for controlled-angle wafer positioningNOVELLUS SYSTEMS INC·Filed 2006·Granted Mar 30, 2010·26 cites·7 claims
- 2494US9045841B1Control of electrolyte composition in a copper electroplating apparatusBUCKALEW BRYAN·Filed 2012·Granted Jun 2, 2015·9 cites·19 claims
- 2594US8475636B2Method and apparatus for electroplatingMAYER STEVEN·Filed 2009·Granted Jul 2, 2013·30 cites·19 claims
- 2694US8217513B2Remote plasma processing of interface surfacesANTONELLI GEORGE ANDREW·Filed 2011·Granted Jul 10, 2012·24 cites·19 claims
- 2794US8084339B2Remote plasma processing of interface surfacesANTONELLI GEORGE ANDREW·Filed 2009·Granted Dec 27, 2011·29 cites·16 claims
- 2894US6821407B1Anode and anode chamber for copper electroplatingNOVELLUS SYSTEMS INC·Filed 2002·Granted Nov 23, 2004·97 cites·25 claims
- 2993US8398831B2Rapidly cleanable electroplating cup sealGHONGADI SHANTINATH·Filed 2011·Granted Mar 19, 2013·18 cites·27 claims
- 3093US8308931B2Method and apparatus for electroplatingREID JONATHAN·Filed 2008·Granted Nov 13, 2012·62 cites·34 claims
- 3193US7780867B1Edge bevel removal of copper from silicon wafersNOVELLUS SYSTEMS INC·Filed 2005·Granted Aug 24, 2010·45 cites·59 claims
- 3293US6586342B1Edge bevel removal of copper from silicon wafersNOVELLUS SYSTEMS INC·Filed 2001·Granted Jul 1, 2003·76 cites·27 claims
- 3390US7799684B1Two step process for uniform across wafer deposition and void free filling on ruthenium coated wafersNOVELLUS SYSTEMS INC·Filed 2007·Granted Sep 21, 2010·22 cites·40 claims
- 3489US10472730B2Electrolyte concentration control system for high rate electroplatingNOVELLUS SYSTEMS INC·Filed 2015·Granted Nov 12, 2019·2 cites·15 claims
- 3589US7456102B1Electroless copper fill processNOVELLUS SYSTEMS INC·Filed 2005·Granted Nov 25, 2008·15 cites·23 claims
- 3686US7998881B1Method for making high stress boron-doped carbon filmsNOVELLUS SYSTEMS INC·Filed 2008·Granted Aug 16, 2011·11 cites·17 claims
- 3786US7097410B1Methods and apparatus for controlled-angle wafer positioningNOVELLUS SYSTEMS INC·Filed 2003·Granted Aug 29, 2006·28 cites·10 claims
- 3884US8362571B1High compressive stress carbon liners for MOS devicesNOVELLUS SYSTEMS INC·Filed 2011·Granted Jan 29, 2013·5 cites·17 claims
- 3984US2024429091A1Method to create air gapsLAM RES CORP·Filed 2024·Application pending·0 cites
- 4083US9109295B2Electrolyte concentration control system for high rate electroplatingREID JONATHAN D·Filed 2009·Granted Aug 18, 2015·3 cites·19 claims
- 4183US7799671B1Interfacial layers for electromigration resistance improvement in damascene interconnectsNOVELLUS SYSTEMS INC·Filed 2009·Granted Sep 21, 2010·11 cites·21 claims
- 4281US9624578B2Method for RF compensation in plasma assisted atomic layer depositionLAM RES CORP·Filed 2014·Granted Apr 18, 2017·2 cites·13 claims
- 4377US2024271281A1Deposition of metal filmsLAM RES CORP·Filed 2024·Application pending·0 cites
- 4461US11075127B2Suppressing interfacial reactions by varying the wafer temperature throughout depositionLAM RES CORP·Filed 2019·Granted Jul 27, 2021·0 cites·20 claims
- 4557US9353444B2Two-step deposition with improved selectivityLAM RES CORP·Filed 2014·Granted May 31, 2016·0 cites·18 claims
- 4655US10020188B2Method for depositing ALD films using halide-based precursorsLAM RES CORP·Filed 2017·Granted Jul 10, 2018·0 cites·18 claims
- 4753US2024381790A1Techniques and apparatuses for processing chalcogenidesLAM RES CORP·Filed 2022·Application pending·0 cites
- 4848US2010317198A1Remote plasma processing of interface surfacesNOVELLUS SYSTEMS INC·Filed 2009·Application pending·0 cites
- 4948US2016273113A1Two-step deposition with improved selectivityLAM RES CORP·Filed 2016·Application pending·0 cites
- 5046US9029258B2Through silicon via metallizationLAM RES CORP·Filed 2013·Granted May 12, 2015·0 cites·34 claims
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →