Inventor · disambiguated record
Sheila F. Chopin
Also filed as: CHOPIN SHEILA · CHOPIN SHEILA F
17 granted patents·3 pending applications·196 citations·filing 2002–2023
92Inventor score
Files withFREESCALE SEMICONDUCTOR INC9CHOPIN SHEILA F5NXP USA INC3HIGGINS III LEO M1MATHEW VARUGHESE1
Top patents by PatentIndex Score
20 records- 0195US6998952B2Inductive device including bond wiresFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Feb 14, 2006·137 cites·26 claims
- 0293US9093383B1Encapsulant for a semiconductor deviceFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Jul 28, 2015·7 cites·20 claims
- 0389US8836110B2Heat spreader for use within a packaged semiconductor deviceCHOPIN SHEILA F·Filed 2012·Granted Sep 16, 2014·13 cites·21 claims
- 0486US9640466B1Packaged semiconductor device with a lead frame and method for formingFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted May 2, 2017·5 cites·20 claims
- 0583US8853867B2Encapsulant for a semiconductor deviceFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Oct 7, 2014·6 cites·20 claims
- 0677US12415305B2Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processesNXP USA INC·Filed 2023·Granted Sep 16, 2025·0 cites·14 claims
- 0770US8955388B2Mold compound compatibility test system and methods thereofMATHEW VARUGHESE·Filed 2012·Granted Feb 17, 2015·2 cites·20 claims
- 0870US7215014B2Solderable metal finish for integrated circuit package leads and method for formingFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted May 8, 2007·16 cites·32 claims
- 0966US11787097B2Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processesNXP USA INC·Filed 2021·Granted Oct 17, 2023·0 cites·6 claims
- 1058US7172927B2Warpage control of array packagingFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Feb 6, 2007·8 cites·13 claims
- 1152US10199339B2Semiconductor structure with sacrificial anode and method for formingFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Feb 5, 2019·0 cites·19 claims
- 1251US9412709B2Semiconductor structure with sacrificial anode and passivation layer and method for formingCHOPIN SHEILA F·Filed 2013·Granted Aug 9, 2016·0 cites·15 claims
- 1350US10217713B2Semiconductor device attached to an exposed padNXP USA INC·Filed 2016·Granted Feb 26, 2019·0 cites·16 claims
- 1449US2016071787A1Semiconductor device attached to an exposed padCHOPIN SHEILA F·Filed 2014·Application pending·0 cites
- 1548US9426884B2System and method for lead frame package degatingCHOPIN SHEILA F·Filed 2013·Granted Aug 23, 2016·0 cites·20 claims
- 1647US9111952B2Semiconductor deviceHIGGINS III LEO M·Filed 2013·Granted Aug 18, 2015·0 cites·20 claims
- 1747US7803662B2Warpage control using a package carrier assemblyFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Sep 28, 2010·0 cites·9 claims
- 1845US7015585B2Packaged integrated circuit having wire bonds and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Mar 21, 2006·2 cites·8 claims
- 1939US2012193737A1Mram device and method of assembling samePANG XINGSHOU·Filed 2011·Application pending·0 cites
- 2035US2007031996A1Packaged integrated circuit having a heat spreader and method thereforCHOPIN SHEILA F·Filed 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Sheila F. Chopin files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →