Inventor · disambiguated record
Shin-Hung Li
Also filed as: LI SHIN-HUNG
31 granted patents·22 pending applications·160 citations·filing 1998–2025
95Inventor score
Top patents by PatentIndex Score
53 records- 0195US12132106B2Semiconductor device and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Oct 29, 2024·2 cites·10 claims
- 0295US11404305B1Manufacturing method of isolation structures for semiconductor devicesUNITED MICROELECTRONICS CORP·Filed 2021·Granted Aug 2, 2022·4 cites·20 claims
- 0393US12002883B2Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jun 4, 2024·2 cites·7 claims
- 0493US10276710B1High voltage transistor and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Apr 30, 2019·12 cites·20 claims
- 0592US11682726B2High voltage semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jun 20, 2023·2 cites·10 claims
- 0692US9653460B1Semiconductor device and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 16, 2017·8 cites·10 claims
- 0790US11495681B2Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2020·Granted Nov 8, 2022·2 cites·16 claims
- 0888US9397084B1Structure of ESD protection circuits on BEOL layerUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jul 19, 2016·10 cites·18 claims
- 0986US6374512B1Method for reducing contamination of a substrate in a substrate processing systemAPPLIED MATERIALS INC·Filed 2000·Granted Apr 23, 2002·32 cites·8 claims
- 1085US6096135AMethod and apparatus for reducing contamination of a substrate in a substrate processing systemAPPLIED MATERIALS INC·Filed 1998·Granted Aug 1, 2000·64 cites·8 claims
- 1179US12490492B2Manufacturing method of semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2023·Granted Dec 2, 2025·0 cites·10 claims
- 1278US12279446B2Manufacturing method of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2024·Granted Apr 15, 2025·0 cites·8 claims
- 1378US12206020B2High voltage semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2023·Granted Jan 21, 2025·0 cites·9 claims
- 1477US12080794B2Manufacturing method of high voltage semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2023·Granted Sep 3, 2024·0 cites·9 claims
- 1575US2025015183A1Method of fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1675US2025220954A1Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 1775US2024347338A1Semiconductor structure and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1873US11640981B2Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2021·Granted May 2, 2023·0 cites·7 claims
- 1971US9972539B2Method of fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted May 15, 2018·1 cites·10 claims
- 2071US2024339534A1Manufacturing method of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2170US12057313B2Semiconductor structure and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Aug 6, 2024·0 cites·7 claims
- 2270US2025194178A1Method for forming a semiconductor high-voltage device having a buried gate dielectric layerUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 2367USD438129STape measureFiled 2000·Granted Feb 27, 2001·15 cites·1 claims
- 2466US10923485B2Semiconductor structure and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Feb 16, 2021·0 cites·10 claims
- 2565US12046671B2Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jul 23, 2024·0 cites·10 claims
- 2664US12261202B2Semiconductor high-voltage device having a buried gate dielectric layerUNITED MICROELECTRONICS CORP·Filed 2022·Granted Mar 25, 2025·0 cites·9 claims
- 2762US2025324715A1Transistor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2862US2025143154A1Semiconductor device with light-shielding layer and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2961US2025329643A1Semiconductor interconnect structure and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 3061US2025329585A1Interconnection structure and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 3161US2025323175A1Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 3260US2025351523A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 3360US2025266368A1Method of forming semiconductor device, zero-layer overlay mark and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 3459US2025133755A1Capacitor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 3559US2025072221A1Manufacturing method of semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 3658US10665597B2Semiconductor structure and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted May 26, 2020·0 cites·9 claims
- 3758US2025079168A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 3858US2025142841A1Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 3958US2025098209A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 4058US2025081573A1Middle voltage transistor and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 4157US10497805B2Semiconductor structure and manufacturing method of the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Dec 3, 2019·0 cites·10 claims
- 4257US2025072035A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 4357US2025102922A1Exposure method of semiconductor patternUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 4456US10084083B1Semiconductor structure and manufacturing method of the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Sep 25, 2018·0 cites·10 claims
- 4556US2025072091A1Transistor structureUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 4655US10535734B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Jan 14, 2020·0 cites·9 claims
- 4753US10396157B1Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Aug 27, 2019·0 cites·11 claims
- 4852US11515404B2Semiconductor structure comprising regions having an isolation trench with a stepped bottom surface therebetween and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Nov 29, 2022·0 cites·18 claims
- 4952US2024055361A1Method for forming alignment keys of semiconductor structure and semiconductor structure having alignment keysUNITED MICROELECTRONICS CORP·Filed 2022·Application pending·0 cites
- 5050US11217693B2Semiconductor transistor and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2019·Granted Jan 4, 2022·0 cites·17 claims
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →