Inventor · disambiguated record
Shih-Chin Lin
Also filed as: LIN SHIH-CHIN
42 granted patents·31 pending applications·192 citations·filing 1998–2025
97Inventor score
Files withMEDIATEK INC37IND TECH RES INST9UNITED MICROELECTRONICS CORP9PIXART IMAGING INC4LIN SHIH-CHIN3
Top patents by PatentIndex Score
73 records- 0196US9597752B2Composite solder ball, semiconductor package using the same, semiconductor device using the same and manufacturing method thereofMEDIATEK INC·Filed 2015·Granted Mar 21, 2017·7 cites·20 claims
- 0294US9023693B1Multi-mode thin film deposition apparatus and method of depositing a thin filmIND TECH RES INST·Filed 2013·Granted May 5, 2015·43 cites·17 claims
- 0393US9908203B2Composite solder ball, semiconductor package using the same, semiconductor device using the same and manufacturing method thereofMEDIATEK INC·Filed 2017·Granted Mar 6, 2018·4 cites·18 claims
- 0493US9761534B2Semiconductor package, semiconductor device using the same and manufacturing method thereofMEDIATEK INC·Filed 2016·Granted Sep 12, 2017·11 cites·19 claims
- 0586US9000581B2Semiconductor packageMEDIATEK INC·Filed 2013·Granted Apr 7, 2015·7 cites·19 claims
- 0686US6970374B2Low leakage current static random access memoryUNITED MICROELECTRONICS CORP·Filed 2004·Granted Nov 29, 2005·41 cites·17 claims
- 0784US12360537B2Robot capable of identifying tunnelsPIXART IMAGING INC·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 0879US11994871B2Moving robot without detection dead zonePIXART IMAGING INC·Filed 2023·Granted May 28, 2024·0 cites·18 claims
- 0979US8896135B2Encapsulation film, package structure utilizing the same, and method for forming the package structureWANG CHING-CHIUN·Filed 2011·Granted Nov 25, 2014·4 cites·5 claims
- 1077US9881902B2Semiconductor package, semiconductor device using the same and manufacturing method thereofMEDIATEK INC·Filed 2016·Granted Jan 30, 2018·2 cites·22 claims
- 1176US11675365B2Moving robot without detection dead zonePIXART IMAGING INC·Filed 2022·Granted Jun 13, 2023·0 cites·20 claims
- 1275US11353884B2Robot without detection dead zonePIXART IMAGING INC·Filed 2019·Granted Jun 7, 2022·1 cites·19 claims
- 1375US7034819B2Apparatus and method for generating an interleaved stereo imageSILICON INTEGRATED SYS CORP·Filed 2002·Granted Apr 25, 2006·15 cites·5 claims
- 1472US11983848B2AI frame engine for mobile edgeMEDIATEK INC·Filed 2023·Granted May 14, 2024·0 cites·8 claims
- 1571US10354974B2Structure and formation method of chip package structureMEDIATEK INC·Filed 2015·Granted Jul 16, 2019·2 cites·17 claims
- 1670US10186488B2Manufacturing method of semiconductor package and manufacturing method of semiconductor deviceMEDIATEK INC·Filed 2017·Granted Jan 22, 2019·1 cites·20 claims
- 1769US11854784B2Chip scale package structure and method of forming the sameMEDIATEK INC·Filed 2022·Granted Dec 26, 2023·0 cites·12 claims
- 1869US5995428ACircuit for burn-in operation on a wafer of memory devicesUNITED MICROELECTRONICS CORP·Filed 1998·Granted Nov 30, 1999·26 cites·11 claims
- 1967US2025164981A1Optimization method for vacuum plating processIND TECH RES INST·Filed 2024·Application pending·0 cites
- 2066US10027330B1Arbitrating circuitFARADAY TECH CORP·Filed 2018·Granted Jul 17, 2018·1 cites·10 claims
- 2163US9437577B2Package on package structure with pillar bump pins and related method thereofMEDIATEK INC·Filed 2014·Granted Sep 6, 2016·1 cites·10 claims
- 2261US11580621B2AI frame engine for mobile edgeMEDIATEK INC·Filed 2020·Granted Feb 14, 2023·0 cites·12 claims
- 2361US11320449B2Visualization device and observation method for flow fieldIND TECH RES INST·Filed 2019·Granted May 3, 2022·0 cites·20 claims
- 2461US10121222B2Bandwidth efficient method for generating an alpha hint bufferMEDIATEK INC·Filed 2016·Granted Nov 6, 2018·1 cites·18 claims
- 2561US2024297120A1Semiconductor package structureMEDIATEK INC·Filed 2024·Application pending·0 cites
- 2659US6243308B1Method for testing dynamic random access memory under wafer-level-burn-inUNITED MICROELECTRONICS CORP·Filed 2000·Granted Jun 5, 2001·8 cites·12 claims
- 2759US2020312732A1Chip scale package structure and method of forming the sameMEDIATEK INC·Filed 2020·Application pending·0 cites
- 2858US12118653B2Depth analyzer and shading rate controllerMEDIATEK INC·Filed 2022·Granted Oct 15, 2024·0 cites·20 claims
- 2958US7499517B2Shift register and shift register set using the sameTPO DISPLAYS CORP·Filed 2005·Granted Mar 3, 2009·4 cites·19 claims
- 3057US8456021B2Integrated circuit device having die bonded to the polymer side of a polymer substrateFENG CHIEN-TE·Filed 2010·Granted Jun 4, 2013·1 cites·21 claims
- 3157US2023307421A1Package-on-package having a thick logic dieMEDIATEK INC·Filed 2023·Application pending·0 cites
- 3257US2025342119A1Cache storage space managing method and electronic device using the cache storage space managing methodMEDIATEK INC·Filed 2025·Application pending·0 cites
- 3357US2023422525A1Semiconductor package having a thick logic dieMEDIATEK INC·Filed 2023·Application pending·0 cites
- 3456US9184107B2Semiconductor packageMEDIATEK INC·Filed 2014·Granted Nov 10, 2015·0 cites·11 claims
- 3556US2024386648A1Method for performing automatic activation control regarding variable rate shading, and associated apparatusMEDIATEK INC·Filed 2024·Application pending·0 cites
- 3656US2024274517A1Semiconductor package structure, method of forming the same and semiconductor package assembly having the sameMEDIATEK INC·Filed 2024·Application pending·0 cites
- 3756US2023282604A1Semiconductor package having a thick logic dieMEDIATEK INC·Filed 2023·Application pending·0 cites
- 3855US11869831B2Semiconductor package with improved board level reliabilityMEDIATEK INC·Filed 2021·Granted Jan 9, 2024·0 cites·16 claims
- 3955US10312222B2Semiconductor package and semiconductor device using the sameMEDIATEK INC·Filed 2017·Granted Jun 4, 2019·0 cites·20 claims
- 4055US2024321674A1Semiconductor deviceMEDIATEK INC·Filed 2023·Application pending·0 cites
- 4155US2024145350A1Semiconductor device and manufacturing method thereofMEDIATEK INC·Filed 2023·Application pending·0 cites
- 4254US12021068B2Semiconductor device with dummy thermal features on interposerMEDIATEK INC·Filed 2021·Granted Jun 25, 2024·0 cites·13 claims
- 4354US2025372547A1Semiconductor structureMEDIATEK INC·Filed 2025·Application pending·0 cites
- 4454US2023282625A1Semiconductor package having a thick logic dieMEDIATEK INC·Filed 2023·Application pending·0 cites
- 4553US2024386523A1Computing system and method for graphics processor boostingMEDIATEK INC·Filed 2024·Application pending·0 cites
- 4653US2023260866A1Semiconductor package structureMEDIATEK INC·Filed 2023·Application pending·0 cites
- 4752US9905562B2Semiconductor integrated circuit layout structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Feb 27, 2018·0 cites·6 claims
- 4852US9571079B2Integrated circuit and signal monitoring method thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Feb 14, 2017·0 cites·17 claims
- 4951US8711598B1Memory cell and memory cell array using the sameUNITED MICROELECTRONICS CORP·Filed 2012·Granted Apr 29, 2014·1 cites·16 claims
- 5051US2009137319A1Command Distribution Method, and Multimedia Apparatus and System Using the Same for Playing GamesMSTAR SEMICONDUCTOR INC·Filed 2008·Application pending·0 cites
Showing the top 50 of 73 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Shih-Chin Lin files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →