Inventor · disambiguated record
Shih-Haur Shen
Also filed as: SHEN SHIH-HAUR · SHEN SHIH-HAUR WALTERS
25 granted patents·12 pending applications·115 citations·filing 2008–2024
95Inventor score
Top patents by PatentIndex Score
37 records- 0196US9281253B2Determination of gain for eddy current sensorAPPLIED MATERIALS INC·Filed 2013·Granted Mar 8, 2016·28 cites·13 claims
- 0294US9005999B2Temperature control of chemical mechanical polishingXU KUN·Filed 2012·Granted Apr 14, 2015·22 cites·25 claims
- 0393US9636797B2Adjusting eddy current measurementsAPPLIED MATERIALS INC·Filed 2014·Granted May 2, 2017·11 cites·19 claims
- 0492US12320883B2Resistivity-based adjustment of thresholds for in-situ monitoringAPPLIED MATERIALS INC·Filed 2021·Granted Jun 3, 2025·1 cites·19 claims
- 0591US10994389B2Polishing apparatus using neural network for monitoringAPPLIED MATERIALS INC·Filed 2018·Granted May 4, 2021·11 cites·20 claims
- 0691US10391610B2Core configuration for in-situ electromagnetic induction monitoring systemAPPLIED MATERIALS INC·Filed 2017·Granted Aug 27, 2019·6 cites·20 claims
- 0789US10562148B2Real time profile control for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2017·Granted Feb 18, 2020·6 cites·20 claims
- 0888US9023667B2High sensitivity eddy current monitoring systemIRAVANI HASSAN G·Filed 2011·Granted May 5, 2015·11 cites·13 claims
- 0986US9205527B2In-situ monitoring system with monitoring of elongated regionAPPLIED MATERIALS INC·Filed 2013·Granted Dec 8, 2015·7 cites·19 claims
- 1084US2024025006A1Temperature and slurry flow rate control in cmpAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1183US11199605B2Resistivity-based adjustment of measurements from in-situ monitoringAPPLIED MATERIALS INC·Filed 2018·Granted Dec 14, 2021·1 cites·15 claims
- 1283US11079459B2Resistivity-based calibration of in-situ electromagnetic inductive monitoringAPPLIED MATERIALS INC·Filed 2018·Granted Aug 3, 2021·1 cites·18 claims
- 1379US12103135B2Core configuration for in-situ electromagnetic induction monitoring systemAPPLIED MATERIALS INC·Filed 2023·Granted Oct 1, 2024·0 cites·16 claims
- 1477US10350723B2Overpolishing based on electromagnetic inductive monitoring of trench depthAPPLIED MATERIALS INC·Filed 2017·Granted Jul 16, 2019·1 cites·20 claims
- 1576US11638982B2Core configuration for in-situ electromagnetic induction monitoring systemAPPLIED MATERIALS INC·Filed 2019·Granted May 2, 2023·1 cites·18 claims
- 1675US11826872B2Temperature and slurry flow rate control in CMPAPPLIED MATERIALS INC·Filed 2021·Granted Nov 28, 2023·0 cites·23 claims
- 1775US10556315B2Determination of gain for eddy current sensorAPPLIED MATERIALS INC·Filed 2019·Granted Feb 11, 2020·1 cites·19 claims
- 1875US2025108476A1Temperature control of chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1973US10589397B2Endpoint control of multiple substrate zones of varying thickness in chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2017·Granted Mar 17, 2020·1 cites·16 claims
- 2071US8694144B2Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishingDUBOUST ALAIN·Filed 2010·Granted Apr 8, 2014·2 cites·13 claims
- 2170US10207386B2Determination of gain for eddy current sensorAPPLIED MATERIALS INC·Filed 2016·Granted Feb 19, 2019·1 cites·16 claims
- 2269US12447577B2Polishing apparatus using neural network for monitoringAPPLIED MATERIALS INC·Filed 2021·Granted Oct 21, 2025·0 cites·16 claims
- 2369US11004708B2Core configuration with alternating posts for in-situ electromagnetic induction monitoring systemAPPLIED MATERIALS INC·Filed 2017·Granted May 11, 2021·1 cites·18 claims
- 2469US9472475B2Feedback control using detection of clearance and adjustment for uniform topographyAPPLIED MATERIALS INC·Filed 2013·Granted Oct 18, 2016·2 cites·19 claims
- 2569US2025114908A1High performance cmp multidisk apparatusAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2668US2025153303A1Substrate hot spot correction for a chemical mechanical polishing processsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2768US2024391056A1Chemical mechanical polish pad conditioner with multiple disksAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2867US2024139900A1Acoustic carrier head monitoringAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2959US10427272B2Endpoint detection with compensation for filteringAPPLIED MATERIALS INC·Filed 2017·Granted Oct 1, 2019·0 cites·20 claims
- 3055US2014222188A1Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 3154US12214468B2Temperature control of chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2018·Granted Feb 4, 2025·0 cites·11 claims
- 3247US2009057264A1High throughput low topography copper cmp processAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 3346US2009061743A1Method of soft pad preparation to reduce removal rate ramp-up effect and to stabilize defect rateJEW STEPHEN·Filed 2008·Application pending·0 cites
- 3445US9275917B2Determination of gain for eddy current sensorAPPLIED MATERIALS INC·Filed 2013·Granted Mar 1, 2016·0 cites·16 claims
- 3543US2014030956A1Control of polishing of multiple substrates on the same platen in chemical mechanical polishingZHANG JIMIN·Filed 2012·Application pending·0 cites
- 3636US2012276662A1Eddy current monitoring of metal featuresIRAVANI HASSAN G·Filed 2011·Application pending·0 cites
- 3736US2012276817A1Eddy current monitoring of metal residue or metal pillarsIRAVANI HASSAN G·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →