Inventor · disambiguated record
Soichi Homma
Also filed as: HOMMA SOICHI
26 granted patents·14 pending applications·226 citations·filing 2000–2023
94Inventor score
Top patents by PatentIndex Score
40 records- 0196US6798050B1Semiconductor device having semiconductor element with copper pad mounted on wiring substrate and method for fabricating the sameTOSHIBA KK·Filed 2000·Granted Sep 28, 2004·133 cites·6 claims
- 0288US11502057B2Semiconductor device and manufacturing method thereofKIOXIA CORP·Filed 2020·Granted Nov 15, 2022·2 cites·18 claims
- 0388US6569752B1Semiconductor element and fabricating method thereofTOSHIBA KK·Filed 2000·Granted May 27, 2003·56 cites·46 claims
- 0487US11302675B2Semiconductor device and method for manufacturing the sameKIOXIA CORP·Filed 2020·Granted Apr 12, 2022·2 cites·8 claims
- 0583US7141878B2Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2005·Granted Nov 28, 2006·11 cites·11 claims
- 0682US7985663B2Method for manufacturing a semiconductor deviceTOSHIBA KK·Filed 2009·Granted Jul 26, 2011·8 cites·20 claims
- 0779US9349694B2Method of manufacturing a semiconductor deviceTOSHIBA KK·Filed 2014·Granted May 24, 2016·5 cites·5 claims
- 0874US10600773B2Semiconductor device manufacturing methodTOSHIBA MEMORY CORP·Filed 2017·Granted Mar 24, 2020·2 cites·13 claims
- 0968US12119323B2Semiconductor device and method of manufacturing semiconductor deviceKIOXIA CORP·Filed 2022·Granted Oct 15, 2024·0 cites·20 claims
- 1068US11705436B2Semiconductor device and method for manufacturing the sameKIOXIA CORP·Filed 2022·Granted Jul 18, 2023·0 cites·15 claims
- 1167US10854576B2Semiconductor device and manufacturing method thereofTOSHIBA MEMORY CORP·Filed 2017·Granted Dec 1, 2020·1 cites·13 claims
- 1267US9824905B2Semiconductor manufacturing device and semiconductor manufacturing methodTOSHIBA MEMORY CORP·Filed 2014·Granted Nov 21, 2017·0 cites·20 claims
- 1367US2023307422A1Semiconductor device and manufacturing method of the sameKIOXIA CORP·Filed 2023·Application pending·0 cites
- 1466US9385090B2Semiconductor device and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2014·Granted Jul 5, 2016·2 cites·11 claims
- 1565US11476230B2Semiconductor device and method of manufacturing semiconductor deviceKIOXIA CORP·Filed 2021·Granted Oct 18, 2022·0 cites·5 claims
- 1663US9881876B2Semiconductor device having conductive shield layerTOSHIBA MEMORY CORP·Filed 2016·Granted Jan 30, 2018·1 cites·18 claims
- 1761US10903200B2Semiconductor device manufacturing methodTOSHIBA MEMORY CORP·Filed 2020·Granted Jan 26, 2021·0 cites·15 claims
- 1858US2021398946A1Semiconductor device and manufacturing method of the sameKIOXIA CORP·Filed 2021·Application pending·0 cites
- 1957US2024186262A1Manufacturing method of semiconductor device and semiconductor manufacturing apparatusKIOXIA CORP·Filed 2023·Application pending·0 cites
- 2052USRE42158ESemiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2008·Granted Feb 22, 2011·0 cites·37 claims
- 2151US11929332B2Semiconductor device and manufacturing method thereofKIOXIA CORP·Filed 2021·Granted Mar 12, 2024·0 cites·20 claims
- 2249US7214561B2Packaging assembly and method of assembling the sameTOSHIBA KK·Filed 2004·Granted May 8, 2007·3 cites·6 claims
- 2349US2022199580A1Semiconductor device and manufacturing method thereofKIOXIA CORP·Filed 2021·Application pending·0 cites
- 2446US10943844B2Semiconductor device including multiple chipsTOSHIBA MEMORY CORP·Filed 2019·Granted Mar 9, 2021·0 cites·13 claims
- 2546US9458535B2Semiconductor manufacturing device and semiconductor manufacturing methodTOSHIBA KK·Filed 2014·Granted Oct 4, 2016·0 cites·18 claims
- 2646US2021082856A1Semiconductor device and manufacturing method thereofKIOXIA CORP·Filed 2020·Application pending·0 cites
- 2745US10312197B2Method of manufacturing semiconductor device and semiconductor deviceTOSHIBA MEMORY CORP·Filed 2014·Granted Jun 4, 2019·0 cites·19 claims
- 2844US9236329B2Semiconductor memory cardTOSHIBA KK·Filed 2013·Granted Jan 12, 2016·0 cites·9 claims
- 2943US10354977B2Semiconductor device and manufacturing method thereofTOSHIBA MEMORY CORP·Filed 2017·Granted Jul 16, 2019·0 cites·17 claims
- 3043US2015170988A1Method of manufacturing semiconductor apparatusTOSHIBA KK·Filed 2014·Application pending·0 cites
- 3142US2010087033A1Method and apparatus for manufacturing semiconductor deviceTOSHIBA KK·Filed 2009·Application pending·0 cites
- 3240US2004238955A1Semiconductor device and method of fabricating the sameTOSHIBA KK·Filed 2004·Application pending·0 cites
- 3339US2004253803A1Packaging assembly and method of assembling the sameFiled 2003·Application pending·0 cites
- 3437US2012077313A1Semiconductor device manufacturing methodHOMMA SOICHI·Filed 2011·Application pending·0 cites
- 3537US2005266668A1Semiconductor device and method of manufacturing the sameSAWADA KANAKO·Filed 2005·Application pending·0 cites
- 3636US9960143B2Method for manufacturing electronic component and manufacturing apparatus of electronic componentTOSHIBA MEMORY CORP·Filed 2016·Granted May 1, 2018·0 cites·20 claims
- 3736US9646908B2Method for manufacturing semiconductor device and semiconductor deviceTOSHIBA KK·Filed 2016·Granted May 9, 2017·0 cites·7 claims
- 3836US2004222522A1Semiconductor device and manufacturing method of the sameFiled 2004·Application pending·0 cites
- 3936US2011053320A1Method of fabricating a semiconductor deviceTOSHIBA KK·Filed 2010·Application pending·0 cites
- 4035US2011233786A1Semiconductor device and method for manufacturing the sameHOMMA SOICHI·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Soichi Homma files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →