Inventor · disambiguated record
Stan Tsai
Also filed as: TSAI STAN · TSAI STAN D
81 granted patents·53 pending applications·1,990 citations·filing 1999–2020
99Inventor score
Top patents by PatentIndex Score
134 records- 0198US9812365B1Methods of cutting gate structures on transistor devicesGLOBALFOUNDRIES INC·Filed 2016·Granted Nov 7, 2017·26 cites·18 claims
- 0297US6537144B1Method and apparatus for enhanced CMP using metals having reductive propertiesAPPLIED MATERIALS INC·Filed 2000·Granted Mar 25, 2003·145 cites·32 claims
- 0397US6379223B1Method and apparatus for electrochemical-mechanical planarizationAPPLIED MATERIALS INC·Filed 1999·Granted Apr 30, 2002·230 cites·5 claims
- 0496US7422516B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2007·Granted Sep 9, 2008·42 cites·18 claims
- 0596US7278911B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Oct 9, 2007·33 cites·18 claims
- 0696US6739951B2Method and apparatus for electrochemical-mechanical planarizationAPPLIED MATERIALS INC·Filed 2002·Granted May 25, 2004·83 cites·26 claims
- 0796US6524167B1Method and composition for the selective removal of residual materials and barrier materials during substrate planarizationAPPLIED MATERIALS INC·Filed 2000·Granted Feb 25, 2003·72 cites·20 claims
- 0895US9138860B2Closed-loop control for improved polishing pad profilesDHANDAPANI SIVAKUMAR·Filed 2011·Granted Sep 22, 2015·23 cites·20 claims
- 0995US8221193B2Closed loop control of pad profile based on metrology feedbackCHANG SHOU-SUNG·Filed 2008·Granted Jul 17, 2012·29 cites·20 claims
- 1095US6962524B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Granted Nov 8, 2005·80 cites·32 claims
- 1195US6541384B1Method of initiating cooper CMP processAPPLIED MATERIALS INC·Filed 2000·Granted Apr 1, 2003·54 cites·13 claims
- 1294US9923080B1Gate height control and ILD protectionIBM·Filed 2017·Granted Mar 20, 2018·8 cites·20 claims
- 1394US6561873B2Method and apparatus for enhanced CMP using metals having reductive propertiesAPPLIED MATERIALS INC·Filed 2002·Granted May 13, 2003·66 cites·54 claims
- 1494US6309276B1Endpoint monitoring with polishing rate changeAPPLIED MATERIALS INC·Filed 2000·Granted Oct 30, 2001·85 cites·19 claims
- 1593US10134633B1Self-aligned contact with CMP stop layerGLOBALFOUNDRIES INC·Filed 2017·Granted Nov 20, 2018·8 cites·18 claims
- 1693US7285036B2Pad assembly for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Granted Oct 23, 2007·18 cites·20 claims
- 1793US6299741B1Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatusAPPLIED MATERIALS INC·Filed 1999·Granted Oct 9, 2001·110 cites·10 claims
- 1892US6863797B2Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMPAPPLIED MATERIALS INC·Filed 2002·Granted Mar 8, 2005·45 cites·41 claims
- 1991US7390744B2Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2005·Granted Jun 24, 2008·17 cites·14 claims
- 2091US7323416B2Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2005·Granted Jan 29, 2008·20 cites·20 claims
- 2191US6991528B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Granted Jan 31, 2006·45 cites·27 claims
- 2291US6709316B1Method and apparatus for two-step barrier layer polishingAPPLIED MATERIALS INC·Filed 2000·Granted Mar 23, 2004·64 cites·55 claims
- 2390US7137868B2Pad assembly for electrochemical mechanical processingAPPLIED MATERIALS INC·Filed 2006·Granted Nov 21, 2006·12 cites·32 claims
- 2490US6988942B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2004·Granted Jan 24, 2006·41 cites·18 claims
- 2589US6863794B2Method and apparatus for forming metal layersAPPLIED MATERIALS INC·Filed 2001·Granted Mar 8, 2005·18 cites·10 claims
- 2689US6638143B2Ion exchange materials for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2000·Granted Oct 28, 2003·41 cites·18 claims
- 2788US7207878B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Apr 24, 2007·11 cites·19 claims
- 2888US6669538B2Pad cleaning for a CMP systemAPPLIED MATERIALS INC·Filed 2000·Granted Dec 30, 2003·32 cites·7 claims
- 2987US7084064B2Full sequence metal and barrier layer electrochemical mechanical processingAPPLIED MATERIALS INC·Filed 2004·Granted Aug 1, 2006·14 cites·29 claims
- 3087US7029365B2Pad assembly for electrochemical mechanical processingAPPLIED MATERIALS INC·Filed 2003·Granted Apr 18, 2006·29 cites·31 claims
- 3187US6506097B1Optical monitoring in a two-step chemical mechanical polishing processAPPLIED MATERIALS INC·Filed 2001·Granted Jan 14, 2003·36 cites·20 claims
- 3286US7066800B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2001·Granted Jun 27, 2006·31 cites·67 claims
- 3386US6653242B1Solution to metal re-deposition during substrate planarizationAPPLIED MATERIALS INC·Filed 2000·Granted Nov 25, 2003·33 cites·22 claims
- 3485US6613200B2Electro-chemical plating with reduced thickness and integration with chemical mechanical polisher into a single platformAPPLIED MATERIALS INC·Filed 2001·Granted Sep 2, 2003·33 cites·31 claims
- 3584US9865543B1Structure and method for inhibiting cobalt diffusionGLOBALFOUNDRIES INC·Filed 2017·Granted Jan 9, 2018·4 cites·12 claims
- 3684US8096852B2In-situ performance prediction of pad conditioning disk by closed loop torque monitoringDESHPANDE SAMEER·Filed 2008·Granted Jan 17, 2012·14 cites·28 claims
- 3783US7582564B2Process and composition for conductive material removal by electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Sep 1, 2009·9 cites·20 claims
- 3882US7210988B2Method and apparatus for reduced wear polishing pad conditioningAPPLIED MATERIALS INC·Filed 2005·Granted May 1, 2007·9 cites·35 claims
- 3982US7137879B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Granted Nov 21, 2006·7 cites·20 claims
- 4081US7160432B2Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2003·Granted Jan 9, 2007·21 cites·34 claims
- 4181US7104869B2Barrier removal at low polish pressureAPPLIED MATERIALS INC·Filed 2002·Granted Sep 12, 2006·26 cites·24 claims
- 4281US6572453B1Multi-fluid polishing processAPPLIED MATERIALS INC·Filed 2000·Granted Jun 3, 2003·25 cites·20 claims
- 4380US7022608B2Method and composition for the removal of residual materials during substrate planarizationAPPLIED MATERIALS INC·Filed 2003·Granted Apr 4, 2006·10 cites·35 claims
- 4480US6821881B2Method for chemical mechanical polishing of semiconductor substratesAPPLIED MATERIALS INC·Filed 2002·Granted Nov 23, 2004·17 cites·6 claims
- 4579US7569134B2Contacts for electrochemical processingAPPLIED MATERIALS INC·Filed 2006·Granted Aug 4, 2009·5 cites·7 claims
- 4679US7344431B2Pad assembly for electrochemical mechanical processingAPPLIED MATERIALS INC·Filed 2006·Granted Mar 18, 2008·5 cites·21 claims
- 4779US6869498B1Chemical mechanical polishing with shear force measurementAPPLIED MATERIALS INC·Filed 2003·Granted Mar 22, 2005·18 cites·16 claims
- 4879US6858540B2Selective removal of tantalum-containing barrier layer during metal CMPAPPLIED MATERIALS INC·Filed 2002·Granted Feb 22, 2005·21 cites·34 claims
- 4978US7128825B2Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2003·Granted Oct 31, 2006·20 cites·29 claims
- 5078US7077721B2Pad assembly for electrochemical mechanical processingAPPLIED MATERIALS INC·Filed 2003·Granted Jul 18, 2006·17 cites·31 claims
Showing the top 50 of 134 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →