Inventor · disambiguated record
Tae Hong Ha
Also filed as: HA TAE HONG
36 granted patents·12 pending applications·119 citations·filing 1992–2024
96Inventor score
Top patents by PatentIndex Score
48 records- 0193US12211743B2Method of forming a metal liner for interconnect structuresAPPLIED MATERIALS INC·Filed 2021·Granted Jan 28, 2025·3 cites·17 claims
- 0292US11764157B2Ruthenium liner and cap for back-end-of-line applicationsAPPLIED MATERIALS INC·Filed 2021·Granted Sep 19, 2023·2 cites·6 claims
- 0390US9677172B2Methods for forming a cobalt-ruthenium liner layer for interconnect structuresAPPLIED MATERIALS INC·Filed 2015·Granted Jun 13, 2017·8 cites·11 claims
- 0489US11562909B2Directional selective junction clean with field polymer protectionsAPPLIED MATERIALS INC·Filed 2020·Granted Jan 24, 2023·2 cites·8 claims
- 0585US11270911B2Doping of metal barrier layersAPPLIED MATERIALS INC·Filed 2020·Granted Mar 8, 2022·2 cites·20 claims
- 0685US10157787B2Method and apparatus for depositing cobalt in a featureAPPLIED MATERIALS INC·Filed 2016·Granted Dec 18, 2018·4 cites·5 claims
- 0781US7311295B2Cylinder apparatus for hydraulic lift jack with transmissionHA TAE-HONG·Filed 2005·Granted Dec 25, 2007·11 cites·5 claims
- 0880US11410881B2Impurity removal in doped ALD tantalum nitrideAPPLIED MATERIALS INC·Filed 2020·Granted Aug 9, 2022·1 cites·20 claims
- 0980US10002834B2Method and apparatus for protecting metal interconnect from halogen based precursorsAPPLIED MATERIALS INC·Filed 2015·Granted Jun 19, 2018·3 cites·20 claims
- 1080US8043922B2Method of fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Oct 25, 2011·7 cites·13 claims
- 1178US9938622B2Method to deposit CVD rutheniumAPPLIED MATERIALS INC·Filed 2016·Granted Apr 10, 2018·2 cites·20 claims
- 1277US8476162B2Methods of forming layers on substratesHA TAE HONG·Filed 2011·Granted Jul 2, 2013·4 cites·20 claims
- 1374US2025112090A1Method Of Forming A Metal Liner For Interconnect StructuresAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1472US2024183028A1Methods and apparatus for precleaning and treating wafer surfacesAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1571US12243774B2Impurity removal in doped ALD tantalum nitrideAPPLIED MATERIALS INC·Filed 2022·Granted Mar 4, 2025·0 cites·20 claims
- 1670US2024038859A1Metal cap for contact resistance reductionAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1769US11784127B2Ruthenium liner and cap for back-end-of-lineAPPLIED MATERIALS INC·Filed 2022·Granted Oct 10, 2023·0 cites·13 claims
- 1867US12463052B2Directional selective junction clean with field polymer protectionsAPPLIED MATERIALS INC·Filed 2022·Granted Nov 4, 2025·0 cites·8 claims
- 1966US11948836B2Deposition of metal films with tungsten linerAPPLIED MATERIALS INC·Filed 2021·Granted Apr 2, 2024·0 cites·18 claims
- 2065US12347695B2Methods for controlling contact resistance in cobalt-titanium structuresAPPLIED MATERIALS INC·Filed 2022·Granted Jul 1, 2025·0 cites·13 claims
- 2159US12157943B2Methods of selective depositionAPPLIED MATERIALS INC·Filed 2020·Granted Dec 3, 2024·0 cites·13 claims
- 2259US11939666B2Methods and apparatus for precleaning and treating wafer surfacesAPPLIED MATERIALS INC·Filed 2020·Granted Mar 26, 2024·0 cites·15 claims
- 2359US2022231137A1Metal cap for contact resistance reductionAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 2458US11672132B2Variable resistance memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 6, 2023·0 cites·20 claims
- 2558US11171046B2Methods for forming cobalt and ruthenium capping layers for interconnect structuresAPPLIED MATERIALS INC·Filed 2020·Granted Nov 9, 2021·0 cites·16 claims
- 2657US11171045B2Deposition of metal films with tungsten linerAPPLIED MATERIALS INC·Filed 2019·Granted Nov 9, 2021·0 cites·9 claims
- 2756US11424132B2Methods and apparatus for controlling contact resistance in cobalt-titanium structuresAPPLIED MATERIALS INC·Filed 2019·Granted Aug 23, 2022·0 cites·13 claims
- 2856US10714388B2Method and apparatus for depositing cobalt in a featureAPPLIED MATERIALS INC·Filed 2018·Granted Jul 14, 2020·0 cites·13 claims
- 2955US7100897B2Hydraulic jackHA TAE-HONG·Filed 2002·Granted Sep 5, 2006·5 cites·19 claims
- 3055US5172462ASpring compression deviceHA TAE HONG·Filed 1992·Granted Dec 22, 1992·22 cites·7 claims
- 3151US7723194B2Semiconductor device having silicide layers and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted May 25, 2010·0 cites·8 claims
- 3251US6149144AMovable work benchFiled 1999·Granted Nov 21, 2000·23 cites·8 claims
- 3351US2014134351A1Method to deposit cvd rutheniumAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 3449US11527437B2Methods and apparatus for intermixing layer for enhanced metal reflowAPPLIED MATERIALS INC·Filed 2020·Granted Dec 13, 2022·0 cites·10 claims
- 3549US11417568B2Methods for selective deposition of tungsten atop a dielectric layer for bottom up gapfillAPPLIED MATERIALS INC·Filed 2020·Granted Aug 16, 2022·0 cites·20 claims
- 3649US5907894ASpring compression device for shock absorber of motor carFiled 1997·Granted Jun 1, 1999·19 cites·8 claims
- 3749US2007022953A1Source gas-supplying unit and chemical vapor deposition apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 3848US11587873B2Binary metal liner layersAPPLIED MATERIALS INC·Filed 2020·Granted Feb 21, 2023·0 cites·16 claims
- 3948US10892186B2Integration of ALD copper with high temperature PVD copper deposition for BEOL interconnectAPPLIED MATERIALS INC·Filed 2018·Granted Jan 12, 2021·0 cites·13 claims
- 4046US2022037204A1Methods and apparatus for forming stabilization layersAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 4145US7439593B2Semiconductor device having silicide formed with blocking insulation layerSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Oct 21, 2008·1 cites·13 claims
- 4245US2010068881A1Method of forming metallization in a semiconductor device using selective plasma treatmentKANG JOO-HO·Filed 2009·Application pending·0 cites
- 4343US2008073717A1Semiconductor devices having substrate plug and methods of forming the sameHA TAE-HONG·Filed 2007·Application pending·0 cites
- 4440US10014179B2Methods for forming cobalt-copper selective fill for an interconnectAPPLIED MATERIALS INC·Filed 2016·Granted Jul 3, 2018·0 cites·22 claims
- 4540US2020144056A1Method of forming a cobalt layer on a substrateAPPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
- 4636US2011315319A1Pre-clean chamber with reduced ion currentFORSTER JOHN C·Filed 2011·Application pending·0 cites
- 4735US2019348369A1Method and apparatus for protecting metal interconnect from halogen based precursorsNAIK MEHUL B·Filed 2018·Application pending·0 cites
- 4828US10633056B2Bicycle with automatic transmissionHA MIN SOO·Filed 2018·Granted Apr 28, 2020·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →