Inventor · disambiguated record
Takeo Hanashima
Also filed as: HANASHIMA TAKEO
29 granted patents·7 pending applications·519 citations·filing 2007–2025
95Inventor score
Top patents by PatentIndex Score
36 records- 0196US8501599B2Substrate processing apparatus and substrate processing methodUENO MASAAKI·Filed 2007·Granted Aug 6, 2013·470 cites·19 claims
- 0291US11784044B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Oct 10, 2023·1 cites·21 claims
- 0391US9536734B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Jan 3, 2017·7 cites·15 claims
- 0490US9349586B2Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted May 24, 2016·8 cites·18 claims
- 0587US10032626B2Method of manufacturing semiconductor device by forming a film on a substrate, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Jul 24, 2018·9 cites·15 claims
- 0684US2025349534A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0783US10808318B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Oct 20, 2020·3 cites·10 claims
- 0883US9728400B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Aug 8, 2017·3 cites·15 claims
- 0982US10640872B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2018·Granted May 5, 2020·2 cites·12 claims
- 1081US12437987B2Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Granted Oct 7, 2025·0 cites·22 claims
- 1180US12400855B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Aug 26, 2025·0 cites·23 claims
- 1280US11542601B2Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2018·Granted Jan 3, 2023·2 cites·17 claims
- 1379US11753716B2Method of processing substrate, substrate processing apparatus, recording medium, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2020·Granted Sep 12, 2023·1 cites·14 claims
- 1476US12065741B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Aug 20, 2024·0 cites·20 claims
- 1576US7795143B2Substrate processing apparatus and manufacturing method of semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2007·Granted Sep 14, 2010·6 cites·12 claims
- 1676US2025290200A1Substrate processing method, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1775US11952664B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Apr 9, 2024·0 cites·17 claims
- 1875US8507296B2Substrate processing method and film forming methodUENO MASAAKI·Filed 2009·Granted Aug 13, 2013·4 cites·16 claims
- 1970US10388512B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Aug 20, 2019·1 cites·8 claims
- 2069US9831082B2Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Nov 28, 2017·1 cites·16 claims
- 2168US11923188B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Mar 5, 2024·0 cites·20 claims
- 2267US11365482B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2020·Granted Jun 21, 2022·0 cites·11 claims
- 2367US9673043B2Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Jun 6, 2017·1 cites·13 claims
- 2466US12351908B2Substrate processing method, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jul 8, 2025·0 cites·20 claims
- 2566US2025115993A1Substrate processing apparatus, cleaning method, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2662US2025003071A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2753US12053805B2Method of cleaning member in process container, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Aug 6, 2024·0 cites·21 claims
- 2853US2019311898A1Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Application pending·0 cites
- 2952US2022298628A1Nozzle Cleaning Method, Substrate Processing Method, Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Non-transitory Computer-readable Recording MediumKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 3050US12040179B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Jul 16, 2024·0 cites·19 claims
- 3147US9514935B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and programHITACHI INT ELECTRIC INC·Filed 2013·Granted Dec 6, 2016·0 cites·7 claims
- 3246US9530641B2Method for manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2013·Granted Dec 27, 2016·0 cites·18 claims
- 3344US8367530B2Substrate processing apparatus and manufacturing method of semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2010·Granted Feb 5, 2013·0 cites·12 claims
- 3441US11387097B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Jul 12, 2022·0 cites·14 claims
- 3538US11814725B2Method of cleaning, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Nov 14, 2023·0 cites·20 claims
- 3636US2011104879A1Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →