Inventor · disambiguated record
Takaaki Matsuoka
Also filed as: MATSUOKA TAKAAKI
32 granted patents·27 pending applications·180 citations·filing 2000–2019
96Inventor score
Files withTOKYO ELECTRON LTD18OHMI TADAHIRO10UNIV TOHOKU7UNIV TOHOKU NAT UNIV CORP6MATSUOKA TAKAAKI5
Top patents by PatentIndex Score
59 records- 0197US8716114B2Semiconductor device manufacturing method and semiconductor deviceTOKYO ELECTRON LTD·Filed 2013·Granted May 6, 2014·40 cites·5 claims
- 0293US8399862B2Ion implanting apparatus and ion implanting methodOHMI TADAHIRO·Filed 2007·Granted Mar 19, 2013·20 cites·19 claims
- 0389US6285102B1Drive mechanism having a gas bearing operable under a negative pressure environmentTOKYO ELECTRON LTD·Filed 2000·Granted Sep 4, 2001·48 cites·24 claims
- 0483US10412323B2High-temperature object observation deviceIHI CORP·Filed 2018·Granted Sep 10, 2019·2 cites·20 claims
- 0582US7803705B2Manufacturing method of semiconductor device and film deposition systemTOKYO ELECTRON LTD·Filed 2005·Granted Sep 28, 2010·8 cites·8 claims
- 0680US8535494B2Rotary magnet sputtering apparatusOHMI TADAHIRO·Filed 2009·Granted Sep 17, 2013·5 cites·6 claims
- 0778US7313931B2Method and device for heat treatmentTOKYO ELECTRON LTD·Filed 2005·Granted Jan 1, 2008·5 cites·9 claims
- 0877US8915999B2Shower plate sintered integrally with gas release hole member and method for manufacturing the sameOKESAKU MASAHIRO·Filed 2007·Granted Dec 23, 2014·4 cites·5 claims
- 0975US7874781B2Substrate processing apparatusTOKYO ELECTRON LTD·Filed 2004·Granted Jan 25, 2011·17 cites·15 claims
- 1074US8573151B2Microwave plasma processing apparatus, dielectric window for use in the microwave plasma processing apparatus, and method for manufacturing the dielectric windowOHMI TADAHIRO·Filed 2009·Granted Nov 5, 2013·3 cites·18 claims
- 1174US8278205B2Semiconductor device and method for manufacturing the sameMATSUOKA TAKAAKI·Filed 2009·Granted Oct 2, 2012·4 cites·15 claims
- 1273US8461047B2Method for processing amorphous carbon film, and semiconductor device manufacturing method using the methodISHIKAWA HIRAKU·Filed 2009·Granted Jun 11, 2013·1 cites·8 claims
- 1367US9117764B2Etching method, substrate processing method, pattern forming method, method for manufacturing semiconductor element, and semiconductor elementMATSUOKA TAKAAKI·Filed 2011·Granted Aug 25, 2015·2 cites·5 claims
- 1467US8197913B2Film forming method for a semiconductorMATSUOKA TAKAAKI·Filed 2008·Granted Jun 12, 2012·2 cites·22 claims
- 1566US2014027278A1Magnetron sputtering apparatusTOKYO ELECTRON LTD·Filed 2013·Application pending·0 cites
- 1665US8568577B2Magnetron sputtering apparatusOHMI TADAHIRO·Filed 2008·Granted Oct 29, 2013·0 cites·16 claims
- 1765US6858115B2Process for reforming surface of substrate, reformed substrate and apparatus for the sameTOYOTA CHUO KENKYUSHO KK·Filed 2003·Granted Feb 22, 2005·7 cites·20 claims
- 1863US8435882B2Film forming method for a semiconductorMATSUOKA TAKAAKI·Filed 2008·Granted May 7, 2013·1 cites·13 claims
- 1962US8486792B2Film forming method of silicon oxide film, silicon oxide film, semiconductor device, and manufacturing method of semiconductor deviceUEDA HIROKAZU·Filed 2009·Granted Jul 16, 2013·2 cites·27 claims
- 2061US8383194B2Film forming apparatus, film forming system, film forming method, and method of manufacturing electronic device or organic electroluminescence elementUNIV TOHOKU·Filed 2006·Granted Feb 26, 2013·1 cites·27 claims
- 2161US7923819B2Interlayer insulating film, wiring structure and electronic device and methods of manufacturing the sameUNIV TOHOKU NAT UNIV CORP·Filed 2007·Granted Apr 12, 2011·1 cites·16 claims
- 2260US9767994B2Shower plate sintered integrally with gas release hole member and method for manufacturing the sameTOKYO ELECTRON LTD·Filed 2014·Granted Sep 19, 2017·0 cites·10 claims
- 2360US2010279512A1Plasma processing apparatus and method for plasma-processing semiconductor substrateTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 2460US2011268870A1Film forming apparatus and film forming methodUNIV TOHOKU·Filed 2011·Application pending·0 cites
- 2559US2011186425A1Magnetron sputtering method, and magnetron sputtering apparatusTOKYO ELECTRON LTD·Filed 2009·Application pending·0 cites
- 2659US2009041929A1Film Forming Apparatus and Film Forming MethodUNIV TOHOKU·Filed 2006·Application pending·0 cites
- 2757US8496792B2Rotary magnet sputtering apparatusOHMI TADAHIRO·Filed 2008·Granted Jul 30, 2013·0 cites·17 claims
- 2855US6951815B2Method and device for heat treatmentTOKYO ELECTRON LTD·Filed 2002·Granted Oct 4, 2005·4 cites·9 claims
- 2954US2013065399A1Plasma processing methodTOKYO ELECTRON LTD·Filed 2012·Application pending·0 cites
- 3053US11498145B2Welding method of diffusion bonded structureIHI CORP·Filed 2019·Granted Nov 15, 2022·0 cites·12 claims
- 3153US2009087545A1Film Forming Apparatus, Evaporating Jig, and Measurement MethodOHMI TADAHIRO·Filed 2006·Application pending·0 cites
- 3253US2010126848A1Magnetron sputtering apparatusUNIV TOHOKU·Filed 2006·Application pending·0 cites
- 3353US2008318431A1Shower Plate and Plasma Treatment Apparatus Using Shower PlateUNIV TOHOKU·Filed 2006·Application pending·0 cites
- 3451US7780391B2Substrate processing deviceTOKYO ELECTRON LTD·Filed 2003·Granted Aug 24, 2010·3 cites·11 claims
- 3550US2011189857A1Chemical mechanical polishing apparatus, chemical mechanical polishing method, and control programTOKYO ELECTRON LTD·Filed 2009·Application pending·0 cites
- 3650US2009135109A1Organic el element, organic el display device, and methods of manufacturing the sameUNIV TOHOKU NAT UNIV CORP·Filed 2008·Application pending·0 cites
- 3750US2011215384A1Semiconductor device and method of manufacturing the sameUNIV TOHOKU NAT UNIV CORP·Filed 2008·Application pending·0 cites
- 3849US2008241587A1Film-Forming Apparatus And Film-Forming MethodTOKYO ELECTRON LTD·Filed 2005·Application pending·0 cites
- 3948US8021975B2Plasma processing method for forming a film and an electronic component manufactured by the methodTOKYO ELECTRON LTD·Filed 2007·Granted Sep 20, 2011·0 cites·19 claims
- 4048US2010264117A1Plasma processing system and plasma processing methodUNIV TOHOKU·Filed 2008·Application pending·0 cites
- 4147US9812302B2Magnetron sputtering apparatusOHMI TADAHIRO·Filed 2008·Granted Nov 7, 2017·0 cites·7 claims
- 4246US8497214B2Semiconductor device manufacturing methodUEDA HIROKAZU·Filed 2008·Granted Jul 30, 2013·0 cites·8 claims
- 4346US8334204B2Semiconductor device and manufacturing method thereforMATSUOKA TAKAAKI·Filed 2008·Granted Dec 18, 2012·0 cites·11 claims
- 4445US2010101834A1Interlayer insulation film, interconnect structure, and methods of manufacturing themUNIV TOHOKU NAT UNIV CORP·Filed 2008·Application pending·0 cites
- 4545US2009277379A1Film coating apparatusUNIV TOHOKU NAT UNIV CORP·Filed 2007·Application pending·0 cites
- 4644US2011127075A1Interlayer insulating film, wiring structure, and methods of manufacturing the sameUNIV TOHOKU NAT UNIV CORP·Filed 2008·Application pending·0 cites
- 4743US8809207B2Pattern-forming method and method for manufacturing semiconductor deviceISHIKAWA HIRAKU·Filed 2012·Granted Aug 19, 2014·0 cites·10 claims
- 4843US2015325448A1Etching method, substrate processing method, pattern forming method, method for manufacturing semiconductor element, and semiconductor elementTOKYO ELECTRON LTD·Filed 2015·Application pending·0 cites
- 4943US2010170050A1Welded Joint, Steel Deck, and Process for Producing The Steel DeckINOSE KOTARO·Filed 2008·Application pending·0 cites
- 5043US2012125765A1Plasma processing apparatus and printed wiring board manufacturing methodOHMI TADAHIRO·Filed 2010·Application pending·0 cites
Showing the top 50 of 59 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →