Inventor · disambiguated record
Takayuki Ohba
Also filed as: OHBA TAKAYUKI
24 granted patents·10 pending applications·454 citations·filing 1987–2025
96Inventor score
Top patents by PatentIndex Score
34 records- 0190US4804560AMethod of selectively depositing tungsten upon a semiconductor substrateFUJITSU LTD·Filed 1987·Granted Feb 14, 1989·125 cites·2 claims
- 0286US4902645AMethod of selectively forming a silicon-containing metal layerFUJITSU LTD·Filed 1988·Granted Feb 20, 1990·61 cites·21 claims
- 0384US8415202B2Method of manufacturing semiconductor deviceOHBA TAKAYUKI·Filed 2011·Granted Apr 9, 2013·10 cites·20 claims
- 0475US5393565AMethod for deposition of a refractory metal nitride and method for formation of a conductive film containing a refractory metal nitrideFUJITSU LTD·Filed 1993·Granted Feb 28, 1995·53 cites·14 claims
- 0575US2025031455A1Three-dimensional device and manufacturing method thereofADVANTEST CORP·Filed 2024·Application pending·0 cites
- 0671US9748217B2Method of producing semiconductor deviceOHBA TAKAYUKI·Filed 2012·Granted Aug 29, 2017·3 cites·19 claims
- 0770US7166516B2Method for fabricating a semiconductor device including the use of a compound containing silicon and nitrogen to form an insulation film of SiN or SiCNFUJITSU LTD·Filed 2003·Granted Jan 23, 2007·13 cites·15 claims
- 0870US5522412AVacuum treatment apparatus and a cleaning method thereforTOKYO ELECTRON LTD·Filed 1994·Granted Jun 4, 1996·40 cites·21 claims
- 0968US6355545B1Method and apparatus for wiring, wire, and integrated circuitSEMICONDUCTOR LEADING EDGE TEC·Filed 2000·Granted Mar 12, 2002·13 cites·3 claims
- 1068US5232872AMethod for manufacturing semiconductor deviceFUJITSU LTD·Filed 1992·Granted Aug 3, 1993·42 cites·11 claims
- 1167US7563729B2Method of forming a dielectric filmFUJITSU MICROELECTRONICS LTD·Filed 2005·Granted Jul 21, 2009·3 cites·14 claims
- 1267US6664179B2Semiconductor device production method and semiconductor device production apparatusFUJITSU LTD·Filed 2002·Granted Dec 16, 2003·12 cites·5 claims
- 1366US6998303B2Manufacture method for semiconductor device with patterned film of ZrO2 or the likeFUJITSU LTD·Filed 2003·Granted Feb 14, 2006·12 cites·4 claims
- 1466US6805138B2Semiconductor device production method and semiconductor device production apparatusFUJITSU LTD·Filed 2003·Granted Oct 19, 2004·11 cites·5 claims
- 1565US11404396B2Semiconductor device comprising memory semiconductor chip in which memory cell is laminated on semiconductor substrateHONDA MOTOR CO LTD·Filed 2021·Granted Aug 2, 2022·0 cites·5 claims
- 1663US11437349B2Semiconductor deviceHONDA MOTOR CO LTD·Filed 2021·Granted Sep 6, 2022·0 cites·5 claims
- 1761US5066612AMethod of forming wiring of a semiconductor deviceFUJITSU LTD·Filed 1991·Granted Nov 19, 1991·36 cites·16 claims
- 1859US2021202477A1Three-dimensional device and manufacturing method thereofADVANTEST CORP·Filed 2020·Application pending·0 cites
- 1958US2024234308A9Semiconductor apparatus and method for manufacturing semiconductor apparatusADVANTEST CORP·Filed 2023·Application pending·0 cites
- 2058US2024290741A1Semiconductor apparatus and manufacturing methodADVANTEST CORP·Filed 2023·Application pending·0 cites
- 2158US2024186208A1Method, structure, and manufacturing method for expanding chip heat dissipation areaADVANTEST CORP·Filed 2023·Application pending·0 cites
- 2258US2024234352A9Stacked chip and fabrication method of stacked chipADVANTEST CORP·Filed 2023·Application pending·0 cites
- 2357US12476221B2Fabrication method of stacked device and stacked deviceADVANTEST CORP·Filed 2022·Granted Nov 18, 2025·0 cites·4 claims
- 2456US11309290B2Semiconductor apparatus including penetration electrodes connecting laminated semiconductor chipsHONDA MOTOR CO LTD·Filed 2020·Granted Apr 19, 2022·0 cites·6 claims
- 2555US2025374667A1Semiconductor device and manufacturing method of semiconductor deviceINST OF SCIENCE TOKYO·Filed 2025·Application pending·0 cites
- 2654US12002781B2Semiconductor device and method for manufacturing sameTOKYO INST TECH·Filed 2021·Granted Jun 4, 2024·0 cites·13 claims
- 2753US11456028B2Semiconductor device and control method thereofHONDA MOTOR CO LTD·Filed 2021·Granted Sep 27, 2022·0 cites·5 claims
- 2852US11756891B2Semiconductor device and method for manufacturing sameTOKYO INST TECH·Filed 2021·Granted Sep 12, 2023·0 cites·15 claims
- 2952US11302379B2Semiconductor apparatusHONDA MOTOR CO LTD·Filed 2020·Granted Apr 12, 2022·0 cites·8 claims
- 3048US2021118863A1Semiconductor apparatusHONDA MOTOR CO LTD·Filed 2020·Application pending·0 cites
- 3146US5264038AChemical vapor deposition systemFUJITSU LTD·Filed 1990·Granted Nov 23, 1993·13 cites·10 claims
- 3246US2020303009A1Semiconductor deviceHONDA MOTOR CO LTD·Filed 2020·Application pending·0 cites
- 3345US2007072381A1Method for fabricating a semiconductor device including the use of a compound containing silicon and nitrogen to form an insulation film of SiN, SiCN or SiOCNFUJITSU LTD·Filed 2006·Application pending·0 cites
- 3440USRE36925EVacuum treatment apparatus and a method for manufacturing semiconductor device thereinTOKYO ELECTRON LTD·Filed 1998·Granted Oct 31, 2000·7 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →