Inventor · disambiguated record
Takumi Yanagawa
Also filed as: YANAGAWA TAKUMI
14 granted patents·6 pending applications·77 citations·filing 2006–2024
90Inventor score
Top patents by PatentIndex Score
20 records- 0197US10504744B1Three or more states for achieving high aspect ratio dielectric etchLAM RES CORP·Filed 2018·Granted Dec 10, 2019·25 cites·12 claims
- 0294US7977390B2Method for plasma etching performance enhancementLAM RES CORP·Filed 2006·Granted Jul 12, 2011·29 cites·18 claims
- 0389US10861708B2Three or more states for achieving high aspect ratio dielectric etchLAM RES CORP·Filed 2019·Granted Dec 8, 2020·4 cites·20 claims
- 0486US10741407B2Reduction of sidewall notching for high aspect ratio 3D NAND etchLAM RES CORP·Filed 2018·Granted Aug 11, 2020·8 cites·18 claims
- 0584US10515821B1Method of achieving high selectivity for high aspect ratio dielectric etchLAM RES CORP·Filed 2018·Granted Dec 24, 2019·3 cites·15 claims
- 0683US11687808B2Artificial intelligence explaining for natural language processingIBM·Filed 2020·Granted Jun 27, 2023·2 cites·17 claims
- 0780US10847377B2Method of achieving high selectivity for high aspect ratio dielectric etchLAM RES CORP·Filed 2019·Granted Nov 24, 2020·2 cites·20 claims
- 0876US10621284B2Training data updateIBM·Filed 2019·Granted Apr 14, 2020·1 cites·16 claims
- 0974US10372826B2Training data updateIBM·Filed 2017·Granted Aug 6, 2019·1 cites·13 claims
- 1073US10387572B2Training data updateIBM·Filed 2017·Granted Aug 20, 2019·1 cites·13 claims
- 1173US2024297050A1Method for etching an etch layerLAM RES CORP·Filed 2024·Application pending·0 cites
- 1271US10614269B2Training data updateIBM·Filed 2019·Granted Apr 7, 2020·1 cites·15 claims
- 1357US12020944B2Method for etching an etch layerLAM RES CORP·Filed 2019·Granted Jun 25, 2024·0 cites·5 claims
- 1455US12505991B2Tunability of edge plasma density for tilt controlLAM RES CORP·Filed 2021·Granted Dec 23, 2025·0 cites·17 claims
- 1553US2024404789A1Systems and methods for determining a phase difference between rf signals provided to electrodesLAM RES CORP·Filed 2022·Application pending·0 cites
- 1652US2023260798A1Chemistry for high aspect ratio etch for 3d-nandLAM RES CORP·Filed 2022·Application pending·0 cites
- 1750US2024120209A1Systems and methods for etching a high aspect ratio structureLAM RES CORP·Filed 2021·Application pending·0 cites
- 1849US2008119055A1Reducing twisting in ultra-high aspect ratio dielectric etchLAM RES CORP·Filed 2006·Application pending·0 cites
- 1946US8741165B2Reducing twisting in ultra-high aspect ratio dielectric etchJI BING·Filed 2010·Granted Jun 3, 2014·0 cites·19 claims
- 2045US2017076917A1Plasma Module With Slotted Ground PlateAPPLIED MATERIALS INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →