Inventor · disambiguated record
Takeshi Yasui
Also filed as: YASUI TAKESHI
46 granted patents·21 pending applications·693 citations·filing 1994–2025
97Inventor score
Files withKOKUSAI ELECTRIC CORP21NIPPON STEEL & SUMITOMO METAL CORP9KYB CORP8HITACHI INT ELECTRIC INC7ASAHI CHEMICAL IND4
Top patents by PatentIndex Score
67 records- 0198US9870964B1Method of manufacturing semiconductor device by determining and selecting cooling recipe based on temperatureHITACHI INT ELECTRIC INC·Filed 2017·Granted Jan 16, 2018·418 cites·10 claims
- 0296US9162422B2High-strength hot-dip galvanized steel sheet, high-strength alloyed hot-dip galvanized steel sheet excellent in bake hardenability, and manufacturing method thereofNIPPON STEEL & SUMITOMO METAL CORP·Filed 2012·Granted Oct 20, 2015·8 cites·22 claims
- 0395US8993120B2High-strength hot-dip galvanized steel sheet having excellent delayed fracture resistance and manufacturing method thereofNIPPON STEEL & SUMITOMO METAL CORP·Filed 2012·Granted Mar 31, 2015·10 cites·11 claims
- 0495US8932729B2High-strength hot-dip galvanized steel sheet excellent in impact resistance property and high-strength alloyed hot-dip galvanized steel sheetNIPPON STEEL & SUMITOMO METAL CORP·Filed 2012·Granted Jan 13, 2015·9 cites·5 claims
- 0595US7605371B2High-resolution high-speed terahertz spectrometerUNIV OSAKA·Filed 2005·Granted Oct 20, 2009·37 cites·7 claims
- 0694US11905596B2Method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Feb 20, 2024·2 cites·12 claims
- 0794US10118480B2Grille shutter moduleFALTEC CO LTD·Filed 2015·Granted Nov 6, 2018·13 cites·2 claims
- 0894US9896751B2High strength steel sheet and high strength galvanized steel sheet excellent in shapeability and methods of production of sameKAWATA HIROYUKI·Filed 2012·Granted Feb 20, 2018·9 cites·12 claims
- 0992US11536344B2Valve and shock absorberKYB CORP·Filed 2019·Granted Dec 27, 2022·11 cites·10 claims
- 1092US9557220B2Fourier transform spectroscopy method, spectroscopic device, and spectroscopic measurement program that improve spectral resolution and spectral accuracyUNIV OSAKA·Filed 2013·Granted Jan 31, 2017·28 cites·16 claims
- 1191USD804556SHeat reflector for substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted Dec 5, 2017·42 cites·1 claims
- 1291US9234268B2High-strength galvanized steel sheet excellent in bendability and manufacturing method thereofKAWATA HIROYUKI·Filed 2012·Granted Jan 12, 2016·6 cites·4 claims
- 1389US10704132B2High-strength hot-dip galvanized steel sheet excellent in impact peeling resistance and worked portion corrosion resistanceNIPPON STEEL & SUMITOMO METAL CORP·Filed 2016·Granted Jul 7, 2020·2 cites·8 claims
- 1488US12374527B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2023·Granted Jul 29, 2025·0 cites·17 claims
- 1588USD981970SSubstrate mounting plate for substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2021·Granted Mar 28, 2023·13 cites·1 claims
- 1687US2025336646A1Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1786US9708679B2High-strength hot-dip galvanized steel sheet and high-strength alloyed hot-dip galvanized steel sheet excellent in mechanical cutting property, and manufacturing method thereofNIPPON STEEL & SUMITOMO METAL CORP·Filed 2012·Granted Jul 18, 2017·3 cites·7 claims
- 1885US6747094B2High impact thermoplastic resin compositionASAHI CHEMICAL IND·Filed 2001·Granted Jun 8, 2004·29 cites·14 claims
- 1982US12249485B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Mar 11, 2025·0 cites·16 claims
- 2082US12195854B2Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Granted Jan 14, 2025·0 cites·20 claims
- 2181US11837440B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Dec 5, 2023·1 cites·12 claims
- 2280US9702035B2High-strength hot-dip galvanized steel sheet excellent in impact resistance property and manufacturing method thereof, and high-strength alloyed hot-dip galvanized steel sheet and manufacturing method thereofNIPPON STEEL & SUMITOMO METAL CORP·Filed 2014·Granted Jul 11, 2017·5 cites·7 claims
- 2377USD803917SHeat reflector for substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted Nov 28, 2017·18 cites·1 claims
- 2475US2025201518A1Plasma unit, substrate processing apparatus, method of processing, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 2574US6653401B2Thermoplastic elastomer compositionASAHI CHEMICAL IND·Filed 2001·Granted Nov 25, 2003·13 cites·15 claims
- 2668US11869748B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2020·Granted Jan 9, 2024·0 cites·13 claims
- 2768US11384431B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2017·Granted Jul 12, 2022·1 cites·18 claims
- 2868US10113223B2Hot-dip galvanized steel sheetNIPPON STEEL & SUMITOMO METAL CORP·Filed 2015·Granted Oct 30, 2018·2 cites·20 claims
- 2968US2023230818A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 3068US2023212753A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 3167US2025191878A1Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 3265US12230474B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Feb 18, 2025·0 cites·19 claims
- 3364US10822683B2Hot-dip galvanized steel sheetNIPPON STEEL CORP·Filed 2015·Granted Nov 3, 2020·0 cites·16 claims
- 3464US10822684B2Hot-dip galvanized steel sheetNIPPON STEEL CORP·Filed 2015·Granted Nov 3, 2020·0 cites·16 claims
- 3564US9481148B2High-corrosion-resistance hot-dip galvanized steel sheet having excellent appearance uniformity and manufacturing method thereofYASUI TAKESHI·Filed 2012·Granted Nov 1, 2016·1 cites·5 claims
- 3664US2025095969A1Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 3760US11155922B2Method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Oct 26, 2021·0 cites·6 claims
- 3860US2024321558A1Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 3957US12140200B2Shock absorberKYB CORP·Filed 2022·Granted Nov 12, 2024·0 cites·6 claims
- 4056US2025052295A1Damping valve and shock absorberKYB CORP·Filed 2023·Application pending·0 cites
- 4156US2023317438A1Maintenance method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 4255US11180835B2Steel sheetNIPPON STEEL & SUMITOMO METAL CORP·Filed 2015·Granted Nov 23, 2021·0 cites·2 claims
- 4355US9551057B2Galvannealed layer and steel sheet comprising the same, and method for producing the sameKAWATA HIROYUKI·Filed 2012·Granted Jan 24, 2017·0 cites·12 claims
- 4455US7247678B2Rubbery polymer compositionASAHI CHEMICAL IND·Filed 2003·Granted Jul 24, 2007·2 cites·10 claims
- 4554US8653176B2Thermally conductive material and thermally conductive sheet molded from the thermally conductive materialNAKAMICHI MOTONORI·Filed 2006·Granted Feb 18, 2014·3 cites·10 claims
- 4654US2023245869A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 4754US2025273488A1Heating Method, Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, Lamp Module, Method of Processing Substrate and Non-transitory Computer-readable Recording MediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 4853US2024344581A1Valve and shock absorberKYB CORP·Filed 2022·Application pending·0 cites
- 4951US11542999B2Valve and shock absorberKYB CORP·Filed 2020·Granted Jan 3, 2023·0 cites·2 claims
- 5051US2024418233A1Seal device for hydraulic apparatus and shock absorberKYB CORP·Filed 2022·Application pending·0 cites
Showing the top 50 of 67 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →