Inventor · disambiguated record
Thomas A. Ponnuswamy
Also filed as: PONNUSWAMY THOMAS · PONNUSWAMY THOMAS A · PONNUSWAMY THOMAS ANAND
42 granted patents·7 pending applications·638 citations·filing 2002–2025
98Inventor score
Top patents by PatentIndex Score
49 records- 0198US9834852B2Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplatingNOVELLUS SYSTEMS INC·Filed 2016·Granted Dec 5, 2017·13 cites·20 claims
- 0298US6755954B2Electrochemical treatment of integrated circuit substrates using concentric anodes and variable field shaping elementsNOVELLUS SYSTEMS INC·Filed 2002·Granted Jun 29, 2004·140 cites·37 claims
- 0397US9523155B2Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplatingNOVELLUS SYSTEMS INC·Filed 2013·Granted Dec 20, 2016·15 cites·22 claims
- 0497US6773571B1Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sourcesNOVELLUS SYSTEMS INC·Filed 2002·Granted Aug 10, 2004·144 cites·45 claims
- 0596US9746427B2Detection of plating on wafer holding apparatusNOVELLUS SYSTEMS INC·Filed 2014·Granted Aug 29, 2017·9 cites·21 claims
- 0695US10662545B2Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplatingNOVELLUS SYSTEMS INC·Filed 2017·Granted May 26, 2020·4 cites·22 claims
- 0795US9449808B2Apparatus for advanced packaging applicationsNOVELLUS SYSTEMS INC·Filed 2013·Granted Sep 20, 2016·21 cites·23 claims
- 0895US8513124B1Copper electroplating process for uniform across wafer deposition and void free filling on semi-noble metal coated wafersPONNUSWAMY THOMAS A·Filed 2010·Granted Aug 20, 2013·30 cites·22 claims
- 0995US7964506B1Two step copper electroplating process with anneal for uniform across wafer deposition and void free filling on ruthenium coated wafersNOVELLUS SYSTEMS INC·Filed 2008·Granted Jun 21, 2011·60 cites·29 claims
- 1094US9899230B2Apparatus for advanced packaging applicationsNOVELLUS SYSTEMS INC·Filed 2016·Granted Feb 20, 2018·10 cites·16 claims
- 1194US9534308B2Protecting anodes from passivation in alloy plating systemsNOVELLUS SYSTEMS INC·Filed 2013·Granted Jan 3, 2017·5 cites·12 claims
- 1293US9221081B1Automated cleaning of wafer plating assemblyMAYER STEVEN T·Filed 2012·Granted Dec 29, 2015·13 cites·27 claims
- 1393US8703615B1Copper electroplating process for uniform across wafer deposition and void free filling on ruthenium coated wafersPONNUSWAMY THOMAS A·Filed 2012·Granted Apr 22, 2014·21 cites·24 claims
- 1493US8308931B2Method and apparatus for electroplatingREID JONATHAN·Filed 2008·Granted Nov 13, 2012·62 cites·34 claims
- 1592US10106907B2Protecting anodes from passivation in alloy plating systemsNOVELLUS SYSTEMS INC·Filed 2016·Granted Oct 23, 2018·2 cites·19 claims
- 1692US9476139B2Cleaning electroplating substrate holders using reverse current deplatingNOVELLUS SYSTEMS INC·Filed 2013·Granted Oct 25, 2016·10 cites·29 claims
- 1791US9359688B1Apparatuses and methods for controlling PH in electroplating bathsNOVELLUS SYSTEMS INC·Filed 2012·Granted Jun 7, 2016·5 cites·15 claims
- 1891US8500983B2Pulse sequence for plating on thin seed layersPONNUSWAMY THOMAS A·Filed 2010·Granted Aug 6, 2013·20 cites·14 claims
- 1990US9455139B2Methods and apparatus for wetting pretreatment for through resist metal platingNOVELLUS SYSTEMS INC·Filed 2013·Granted Sep 27, 2016·11 cites·16 claims
- 2089US10954605B2Protecting anodes from passivation in alloy plating systemsNOVELLUS SYSTEMS INC·Filed 2018·Granted Mar 23, 2021·1 cites·15 claims
- 2187US10211052B1Systems and methods for fabrication of a redistribution layer to avoid etching of the layerLAM RES CORP·Filed 2017·Granted Feb 19, 2019·5 cites·26 claims
- 2287US9613833B2Methods and apparatus for wetting pretreatment for through resist metal platingNOVELLUS SYSTEMS INC·Filed 2014·Granted Apr 4, 2017·7 cites·15 claims
- 2384US10087545B2Automated cleaning of wafer plating assemblyNOVELLUS SYSTEMS INC·Filed 2015·Granted Oct 2, 2018·3 cites·22 claims
- 2483US10092933B2Methods and apparatuses for cleaning electroplating substrate holdersNOVELLUS SYSTEMS INC·Filed 2013·Granted Oct 9, 2018·6 cites·27 claims
- 2582US12305307B2TSV process window and fill performance enhancement by long pulsing and rampingLAM RES CORP·Filed 2021·Granted May 20, 2025·1 cites·34 claims
- 2681US9828688B2Methods and apparatus for wetting pretreatment for through resist metal platingNOVELLUS SYSTEMS INC·Filed 2016·Granted Nov 28, 2017·3 cites·16 claims
- 2779US10128102B2Methods and apparatus for wetting pretreatment for through resist metal platingNOVELLUS SYSTEMS INC·Filed 2017·Granted Nov 13, 2018·2 cites·20 claims
- 2878US10190232B2Apparatuses and methods for maintaining pH in nickel electroplating bathsLAM RES CORP·Filed 2013·Granted Jan 29, 2019·2 cites·21 claims
- 2977US10648097B2Copper electrodeposition on cobalt lined featuresLAM RES CORP·Filed 2018·Granted May 12, 2020·2 cites·10 claims
- 3074US10930511B2Copper electrodeposition sequence for the filling of cobalt lined featuresLAM RES CORP·Filed 2018·Granted Feb 23, 2021·1 cites·13 claims
- 3173US2023298894A1Copper electrodeposition sequence for the filling of cobalt lined featuresLAM RES CORP·Filed 2023·Application pending·0 cites
- 3272US8076241B2Methods for multi-step copper plating on a continuous ruthenium film in recessed featuresCERIO JR FRANK M·Filed 2009·Granted Dec 13, 2011·5 cites·30 claims
- 3371US10538855B2Cleaning electroplating substrate holders using reverse current deplatingNOVELLUS SYSTEMS INC·Filed 2016·Granted Jan 21, 2020·1 cites·4 claims
- 3471US2025263862A1Tsv process window and fill performance enhancement by long pulsing and rampingLAM RES CORP·Filed 2025·Application pending·0 cites
- 3570US10301738B2Methods and apparatus for wetting pretreatment for through resist metal platingNOVELLUS SYSTEMS INC·Filed 2017·Granted May 28, 2019·1 cites·20 claims
- 3669US11699590B2Copper electrodeposition sequence for the filling of cobalt lined featuresLAM RES CORP·Filed 2021·Granted Jul 11, 2023·0 cites·7 claims
- 3766US11542630B2Cleaning electroplating substrate holders using reverse current deplatingNOVELLUS SYSTEMS INC·Filed 2019·Granted Jan 3, 2023·0 cites·10 claims
- 3861US11168407B2Copper electrodeposition on cobalt lined featuresLAM RES CORP·Filed 2020·Granted Nov 9, 2021·0 cites·10 claims
- 3950US12392047B2Byproduct removal from electroplating solutionsLAM RES CORP·Filed 2020·Granted Aug 19, 2025·0 cites·22 claims
- 4048US12424453B2Low temperature direct copper-copper bondingLAM RES CORP·Filed 2019·Granted Sep 23, 2025·0 cites·25 claims
- 4147US2023212773A1Surface pretreatment for electroplating nanotwinned copperLAM RES CORP·Filed 2021·Application pending·0 cites
- 4246US9412713B2Treatment method of electrodeposited copper for wafer-level-packaging process flowNOVELLUS SYSTEMS INC·Filed 2013·Granted Aug 9, 2016·0 cites·19 claims
- 4346US7247554B2Method of making integrated circuits using ruthenium and its oxides as a Cu diffusion barrierUNIV NORTH TEXAS·Filed 2003·Granted Jul 24, 2007·3 cites·9 claims
- 4445US12293943B2Gold through silicon mask platingLAM RES CORP·Filed 2020·Granted May 6, 2025·0 cites·12 claims
- 4545US2015299882A1Nickel electroplating systems having a grain refiner releasing deviceLAM RES CORP·Filed 2014·Application pending·0 cites
- 4642US2022010446A1Electrodeposition of nanotwinned copper structuresLAM RES CORP·Filed 2019·Application pending·0 cites
- 4740US2019122890A1Multibath plating of a single metalLAM RES CORP·Filed 2018·Application pending·0 cites
- 4838US10714436B2Systems and methods for achieving uniformity across a redistribution layerLAM RES CORP·Filed 2017·Granted Jul 14, 2020·0 cites·15 claims
- 4937US2008149489A1Multistep immersion of wafer into liquid bathNOVELLUS SYSTEMS INC·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →