Inventor · disambiguated record
Timothy H. Daubenspeck
Also filed as: DAUBENSPECK TIMOTHY · DAUBENSPECK TIMOTHY H · DAUBENSPECK TIMOTHY HARRISON
167 granted patents·15 pending applications·2,071 citations·filing 1987–2017
99Inventor score
Files withIBM115DAUBENSPECK TIMOTHY H37ARVIN CHARLES L7GLOBALFOUNDRIES INC5DAUBENSPECK TIMOTHY HARRISON4
Top patents by PatentIndex Score
182 records- 0198US7323780B2Electrical interconnection structure formationIBM·Filed 2005·Granted Jan 29, 2008·62 cites·11 claims
- 0296US8742594B2Structure and method of making an offset-trench crackstop that forms an air gap adjacent to a passivated metal crackstopDAUBENSPECK TIMOTHY H·Filed 2012·Granted Jun 3, 2014·30 cites·15 claims
- 0396US8508043B2Metal pad structure for thickness enhancement of polymer used in electrical interconnection of semiconductor die to semiconductor chip package substrate with solder bumpDAUBENSPECK TIMOTHY H·Filed 2011·Granted Aug 13, 2013·24 cites·19 claims
- 0496US7825511B2Undercut-free BLM process for Pb-free and Pb-reduced C4IBM·Filed 2009·Granted Nov 2, 2010·37 cites·7 claims
- 0596US7335577B2Crack stop for low K dielectricsIBM·Filed 2005·Granted Feb 26, 2008·47 cites·9 claims
- 0696US5219788ABilayer metallization cap for photolithographyIBM·Filed 1991·Granted Jun 15, 1993·425 cites·20 claims
- 0795US7482675B2Probing pads in kerf area for wafer testingIBM·Filed 2005·Granted Jan 27, 2009·40 cites·8 claims
- 0894US7459785B2Electrical interconnection structure formationIBM·Filed 2007·Granted Dec 2, 2008·28 cites·10 claims
- 0994US5935763ASelf-aligned pattern over a reflective layerIBM·Filed 1996·Granted Aug 10, 1999·213 cites·18 claims
- 1093US8803317B2Structures for improving current carrying capability of interconnects and methods of fabricating the sameARVIN CHARLES L·Filed 2012·Granted Aug 12, 2014·5 cites·15 claims
- 1193US8298930B2Undercut-repair of barrier layer metallurgy for solder bumps and methods thereofARVIN CHARLES L·Filed 2010·Granted Oct 30, 2012·16 cites·19 claims
- 1293US7521336B2Crack stop for low K dielectricsIBM·Filed 2007·Granted Apr 21, 2009·22 cites·6 claims
- 1392US8680689B1Coplanar waveguide for stacked multi-chip systemsIBM·Filed 2012·Granted Mar 25, 2014·10 cites·20 claims
- 1491US7868453B2Solder interconnect pads with current spreading layersIBM·Filed 2008·Granted Jan 11, 2011·15 cites·18 claims
- 1591US7485564B2Undercut-free BLM process for Pb-free and Pb-reduced C4IBM·Filed 2007·Granted Feb 3, 2009·20 cites·20 claims
- 1691US7348210B2Post bump passivation for soft error protectionIBM·Filed 2005·Granted Mar 25, 2008·25 cites·5 claims
- 1791US7329951B2Solder bumps in flip-chip technologiesIBM·Filed 2005·Granted Feb 12, 2008·20 cites·1 claims
- 1890US7439170B1Design structure for final via designs for chip stress reductionIBM·Filed 2008·Granted Oct 21, 2008·16 cites·1 claims
- 1989US9059106B2Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chipIBM·Filed 2012·Granted Jun 16, 2015·9 cites·18 claims
- 2089US8637392B2Solder interconnect with non-wettable sidewall pillars and methods of manufactureARVIN CHARLES L·Filed 2010·Granted Jan 28, 2014·9 cites·23 claims
- 2189US8350383B2IC chip package having IC chip with overhang and/or BGA blocking underfill material flow and related methodsIBM·Filed 2009·Granted Jan 8, 2013·16 cites·19 claims
- 2289US7985671B2Structures and methods for improving solder bump connections in semiconductor devicesIBM·Filed 2008·Granted Jul 26, 2011·18 cites·22 claims
- 2389US7316940B2Chip dicingIBM·Filed 2006·Granted Jan 8, 2008·12 cites·10 claims
- 2488US8476762B2Ni plating of a BLM edge for Pb-free C4 undercut controlDAUBENSPECK TIMOTHY H·Filed 2012·Granted Jul 2, 2013·8 cites·16 claims
- 2588US8198133B2Structures and methods to improve lead-free C4 interconnect reliabilityDAUBENSPECK TIMOTHY H·Filed 2009·Granted Jun 12, 2012·16 cites·12 claims
- 2688US7541272B2Damascene patterning of barrier layer metal for C4 solder bumpsIBM·Filed 2007·Granted Jun 2, 2009·14 cites·11 claims
- 2788US6440834B2Method and structure for a semiconductor fuseIBM·Filed 2001·Granted Aug 27, 2002·44 cites·29 claims
- 2887US8361598B2Substrate anchor structure and methodIBM·Filed 2011·Granted Jan 29, 2013·8 cites·12 claims
- 2986US8921975B2System and method for forming aluminum fuse for compatibility with copper BEOL interconnect schemeANDERSON FELIX P·Filed 2012·Granted Dec 30, 2014·8 cites·6 claims
- 3086US7859122B2Final via structures for bond pad-solder ball interconnectionsIBM·Filed 2008·Granted Dec 28, 2010·14 cites·14 claims
- 3186US7635643B2Method for forming C4 connections on integrated circuit chips and the resulting devicesIBM·Filed 2006·Granted Dec 22, 2009·14 cites·20 claims
- 3286US7256503B2Chip underfill in flip-chip technologiesIBM·Filed 2006·Granted Aug 14, 2007·14 cites·20 claims
- 3386US6498385B1Post-fuse blow corrosion prevention structure for copper fusesIBM·Filed 1999·Granted Dec 24, 2002·68 cites·11 claims
- 3485US9159696B2Plug via formation by patterned plating and polishingIBM·Filed 2013·Granted Oct 13, 2015·6 cites·20 claims
- 3585US7176583B2Damascene patterning of barrier layer metal for C4 solder bumpsIBM·Filed 2004·Granted Feb 13, 2007·35 cites·10 claims
- 3684US8298917B2Process for wet singulation using a dicing singulation structureANDRY PAUL S·Filed 2009·Granted Oct 30, 2012·9 cites·19 claims
- 3784US8138099B1Chip package solder interconnect formed by surface tensionDAUBENSPECK TIMOTHY H·Filed 2010·Granted Mar 20, 2012·7 cites·20 claims
- 3884US6667533B2Triple damascene fuseIBM·Filed 2002·Granted Dec 23, 2003·31 cites·30 claims
- 3983US8927334B2Overcoming chip warping to enhance wetting of solder bumps and flip chip attaches in a flip chip packageIBM·Filed 2012·Granted Jan 6, 2015·7 cites·8 claims
- 4083US8492892B2Solder bump connectionsDAUBENSPECK TIMOTHY H·Filed 2010·Granted Jul 23, 2013·6 cites·19 claims
- 4183US8159067B2Underfill flow guide structuresDAUBENSPECK TIMOTHY H·Filed 2008·Granted Apr 17, 2012·8 cites·11 claims
- 4283US7935408B2Substrate anchor structure and methodIBM·Filed 2007·Granted May 3, 2011·10 cites·12 claims
- 4383US7601628B2Wire and solder bond forming methodsIBM·Filed 2006·Granted Oct 13, 2009·11 cites·20 claims
- 4483US7462509B2Dual-sided chip attached modulesIBM·Filed 2006·Granted Dec 9, 2008·10 cites·12 claims
- 4583US7405139B2Prevention of backside cracks in semiconductor chips or wafers using backside film or backside wet etchIBM·Filed 2006·Granted Jul 29, 2008·9 cites·5 claims
- 4682US8937009B2Far back end of the line metallization method and structuresIBM·Filed 2013·Granted Jan 20, 2015·6 cites·18 claims
- 4782US8933540B2Thermal via for 3D integrated circuits structuresIBM·Filed 2013·Granted Jan 13, 2015·6 cites·9 claims
- 4882US8415260B2Chip identification for organic laminate packaging and methods of manufactureBANACH ALBERT J·Filed 2010·Granted Apr 9, 2013·8 cites·3 claims
- 4982US8338286B2Dimensionally decoupled ball limiting metalurgyPERFECTO ERIC DAVID·Filed 2010·Granted Dec 25, 2012·10 cites·15 claims
- 5082US8212357B2Combination via and pad structure for improved solder bump electromigration characteristicsDAUBENSPECK TIMOTHY H·Filed 2008·Granted Jul 3, 2012·10 cites·22 claims
Showing the top 50 of 182 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →