Inventor · disambiguated record
Tokunobu Akao
Also filed as: AKAO TOKUNOBU
19 granted patents·5 pending applications·222 citations·filing 1996–2024
93Inventor score
Files withKOKUSAI ELECTRIC CORP10HITACHI INT ELECTRIC INC6AKAO TOKUNOBU3KOKUSAI ELECTRIC CO LTD3OGAWA UNRYU1
Top patents by PatentIndex Score
24 records- 0194US12050138B2Substrate processing apparatus, and thermocoupleKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jul 30, 2024·2 cites·20 claims
- 0288US6742977B1Substrate processing device, substrate conveying device, and substrate processing methodKOKUSAI ELECTRIC CO LTD·Filed 2000·Granted Jun 1, 2004·75 cites·18 claims
- 0387US11300456B2Substrate processing apparatus, and thermocoupleKOKUSAI ELECTRIC CORP·Filed 2019·Granted Apr 12, 2022·3 cites·20 claims
- 0482US5850071ASubstrate heating equipment for use in a semiconductor fabricating apparatusKOKUSAI ELECTRIC CO LTD·Filed 1996·Granted Dec 15, 1998·81 cites·15 claims
- 0581US12504332B2Substrate temperature sensor, substrate retainer and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Granted Dec 23, 2025·0 cites·20 claims
- 0671US10228291B2Substrate processing apparatus, and thermocoupleHITACHI INT ELECTRIC INC·Filed 2016·Granted Mar 12, 2019·1 cites·12 claims
- 0770US8486222B2Substrate processing apparatus and method of manufacturing a semiconductor deviceAKAO TOKUNOBU·Filed 2011·Granted Jul 16, 2013·3 cites·9 claims
- 0869US11906367B2Substrate temperature sensor, substrate retainer and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2021·Granted Feb 20, 2024·0 cites·16 claims
- 0967US5957651ASubstrate carrying apparatusKOKUSAI ELECTRIC CO LTD·Filed 1996·Granted Sep 28, 1999·40 cites·22 claims
- 1066USD976129STemperature sensorKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jan 24, 2023·3 cites·1 claims
- 1162US10684174B2Substrate processing apparatus, and thermocoupleHITACHI INT ELECTRIC INC·Filed 2018·Granted Jun 16, 2020·0 cites·16 claims
- 1262US2025102373A1Temperature measurement assembly, substrate processing apparatus, method of processing substrate, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1359USD973520STemperature sensorKOKUSAI ELECTRIC CORP·Filed 2021·Granted Dec 27, 2022·2 cites·1 claims
- 1459US8987645B2Substrate processing apparatus having rotatable slot-type antenna and method of manufacturing semiconductor device using the sameOGAWA UNRYU·Filed 2011·Granted Mar 24, 2015·2 cites·4 claims
- 1559US8795433B2Substrate processing apparatusAKAO TOKUNOBU·Filed 2009·Granted Aug 5, 2014·1 cites·16 claims
- 1658US8557720B2Substrate processing apparatus and method of manufacturing a semiconductor deviceAKAO TOKUNOBU·Filed 2011·Granted Oct 15, 2013·1 cites·12 claims
- 1758US2025118579A1Temperature measurement assembly, substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1851US2022139737A1Temperature sensor, heater unit, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 1945USD818850SProtector tube for thermocoupleHITACHI INT ELECTRIC INC·Filed 2017·Granted May 29, 2018·4 cites·1 claims
- 2040US2008288217A1Data Logging MethodHITACHI INT ELECTRIC INC·Filed 2006·Application pending·0 cites
- 2137USD819463SProtector tube for thermocoupleHITACHI INT ELECTRIC INC·Filed 2017·Granted Jun 5, 2018·2 cites·1 claims
- 2237USD803075SThermometry tool for substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2016·Granted Nov 21, 2017·2 cites·1 claims
- 2331US2001035124A1Substrate processing apparatus and semiconductor manufacturing methodFiled 2001·Application pending·0 cites
- 2430USD924701STemperature sensorKOKUSAI ELECTRIC CORP·Filed 2019·Granted Jul 13, 2021·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →