Inventor · disambiguated record
Tsung-Shu Lin
Also filed as: LIN TSUNG-SHU
96 granted patents·23 pending applications·432 citations·filing 2008–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD98LIN TSUNG-SHU4TAIWAN SEMICONDUCTOR MFG4HUANG CHANG-CHIA2LIN WEN-YI2
Top patents by PatentIndex Score
119 records- 0199US11276656B2Integrated fan-out structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 15, 2022·12 cites·20 claims
- 0299US10062648B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 28, 2018·70 cites·19 claims
- 0399US9613931B2Fan-out stacked system in package (SIP) having dummy dies and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 4, 2017·64 cites·19 claims
- 0498US11594469B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 28, 2023·6 cites·20 claims
- 0598US11527502B2Contact pad for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 13, 2022·4 cites·20 claims
- 0698US11282825B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 22, 2022·5 cites·20 claims
- 0798US10347606B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 9, 2019·19 cites·20 claims
- 0897US11901320B2Contact pad for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 13, 2024·2 cites·20 claims
- 0997US10811394B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 20, 2020·10 cites·20 claims
- 1097US9929112B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 27, 2018·19 cites·20 claims
- 1196US11810833B2Package structure and method and equipment for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 7, 2023·3 cites·20 claims
- 1295US11929293B2Semiconductor package with lid structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 12, 2024·2 cites·20 claims
- 1395US11062971B2Package structure and method and equipment for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 13, 2021·12 cites·20 claims
- 1495US10461014B2Heat spreading device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 29, 2019·10 cites·23 claims
- 1595US9984998B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 29, 2018·9 cites·20 claims
- 1695US9972581B1Routing design of dummy metal cap and redistribution lineTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 15, 2018·14 cites·20 claims
- 1794US12327819B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 10, 2025·1 cites·20 claims
- 1894US11923310B2Package structure including through via structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 5, 2024·2 cites·20 claims
- 1994US11515229B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 29, 2022·3 cites·20 claims
- 2093US11756870B2Stacked via structure disposed on a conductive pillar of a semiconductor dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 12, 2023·2 cites·20 claims
- 2193US11133258B2Package with bridge die for interconnection and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 28, 2021·9 cites·19 claims
- 2293US10366959B2Integrated fan-out structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 30, 2019·7 cites·20 claims
- 2393US10354961B2Routing design of dummy metal cap and redistribution lineTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 16, 2019·8 cites·20 claims
- 2493US9691686B2Contact pad for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 27, 2017·10 cites·20 claims
- 2592US9553065B2Bumps for chip scale packaging including under bump metal structures with different diametersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 24, 2017·12 cites·18 claims
- 2691US11302600B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 12, 2022·5 cites·19 claims
- 2791US10515867B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·6 cites·17 claims
- 2890US11855030B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·2 cites·20 claims
- 2990US10978373B2Semiconductor device methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 13, 2021·5 cites·19 claims
- 3088US11581268B2Semiconductor package with redistribution structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 14, 2023·1 cites·20 claims
- 3188US10756038B1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 25, 2020·4 cites·20 claims
- 3288US9978656B2Mechanisms for forming fine-pitch copper bump structuresLIN TSUNG SHU·Filed 2012·Granted May 22, 2018·12 cites·20 claims
- 3388US2025273631A1Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3487US11088079B2Package structure having line connected via portionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·4 cites·20 claims
- 3587US11018073B2Heat spreading device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 25, 2021·3 cites·20 claims
- 3686US11069642B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 20, 2021·5 cites·20 claims
- 3786US10714426B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 14, 2020·3 cites·20 claims
- 3884US12506087B2Semiconductor package with redistribution structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 23, 2025·0 cites·20 claims
- 3984US10930605B2Contact pad for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 23, 2021·2 cites·20 claims
- 4084US9786614B2Integrated fan-out structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 10, 2017·3 cites·20 claims
- 4184US8836094B1Package device including an opening in a flexible substrate and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 16, 2014·7 cites·19 claims
- 4284US2025069980A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4383US12387988B2Method of manufacturing semiconductor package having lid structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 4483US11676943B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 13, 2023·1 cites·20 claims
- 4583US9887144B2Ring structure for chip packagingLIN WEN YI·Filed 2011·Granted Feb 6, 2018·7 cites·20 claims
- 4683US8970033B2Extending metal traces in bump-on-trace structuresCHEN YU-FENG·Filed 2011·Granted Mar 3, 2015·7 cites·17 claims
- 4782US11088048B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·2 cites·20 claims
- 4882US11011451B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 18, 2021·3 cites·20 claims
- 4982US2025309009A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 5081US12170237B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 17, 2024·0 cites·20 claims
Showing the top 50 of 119 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →