Inventor · disambiguated record
Unryu Ogawa
Also filed as: OGAWA UNRYU
14 granted patents·6 pending applications·82 citations·filing 2000–2020
90Inventor score
Top patents by PatentIndex Score
20 records- 0192US6727654B2Plasma processing apparatusHITACHI INT ELECTRIC INC·Filed 2001·Granted Apr 27, 2004·45 cites·18 claims
- 0287US9236242B2Substrate processing method and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2012·Granted Jan 12, 2016·6 cites·13 claims
- 0386US10163663B2Substrate processing apparatus, exhaust system and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2017·Granted Dec 25, 2018·5 cites·9 claims
- 0482US10192735B2Substrate processing method and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2017·Granted Jan 29, 2019·2 cites·15 claims
- 0579US8334215B2Substrate processing method and substrate processing apparatusUEDA TATSUSHI·Filed 2009·Granted Dec 18, 2012·5 cites·15 claims
- 0671US9754780B2Substrate processing method and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted Sep 5, 2017·1 cites·13 claims
- 0770US8486222B2Substrate processing apparatus and method of manufacturing a semiconductor deviceAKAO TOKUNOBU·Filed 2011·Granted Jul 16, 2013·3 cites·9 claims
- 0868US8066894B2Substrate processing method and substrate processing apparatusUEDA TATSUSHI·Filed 2006·Granted Nov 29, 2011·2 cites·11 claims
- 0963US6376796B2Plasma processing systemSATO NORIYOSHI·Filed 2000·Granted Apr 23, 2002·8 cites·9 claims
- 1059US8987645B2Substrate processing apparatus having rotatable slot-type antenna and method of manufacturing semiconductor device using the sameOGAWA UNRYU·Filed 2011·Granted Mar 24, 2015·2 cites·4 claims
- 1158US8557720B2Substrate processing apparatus and method of manufacturing a semiconductor deviceAKAO TOKUNOBU·Filed 2011·Granted Oct 15, 2013·1 cites·12 claims
- 1249US2007062646A1Method and apparatus for processing substratesHITACHI INT ELECTRIC INC·Filed 2006·Application pending·0 cites
- 1345US2008206968A1Manufacturing method of semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2007·Application pending·0 cites
- 1443US7045447B2Semiconductor device producing method and semiconductor device producing apparatus including forming an oxide layer and changing the impedance or potential to form an oxynitrideHITACHI INT ELECTRIC INC·Filed 2003·Granted May 16, 2006·2 cites·21 claims
- 1543US2015089924A1Exhaust gas processing device, exhaust gas processing system, method for controlling exhaust gas processing system, control program, and cylindrical tubeHITACHI INT ELECTRIC INC·Filed 2013·Application pending·0 cites
- 1642US7795156B2Producing method of semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2005·Granted Sep 14, 2010·0 cites·7 claims
- 1741US12188124B2Substrate processing apparatus, gas nozzle and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2020·Granted Jan 7, 2025·0 cites·17 claims
- 1840US2009050056A1Substrate processing apparatus and semiconductor manufacturing method thereofOGAWA UNRYU·Filed 2008·Application pending·0 cites
- 1938US2002036066A1Method and apparatus for processing substratesHITACHI INT ELECTRIC INC·Filed 2001·Application pending·0 cites
- 2035US2008096395A1Producing Method of Semiconductor DeviceTERASAKI TADASHI·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →