Inventor · disambiguated record
Wenting Hou
Also filed as: HOU WENTING
11 granted patents·15 pending applications·28 citations·filing 2008–2025
82Inventor score
Top patents by PatentIndex Score
26 records- 0186US8099702B2Method and apparatus for proximate placement of sequential cellsHOU WENTING·Filed 2008·Granted Jan 17, 2012·28 cites·22 claims
- 0274US11626410B2Silicon-containing layer for bit line resistance reductionAPPLIED MATERIALS INC·Filed 2022·Granted Apr 11, 2023·0 cites·16 claims
- 0372US11655534B2Apparatus for reducing tungsten resistivityAPPLIED MATERIALS INC·Filed 2022·Granted May 23, 2023·0 cites·10 claims
- 0472US11447857B2Methods and apparatus for reducing tungsten resistivityAPPLIED MATERIALS INC·Filed 2020·Granted Sep 20, 2022·0 cites·14 claims
- 0570US11637107B2Silicon-containing layer for bit line resistance reductionAPPLIED MATERIALS INC·Filed 2021·Granted Apr 25, 2023·0 cites·12 claims
- 0670US2024038859A1Metal cap for contact resistance reductionAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0765US11908696B2Methods and devices for subtractive self-alignmentAPPLIED MATERIALS INC·Filed 2022·Granted Feb 20, 2024·0 cites·10 claims
- 0862US11257677B2Methods and devices for subtractive self-alignmentAPPLIED MATERIALS INC·Filed 2020·Granted Feb 22, 2022·0 cites·11 claims
- 0961US2025290193A1Molybdenum physical vapor deposition targetAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1059US2022231137A1Metal cap for contact resistance reductionAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 1158US12387978B2Ru liner above a barrier layerAPPLIED MATERIALS INC·Filed 2022·Granted Aug 12, 2025·0 cites·14 claims
- 1258US2020235104A1Cap Layer For Bit Line Resistance ReductionAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 1357US2024175120A1Low resistivity gapfillAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1456US2025140562A1Low resistivity metal stacks and methods of depositing the sameAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1556US2024006236A1Plasma enhanced tungsten nucleation for low resistivityAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1656US2025105013A1Low resistivity metal stacks and methods of depositing the sameAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1756US2024249920A1Removable mask layer to reduce overhang during re-sputter process in pvd chambersAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1855US10700072B2Cap layer for bit line resistance reductionAPPLIED MATERIALS INC·Filed 2018·Granted Jun 30, 2020·0 cites·20 claims
- 1954US2024087955A1Integrated pvd tungsten liner and seamless cvd tungsten fillAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2053US2024282709A1Layered Substrate with Ruthenium Layer and Method for ProducingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2148US10304732B2Methods and apparatus for filling substrate features with cobaltAPPLIED MATERIALS INC·Filed 2017·Granted May 28, 2019·0 cites·17 claims
- 2246US2017145553A1Pre-coated shield using in vhf-rf pvd chambersAPPLIED MATERIALS INC·Filed 2016·Application pending·0 cites
- 2344US10950500B2Methods and apparatus for filling a feature disposed in a substrateAPPLIED MATERIALS INC·Filed 2018·Granted Mar 16, 2021·0 cites·15 claims
- 2444US2021123139A1Method and apparatus for low resistance contact interconnectionAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 2535US2016055272A1Method and compiling system for generating testbench for icMEDIATEK SINGAPORE PTE LTD·Filed 2015·Application pending·0 cites
- 2631US2012052679A1Method of Fabricating an Ohmic contact to n-type Gallium NitrideHOU WENTING·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →