Inventor · disambiguated record
Wei Lin
Also filed as: LIN WEI · LIN WEI-JIE
36 granted patents·5 pending applications·374 citations·filing 2012–2025
97Inventor score
Top patents by PatentIndex Score
41 records- 0198US9620481B2Substrate bonding with diffusion barrier structuresGLOBALFOUNDRIES INC·Filed 2015·Granted Apr 11, 2017·220 cites·16 claims
- 0297US9466538B1Method to achieve ultra-high chip-to-chip alignment accuracy for wafer-to-wafer bonding processGLOBALFOUNDRIES INC·Filed 2015·Granted Oct 11, 2016·43 cites·17 claims
- 0396US9064937B2Substrate bonding with diffusion barrier structuresIBM·Filed 2013·Granted Jun 23, 2015·29 cites·11 claims
- 0494US10157757B2Gas-controlled bonding platform for edge defect reduction during wafer bondingIBM·Filed 2017·Granted Dec 18, 2018·4 cites·14 claims
- 0593US9922851B2Gas-controlled bonding platform for edge defect reduction during wafer bondingIBM·Filed 2014·Granted Mar 20, 2018·8 cites·16 claims
- 0692US10056272B2Gas-controlled bonding platform for edge defect reduction during wafer bondingIBM·Filed 2017·Granted Aug 21, 2018·3 cites·10 claims
- 0791US9028628B2Wafer-to-wafer oxide fusion bondingIBM·Filed 2013·Granted May 12, 2015·12 cites·10 claims
- 0890US12419062B2Method for manufacturing semiconductor device including capacitor structure having lower electrode with different lengthsNANYA TECHNOLOGY CORP·Filed 2022·Granted Sep 16, 2025·1 cites·7 claims
- 0988US9263366B2Liquid cooling of semiconductor chips utilizing small scale structuresIBM·Filed 2014·Granted Feb 16, 2016·8 cites·11 claims
- 1087US9054109B2Corrosion/etching protection in integration circuit fabricationsLIN WEI·Filed 2012·Granted Jun 9, 2015·9 cites·22 claims
- 1186US9806032B1Integrated circuit structure with refractory metal alignment marker and methods of forming sameGLOBALFOUNDRIES INC·Filed 2016·Granted Oct 31, 2017·6 cites·15 claims
- 1286US9536853B2Semiconductor device including built-in crack-arresting film structureIBM·Filed 2014·Granted Jan 3, 2017·3 cites·6 claims
- 1386US9059039B2Reducing wafer bonding misalignment by varying thermal treatment prior to bondingIBM·Filed 2013·Granted Jun 16, 2015·6 cites·15 claims
- 1485US9263389B2Enhancing barrier in air gap technologyIBM·Filed 2014·Granted Feb 16, 2016·5 cites·7 claims
- 1582US9058974B2Distorting donor wafer to corresponding distortion of host waferIBM·Filed 2013·Granted Jun 16, 2015·4 cites·6 claims
- 1680US9401303B2Handler wafer removal by use of sacrificial inert layerGLOBALFOUNDRIES INC·Filed 2014·Granted Jul 26, 2016·4 cites·20 claims
- 1779US11586314B1Border touch moduleTPK TOUCH SOLUTIONS XIAMEN INC·Filed 2021·Granted Feb 21, 2023·1 cites·20 claims
- 1879US10269760B2Advanced chip to wafer stackingIBM·Filed 2017·Granted Apr 23, 2019·2 cites·5 claims
- 1973US9640514B1Wafer bonding using boron and nitrogen based bonding stackGLOBALFOUNDRIES INC·Filed 2016·Granted May 2, 2017·2 cites·17 claims
- 2071US10170447B2Advanced chip to wafer stackingIBM·Filed 2017·Granted Jan 1, 2019·1 cites·20 claims
- 2166US11829546B2Border touch moduleTPK TOUCH SOLUTIONS XIAMEN INC·Filed 2023·Granted Nov 28, 2023·0 cites·9 claims
- 2266US9881896B2Advanced chip to wafer stackingIBM·Filed 2015·Granted Jan 30, 2018·1 cites·8 claims
- 2365US10615139B2Semiconductor device including built-in crack-arresting film structureIBM·Filed 2018·Granted Apr 7, 2020·0 cites·4 claims
- 2464US9059333B1Facilitating chip dicing for metal-metal bonding and hybrid wafer bondingIBM·Filed 2013·Granted Jun 16, 2015·1 cites·16 claims
- 2563US10211178B2Semiconductor device including built-in crack-arresting film structureIBM·Filed 2017·Granted Feb 19, 2019·0 cites·5 claims
- 2662US10047264B2Polymer composite thermal interface material with high thermal conductivityIBM·Filed 2014·Granted Aug 14, 2018·1 cites·11 claims
- 2762US10020279B2Semiconductor device including built-in crack-arresting film structureIBM·Filed 2016·Granted Jul 10, 2018·0 cites·6 claims
- 2859US10777433B2Gas-controlled bonding platform for edge defect reduction during wafer bondingIBM·Filed 2018·Granted Sep 15, 2020·0 cites·20 claims
- 2958US10332837B2Enhancing barrier in air gap technologyIBM·Filed 2017·Granted Jun 25, 2019·0 cites·6 claims
- 3058US10276500B2Enhancing barrier in air gap technologyIBM·Filed 2017·Granted Apr 30, 2019·0 cites·7 claims
- 3154US9847295B2Enhancing barrier in air gap technologyIBM·Filed 2015·Granted Dec 19, 2017·0 cites·6 claims
- 3253US9142488B2Manganese oxide hard mask for etching dielectric materialsIBM·Filed 2013·Granted Sep 22, 2015·0 cites·20 claims
- 3353US2024006473A1Semiconductor device including capacitor structure having lower electrode with different lengthsNANYA TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 3450US9472457B2Manganese oxide hard mask for etching dielectric materialsIBM·Filed 2015·Granted Oct 18, 2016·0 cites·15 claims
- 3549US2025335061A1Metal mesh touch display deviceTPK ADVANCED SOLUTIONS INC·Filed 2025·Application pending·0 cites
- 3648US9564386B2Semiconductor package with structures for cooling fluid retentionIBM·Filed 2015·Granted Feb 7, 2017·0 cites·15 claims
- 3748US9190303B2Reducing wafer bonding misalignment by varying thermal treatment prior to bondingIBM·Filed 2015·Granted Nov 17, 2015·0 cites·5 claims
- 3847US9553054B2Strain detection structures for bonded wafers and chipsIBM·Filed 2014·Granted Jan 24, 2017·0 cites·12 claims
- 3946US2015221610A1Separating bonded wafersIBM·Filed 2015·Application pending·0 cites
- 4045US2015255417A1Facilitating chip dicing for metal-metal bonding and hybrid wafer bondingIBM·Filed 2015·Application pending·0 cites
- 4142US2014265165A1Wafer-to-wafer fusion bonding chuckIBM·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →