Inventor · disambiguated record
Wendy H. Yeh
Also filed as: YEH WENDY H
13 granted patents·11 pending applications·259 citations·filing 2002–2013
92Inventor score
Files withAPPLIED MATERIALS INC16SEAMONS MARTIN JAY2BALASUBRAMANIAN GANESH1LEE KWANGDUK DOUGLAS1SEAMONS MARTIN J1
Top patents by PatentIndex Score
24 records- 0195US7064078B2Techniques for the use of amorphous carbon (APF) for various etch and litho integration schemeAPPLIED MATERIALS INC·Filed 2004·Granted Jun 20, 2006·114 cites·23 claims
- 0293US7407893B2Liquid precursors for the CVD deposition of amorphous carbon filmsAPPLIED MATERIALS INC·Filed 2005·Granted Aug 5, 2008·33 cites·20 claims
- 0392US7718081B2Techniques for the use of amorphous carbon (APF) for various etch and litho integration schemesAPPLIED MATERIALS INC·Filed 2006·Granted May 18, 2010·17 cites·20 claims
- 0486US6853043B2Nitrogen-free antireflective coating for use with photolithographic patterningAPPLIED MATERIALS INC·Filed 2002·Granted Feb 8, 2005·41 cites·32 claims
- 0581US7109087B2Absorber layer for DSA processingAPPLIED MATERIALS INC·Filed 2003·Granted Sep 19, 2006·20 cites·23 claims
- 0677US7776516B2Graded ARC for high NA and immersion lithographyAPPLIED MATERIALS INC·Filed 2006·Granted Aug 17, 2010·4 cites·14 claims
- 0777US7642195B2Hydrogen treatment to improve photoresist adhesion and rework consistencyAPPLIED MATERIALS INC·Filed 2005·Granted Jan 5, 2010·6 cites·20 claims
- 0865US7365014B2Reticle fabrication using a removable hard maskAPPLIED MATERIALS INC·Filed 2004·Granted Apr 29, 2008·7 cites·13 claims
- 0962US7105442B2Ashable layers for reducing critical dimensions of integrated circuit featuresAPPLIED MATERIALS INC·Filed 2002·Granted Sep 12, 2006·9 cites·8 claims
- 1057US7262106B2Absorber layer for DSA processingAPPLIED MATERIALS INC·Filed 2004·Granted Aug 28, 2007·4 cites·29 claims
- 1155US2008230154A1Absorber layer for dsa processingAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 1253US7737040B2Method of reducing critical dimension bias during fabrication of a semiconductor deviceAPPLIED MATERIALS INC·Filed 2007·Granted Jun 15, 2010·0 cites·8 claims
- 1353US2008254233A1Plasma-induced charge damage control for plasma enhanced chemical vapor deposition processesLEE KWANGDUK DOUGLAS·Filed 2007·Application pending·0 cites
- 1452US2006292808A1Absorber layer for dsa processingAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 1551US2007207275A1Enhancement of remote plasma source clean for dielectric filmsAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 1650US7094442B2Methods for the reduction and elimination of particulate contamination with CVD of amorphous carbonAPPLIED MATERIALS INC·Filed 2004·Granted Aug 22, 2006·4 cites·18 claims
- 1748US2013284090A1Compensating concentration uncertainityBALASUBRAMANIAN GANESH·Filed 2013·Application pending·0 cites
- 1844US8125034B2Graded ARC for high NA and immersion lithographyYEH WENDY H·Filed 2010·Granted Feb 28, 2012·0 cites·11 claims
- 1944US2007243721A1Absorber layer for dsa processingAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 2044US2006222771A1Methods for the reduction and elimination of particulate contamination with cvd of amorphous carbonSEAMONS MARTIN J·Filed 2006·Application pending·0 cites
- 2143US2009093128A1Methods for high temperature deposition of an amorphous carbon layerSEAMONS MARTIN JAY·Filed 2007·Application pending·0 cites
- 2243US2007286965A1Methods for the reduction and elimination of particulate contamination with cvd of amorphous carbonSEAMONS MARTIN JAY·Filed 2006·Application pending·0 cites
- 2342US2009004875A1Methods of trimming amorphous carbon film for forming ultra thin structures on a substrateSHEN MEIHUA·Filed 2008·Application pending·0 cites
- 2441US2005150452A1Process kit design for deposition chamberFiled 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Wendy H. Yeh files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →