Inventor · disambiguated record
William E. Bernier
Also filed as: BERNIER WILLIAM E · BERNIER WILLIAM EMMETT
35 granted patents·5 pending applications·704 citations·filing 1981–2022
97Inventor score
Files withIBM29UNIV NEW YORK STATE RES FOUND5BERNIER WILLIAM E4OPERATIONS TECH DEVELOPMENT NFP1SMITH GLEN A1
Top patents by PatentIndex Score
40 records- 0194US6559666B2Method and device for semiconductor testing using electrically conductive adhesivesIBM·Filed 2001·Granted May 6, 2003·80 cites·16 claims
- 0294US5847929AAttaching heat sinks directly to flip chips and ceramic chip carriersIBM·Filed 1996·Granted Dec 8, 1998·164 cites·16 claims
- 0392US6069023AAttaching heat sinks directly to flip chips and ceramic chip carriersIBM·Filed 1998·Granted May 30, 2000·115 cites·46 claims
- 0491US6251707B1Attaching heat sinks directly to flip chips and ceramic chip carriersIBM·Filed 2000·Granted Jun 26, 2001·63 cites·5 claims
- 0589US6425772B1Conductive adhesive having a palladium matrix interface between two metal surfacesIBM·Filed 2001·Granted Jul 30, 2002·59 cites·14 claims
- 0689US4374001AElectrolytic printingIBM·Filed 1981·Granted Feb 15, 1983·38 cites·24 claims
- 0786US8444043B1Uniform solder reflow fixtureBERNIER WILLIAM E·Filed 2012·Granted May 21, 2013·11 cites·18 claims
- 0886US4444626AElectrochromic printingIBM·Filed 1983·Granted Apr 24, 1984·32 cites·24 claims
- 0985US10661261B2Metal oxide nanofibrous materials for photodegradation of environmental toxinsUNIV NEW YORK STATE RES FOUND·Filed 2016·Granted May 26, 2020·4 cites·26 claims
- 1085US7119003B2Extension of fatigue life for C4 solder ball to chip connectionIBM·Filed 2005·Granted Oct 10, 2006·14 cites·19 claims
- 1181US7566649B2Compressible films surrounding solder connectorsIBM·Filed 2007·Granted Jul 28, 2009·8 cites·19 claims
- 1279US6550667B2Flux composition and soldering method for high density arraysIBM·Filed 2000·Granted Apr 22, 2003·17 cites·32 claims
- 1378US8957531B2Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivityBERNIER WILLIAM E·Filed 2011·Granted Feb 17, 2015·4 cites·17 claims
- 1478US7442878B2Low stress conductive polymer bumpIBM·Filed 2006·Granted Oct 28, 2008·7 cites·16 claims
- 1576US7316572B2Compliant electrical contactsIBM·Filed 2005·Granted Jan 8, 2008·6 cites·14 claims
- 1674US11810893B2Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protectionIBM·Filed 2021·Granted Nov 7, 2023·0 cites·1 claims
- 1774US11049841B2Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protectionIBM·Filed 2017·Granted Jun 29, 2021·1 cites·3 claims
- 1868US6268739B1Method and device for semiconductor testing using electrically conductive adhesivesIBM·Filed 2000·Granted Jul 31, 2001·12 cites·9 claims
- 1965US7170187B2Low stress conductive polymer bumpIBM·Filed 2004·Granted Jan 30, 2007·11 cites·5 claims
- 2064US12064753B2Metal oxide nanofibrous materials for photodegradation of environmental toxinsUNIV NEW YORK STATE RES FOUND·Filed 2020·Granted Aug 20, 2024·0 cites·20 claims
- 2161US6288559B1Semiconductor testing using electrically conductive adhesivesIBM·Filed 1998·Granted Sep 11, 2001·20 cites·17 claims
- 2260US2018350768A1Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shielding and ProtectionIBM·Filed 2018·Application pending·0 cites
- 2358US9899279B2Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivityIBM·Filed 2014·Granted Feb 20, 2018·0 cites·10 claims
- 2458US7332821B2Compressible films surrounding solder connectorsIBM·Filed 2004·Granted Feb 19, 2008·7 cites·21 claims
- 2556US10699972B2Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivityIBM·Filed 2017·Granted Jun 30, 2020·0 cites·16 claims
- 2655US2016233190A1Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shielding and ProtectionIBM·Filed 2016·Application pending·0 cites
- 2752US2023105420A1Resilient direct part marking on carbon steel using laser engraving and coating processesOPERATIONS TECH DEVELOPMENT NFP·Filed 2022·Application pending·0 cites
- 2851US6492071B1Wafer scale encapsulation for integrated flip chip and surface mount technology assemblyIBM·Filed 2000·Granted Dec 10, 2002·4 cites·19 claims
- 2950US6331119B1Conductive adhesive having a palladium matrix interface between two metal surfacesIBM·Filed 1999·Granted Dec 18, 2001·14 cites·12 claims
- 3050US2013082365A1Interposer for ESD, EMI, and EMCBERNIER WILLIAM E·Filed 2011·Application pending·0 cites
- 3148US10459121B1Increased thermal stabilization of optical absorbersUNIV NEW YORK STATE RES FOUND·Filed 2017·Granted Oct 29, 2019·0 cites·18 claims
- 3248US9915757B1Increased thermal stabilization of optical absorbersUNIV NEW YORK STATE RES FOUND·Filed 2014·Granted Mar 13, 2018·0 cites·12 claims
- 3347US2008000080A1Compliant electrical contactsBERNIER WILLIAM E·Filed 2007·Application pending·0 cites
- 3444US6921015B2Solder protective coating and fluxless joining of flip chip devices on laminates with plated solderIBM·Filed 2003·Granted Jul 26, 2005·1 cites·10 claims
- 3542US6255208B1Selective wafer-level testing and burn-inIBM·Filed 1999·Granted Jul 3, 2001·10 cites·18 claims
- 3640US9920220B2Conductive films and devices comprised thereofUNIV NEW YORK STATE RES FOUND·Filed 2014·Granted Mar 20, 2018·0 cites·17 claims
- 3739US8167962B2Pulpstone for long fiber pulp productionSMITH GLEN A·Filed 2008·Granted May 1, 2012·0 cites·24 claims
- 3839US7067916B2Extension of fatigue life for C4 solder ball to chip connectionIBM·Filed 2001·Granted Jun 27, 2006·0 cites·19 claims
- 3937US6585150B1Solder protective coating and fluxless joining of flip chip devices on laminates with plated solderIBM·Filed 2000·Granted Jul 1, 2003·0 cites·15 claims
- 4035US4453171AReduced electrode wear in electrolytic printing by pH control of the print reaction zoneIBM·Filed 1982·Granted Jun 5, 1984·2 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →