Interposer for ESD, EMI, and EMC

Abstract

A interposer sandwich structure comprises a top interposer and a bottom interposer enclosing an integrated circuit electronic device that includes means for attaching the device to the bottom interposer, and an interconnection structure connecting the top interposer to the bottom interposer. The top interposer may also be directly connected to a chip carrier in addition to the bottom interposer. The structure provides shielding and protection of the device against Electrostatic Discharge (ESD), Electromagnetic Interference (EMI), and Electromagnetic Conductivity (EMC) in miniaturized 3D packaging.

We claim: 
     
         1 . An interposer sandwich structure article of manufacture comprising a top interposer and a bottom interposer enclosing an integrated circuit electronic device, an attaching structure for attaching said device to said bottom interposer, and an interconnection structure connecting said top interposer to said bottom interposer. 
     
     
         2 . The article of manufacture of  claim 1  wherein said attaching structure for attaching said device to said bottom interposer comprise small metal bumps and said interconnection structure comprises large metal bumps extending from said top interposer and fused with small metal bumps extending from said bottom interposer. 
     
     
         3 . The article of manufacture of  claim 1  wherein said attaching structure for attaching said device to said bottom interposer comprise small solder bumps and said interconnection structure comprises large solder bumps extending from said top interposer an fused with small solder bumps extending from said bottom interposer. 
     
     
         4 . The article of manufacture of  claim 1  wherein said attaching structure for attaching said device to said bottom interposer comprise small solder bumps and said interconnection structure comprises large copper bumps extending from said top interposer and fused with small solder bumps extending from said bottom interposer. 
     
     
         5 . The article of manufacture of  claim 1  wherein said interposers are selected from silicon interposers, ceramic interposers and polymeric interposers and combinations thereof. 
     
     
         6 . The article of manufacture of  claim 1  wherein said interposers comprise silicon interposers. 
     
     
         7 . The article of manufacture of  claim 1  wherein said top interposer is also directly connected to a chip carrier. 
     
     
         8 . The article of manufacture of  claim 1  wherein said top interposer includes a blanket metal coating on at least one of the bottom or top surfaces of said top interposer. 
     
     
         9 . The article of manufacture of  claim 1  wherein said attaching structure for attaching said device to said bottom interposer comprises electrical connections to an electrical ground or bias. 
     
     
         10 . The article of manufacture of  claim 1  wherein said top interposer comprises connections to a chip carrier. 
     
     
         11 . The article of manufacture of  claim 10  wherein said connections to said chip carrier comprises connections to an electrical ground or bias. 
     
     
         12 . The article of manufacture of  claim 1  comprising a plurality of said devices connected to said bottom interposer wherein said top interposer is operatively associated with less than all of said devices to provide selective functional isolation of said devices for shielding for maximum miniaturization. 
     
     
         13 . The article of manufacture of  claim 1  comprising a thermal interface material operatively associated with said device to provide rapid heat dissipation from said device. 
     
     
         13 . The article of manufacture of  claim 12  comprising a thermal interface material operatively associated with said devices to provide rapid heat dissipation from said devices.