Inventor · disambiguated record
Wilfred Gomes
Also filed as: GOMES WILFRED
59 granted patents·164 pending applications·113 citations·filing 2002–2025
98Inventor score
Top patents by PatentIndex Score
223 records- 0198US11087832B1Three-dimensional nanoribbon-based static random-access memoryINTEL CORP·Filed 2020·Granted Aug 10, 2021·18 cites·20 claims
- 0296US11018264B1Three-dimensional nanoribbon-based logicINTEL CORP·Filed 2019·Granted May 25, 2021·18 cites·20 claims
- 0395US11257822B2Three-dimensional nanoribbon-based dynamic random-access memoryINTEL CORP·Filed 2019·Granted Feb 22, 2022·9 cites·26 claims
- 0495US11239238B2Thin film transistor based memory cells on both sides of a layer of logic devicesINTEL CORP·Filed 2019·Granted Feb 1, 2022·13 cites·23 claims
- 0594US11056492B1Dense memory arrays utilizing access transistors with back-side contactsINTEL CORP·Filed 2019·Granted Jul 6, 2021·9 cites·18 claims
- 0693US12271306B2Integrated three-dimensional (3D) DRAM cacheINTEL CORP·Filed 2021·Granted Apr 8, 2025·3 cites·20 claims
- 0793US11335686B2Transistors with back-side contacts to create three dimensional memory and logicINTEL CORP·Filed 2019·Granted May 17, 2022·8 cites·20 claims
- 0892US12381193B2Integrated circuit assembliesINTEL CORP·Filed 2021·Granted Aug 5, 2025·2 cites·26 claims
- 0991US12170273B2Integrated circuit assemblies with direct chip attach to circuit boardsINTEL CORP·Filed 2021·Granted Dec 17, 2024·2 cites·20 claims
- 1091US11139300B2Three-dimensional memory arrays with layer selector transistorsINTEL CORP·Filed 2019·Granted Oct 5, 2021·5 cites·20 claims
- 1190US11024601B2HyperchipINTEL CORP·Filed 2017·Granted Jun 1, 2021·4 cites·22 claims
- 1288US11894359B2Distributed semiconductor die and package architectureINTEL CORP·Filed 2022·Granted Feb 6, 2024·1 cites·23 claims
- 1387US12355002B2HyperchipINTEL CORP·Filed 2024·Granted Jul 8, 2025·0 cites·20 claims
- 1487US11824041B2HyperchipINTEL CORP·Filed 2021·Granted Nov 21, 2023·1 cites·14 claims
- 1586US12432897B2Cooling approaches for stitched diesINTEL CORP·Filed 2021·Granted Sep 30, 2025·1 cites·22 claims
- 1685US12074138B2HyperchipINTEL CORP·Filed 2023·Granted Aug 27, 2024·0 cites·20 claims
- 1784US12412835B2Back-side power delivery with glass support at the frontINTEL CORP·Filed 2021·Granted Sep 9, 2025·1 cites·20 claims
- 1884US12327809B2Vertically stacked and bonded memory arraysINTEL CORP·Filed 2021·Granted Jun 10, 2025·1 cites·20 claims
- 1983US12147083B2Hybrid manufacturing for integrating photonic and electronic componentsINTEL CORP·Filed 2020·Granted Nov 19, 2024·1 cites·21 claims
- 2083US11387198B2Device, system and method for providing inductor structuresINTEL CORP·Filed 2017·Granted Jul 12, 2022·3 cites·15 claims
- 2182US12310001B2Decoupling capacitors and methods of fabricationINTEL CORP·Filed 2021·Granted May 20, 2025·1 cites·20 claims
- 2282US11984430B2HyperchipINTEL CORP·Filed 2023·Granted May 14, 2024·0 cites·8 claims
- 2382US11652060B2Die interconnection scheme for providing a high yielding process for high performance microprocessorsINTEL CORP·Filed 2018·Granted May 16, 2023·3 cites·20 claims
- 2481US11901347B2Microelectronic package with three-dimensional (3D) monolithic memory dieINTEL CORP·Filed 2020·Granted Feb 13, 2024·1 cites·19 claims
- 2580US12278229B2Hybrid manufacturing for integrated circuit devices and assembliesINTEL CORP·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
- 2680US11257804B2Distributed semiconductor die and package architectureINTEL CORP·Filed 2020·Granted Feb 22, 2022·1 cites·12 claims
- 2780US2024389300A1Three-dimensional memory arrays with layer selector transistorsINTEL CORP·Filed 2024·Application pending·0 cites
- 2879US2025116812A1Multi-layered optical integrated circuit assembly with a monocrystalline waveguide and lower crystallinity bonding layerINTEL CORP·Filed 2024·Application pending·0 cites
- 2978US11373987B2Device, method and system for providing a stacked arrangement of integrated circuit diesINTEL CORP·Filed 2017·Granted Jun 28, 2022·2 cites·7 claims
- 3078US10784204B2Rlink—die to die channel interconnect configurations to improve signalingINTEL CORP·Filed 2016·Granted Sep 22, 2020·3 cites·22 claims
- 3176US2025031362A1Arrays of double-sided dram cells including capacitors on the frontside and backside of a stacked transistor structureINTEL CORP·Filed 2024·Application pending·0 cites
- 3276US2025201797A1Hybrid manufacturing for integrated circuit devices and assembliesINTEL CORP·Filed 2025·Application pending·0 cites
- 3376US2025020873A1Hybrid manufacturing for integrating photonic and electronic componentsINTEL CORP·Filed 2024·Application pending·0 cites
- 3475US2025300152A1Integrated circuit assembliesINTEL CORP·Filed 2025·Application pending·0 cites
- 3574US2025040231A1Gallium nitride (gan) three-dimensional integrated circuit technologyINTEL CORP·Filed 2024·Application pending·0 cites
- 3673US12471362B2Integrated circuit structures having ultra-high conductivity global routingINTEL CORP·Filed 2022·Granted Nov 11, 2025·0 cites·20 claims
- 3772US12114479B2Three-dimensional memory arrays with layer selector transistorsINTEL CORP·Filed 2021·Granted Oct 8, 2024·0 cites·20 claims
- 3872US11830829B2Device, system and method for providing inductor structuresINTEL CORP·Filed 2022·Granted Nov 28, 2023·0 cites·16 claims
- 3971US12197007B2Multi-layered optical integrated circuit assembly with a monocrystalline waveguide and lower crystallinity bonding layerINTEL CORP·Filed 2021·Granted Jan 14, 2025·0 cites·20 claims
- 4070US11749663B2Device, method and system for providing a stacked arrangement of integrated circuit diesINTEL CORP·Filed 2022·Granted Sep 5, 2023·0 cites·20 claims
- 4170US11569173B2Bridge hub tiling architectureINTEL CORP·Filed 2017·Granted Jan 31, 2023·1 cites·21 claims
- 4269US11817442B2Hybrid manufacturing for integrated circuit devices and assembliesINTEL CORP·Filed 2020·Granted Nov 14, 2023·0 cites·45 claims
- 4369US11690211B2Thin film transistor based memory cells on both sides of a layer of logic devicesINTEL CORP·Filed 2021·Granted Jun 27, 2023·0 cites·19 claims
- 4468US2023138386A1Bridge hub tiling architectureINTEL CORP·Filed 2022·Application pending·0 cites
- 4567US12058849B2Three-dimensional nanoribbon-based dynamic random-access memoryINTEL CORP·Filed 2021·Granted Aug 6, 2024·0 cites·20 claims
- 4667US2023245974A1Die interconnection scheme for providing a high yielding process for high performance microprocessorsINTEL CORP·Filed 2023·Application pending·0 cites
- 4767US2025386512A1One-transistor memory cell with a channel region around source and drain regionsINTEL CORP·Filed 2024·Application pending·0 cites
- 4865US2025311203A1Heterogeneous memory stack with shared logic circuitINTEL CORP·Filed 2024·Application pending·0 cites
- 4965US2025358993A1Multi-gate negative differential impedance device for sramINTEL CORP·Filed 2024·Application pending·0 cites
- 5065US2025294777A1Integrated circuit device with memory array and shared gain elementINTEL CORP·Filed 2024·Application pending·0 cites
Showing the top 50 of 223 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →