Inventor · disambiguated record

Won Chul Do

Also filed as: DO WON C · DO WON CHUL · DO WON CHUL DO

67 granted patents·13 pending applications·435 citations·filing 2001–2025

99Inventor score

Technology areasH10W H01L H10P

Files withAMKOR TECHNOLOGY INC37 AMKOR TECH SINGAPORE HOLDING PTE LTD33 DO WON CHUL3 KELLY MICHAEL G3 PAEK JONG SIK2

Top patents by PatentIndex Score

80 records

0198US11424155B2Semiconductor device package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Aug 23, 2022·4 cites·20 claims
0298US9000586B2Semiconductor device and manufacturing method thereofDO WON CHUL·Filed 2012·Granted Apr 7, 2015·49 cites·20 claims
0397US9349681B1Semiconductor device package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted May 24, 2016·16 cites·20 claims
0497US8362612B1Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2010·Granted Jan 29, 2013·53 cites·20 claims
0596US9966300B1Semiconductor device package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted May 8, 2018·13 cites·20 claims
0696US8552548B1Conductive pad on protruding through electrode semiconductor deviceDO WON CHUL·Filed 2011·Granted Oct 8, 2013·31 cites·17 claims
0795US10283400B1Semiconductor device package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted May 7, 2019·11 cites·20 claims
0895US9941180B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Apr 10, 2018·28 cites·19 claims
0995US9391043B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Jul 12, 2016·12 cites·20 claims
1095US9048125B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2013·Granted Jun 2, 2015·20 cites·20 claims
1194US11562964B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jan 24, 2023·5 cites·20 claims
1292US11881458B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Jan 23, 2024·2 cites·21 claims
1392US10008393B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Jun 26, 2018·7 cites·22 claims
1492US8487445B1Semiconductor device having through electrodes protruding from dielectric layerDO WON CHUL·Filed 2010·Granted Jul 16, 2013·20 cites·16 claims
1591US10714378B2Semiconductor device package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2019·Granted Jul 14, 2020·5 cites·20 claims
1691US10340244B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Jul 2, 2019·7 cites·20 claims
1791US9966276B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted May 8, 2018·5 cites·20 claims
1890US10297466B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted May 21, 2019·4 cites·20 claims
1990US9553041B1Semiconductor device package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Jan 24, 2017·5 cites·20 claims
2090US8796072B2Method and system for a semiconductor device package with a die-to-die first bondKELLY MICHAEL G·Filed 2012·Granted Aug 5, 2014·11 cites·20 claims
2188US11574890B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Feb 7, 2023·2 cites·16 claims
2288US10090234B2Semiconductor device package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Oct 2, 2018·4 cites·20 claims
2388US9437575B1Semiconductor device package formed in a chip-on-wafer last process using thin film adhesivesAMKOR TECHNOLOGY INC·Filed 2014·Granted Sep 6, 2016·8 cites·19 claims
2487US10475770B2Semiconductor device having stacked dies and stacked pillars and method of manufacturing thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Nov 12, 2019·6 cites·20 claims
2587US10410967B1Electronic device comprising a conductive pad on a protruding-through electrodeAMKOR TECHNOLOGY INC·Filed 2018·Granted Sep 10, 2019·3 cites·20 claims
2687US10388582B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Aug 20, 2019·5 cites·20 claims
2786US9136159B2Method and system for a semiconductor for device package with a die-to-packaging substrate first bondKELLY MICHAEL G·Filed 2012·Granted Sep 15, 2015·6 cites·20 claims
2885US12500199B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Dec 16, 2025·0 cites·20 claims
2985US9536858B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Jan 3, 2017·3 cites·20 claims
3085US9040349B2Method and system for a semiconductor device package with a die to interposer wafer first bondKELLY MICHAEL G·Filed 2012·Granted May 26, 2015·5 cites·20 claims
3185US2025038042A1Semiconductor device package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
3284US7042068B2Leadframe and semiconductor package made using the leadframeAMKOR TECHNOLOGY INC·Filed 2001·Granted May 9, 2006·32 cites·18 claims
3384US2024332032A1Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
3482US10867956B2Method of manufacturing a semiconductor deviceAMKOR TECHNOLOGY INC·Filed 2015·Granted Dec 15, 2020·4 cites·7 claims
3582US10679952B2Semiconductor device having an encapsulated front side and interposer and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Jun 9, 2020·2 cites·22 claims
3682US8618658B1Semiconductor device and fabricating method thereofPAEK JONG SIK·Filed 2010·Granted Dec 31, 2013·7 cites·13 claims
3781US11018107B2Semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted May 25, 2021·2 cites·22 claims
3880US12388018B2Device chip scale package including a protective layer and method of manufacturing a device chip scale packageAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
3980US8981572B1Conductive pad on protruding through electrode semiconductor deviceAMKOR TECHNOLOGY INC·Filed 2013·Granted Mar 17, 2015·3 cites·20 claims
4079US12136565B2Semiconductor device package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Nov 5, 2024·0 cites·20 claims
4179US9431323B1Conductive pad on protruding through electrodeAMKOR TECHNOLOGY INC·Filed 2015·Granted Aug 30, 2016·2 cites·20 claims
4279US8410585B2Leadframe and semiconductor package made using the leadframeAHN BYUNG HOON·Filed 2006·Granted Apr 2, 2013·9 cites·20 claims
4379US2023223365A1Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Application pending·0 cites
4478US12444690B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Oct 14, 2025·0 cites·19 claims
4578US2024421127A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
4676US12080682B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Sep 3, 2024·0 cites·20 claims
4775US11948808B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Apr 2, 2024·0 cites·18 claims
4875US11501978B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Nov 15, 2022·0 cites·20 claims
4972US12033970B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jul 9, 2024·0 cites·20 claims
5072US11527496B2Semiconductor device comprising semiconductor die and interposer and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Dec 13, 2022·0 cites·17 claims

Showing the top 50 of 80 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →