Inventor · disambiguated record
Wonchul Lee
Also filed as: LEE WONCHUL
31 granted patents·13 pending applications·96 citations·filing 2007–2024
95Inventor score
Top patents by PatentIndex Score
44 records- 0193US11329050B2Semiconductor memory devices having contact plugsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 10, 2022·3 cites·19 claims
- 0292US11670591B2Semiconductor device and method of fabricating sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 6, 2023·2 cites·16 claims
- 0392US8609546B2Pulsed bias plasma process to control microloadingLEE WONCHUL·Filed 2008·Granted Dec 17, 2013·24 cites·21 claims
- 0489US8969936B2Semiconductor devices having increased contact areas between contacts and active regions and methods of fabricating the sameLEE WONCHUL·Filed 2012·Granted Mar 3, 2015·14 cites·34 claims
- 0584US9379114B2Semiconductor device and method of fabricating the sameJEONG JIN-WON·Filed 2012·Granted Jun 28, 2016·12 cites·18 claims
- 0683US10340277B2Semiconductor devices including support patternsSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 2, 2019·4 cites·19 claims
- 0782US10720435B2Semiconductor devices including support patternsSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 21, 2020·3 cites·20 claims
- 0882US7629255B2Method for reducing microloading in etching high aspect ratio structuresLAM RES CORP·Filed 2007·Granted Dec 8, 2009·8 cites·10 claims
- 0981US11917812B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 27, 2024·1 cites·20 claims
- 1079US12417977B2Semiconductor device and method of fabricating sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Sep 16, 2025·0 cites·16 claims
- 1179US9519576B2Memory controller, method of operating the same and memory system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Dec 13, 2016·6 cites·19 claims
- 1279US2024206157A1Semiconductor memory devices having contact plugsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1378US9129902B2Continuous plasma ETCH processLAM RES CORP·Filed 2013·Granted Sep 8, 2015·3 cites·18 claims
- 1477US8518282B2Method of controlling etch microloading for a tungsten-containing layerLEE WONCHUL·Filed 2008·Granted Aug 27, 2013·5 cites·20 claims
- 1576US10347641B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 9, 2019·2 cites·20 claims
- 1673US12009299B2Semiconductor device and method of fabricating sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 11, 2024·0 cites·20 claims
- 1773US11968823B2Semiconductor memory devices having contact plugsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 23, 2024·0 cites·20 claims
- 1872US12426248B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Sep 23, 2025·0 cites·20 claims
- 1971US9213598B2Nonvolatile memory device and method of operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Dec 15, 2015·3 cites·20 claims
- 2067US9348708B2Memory system performing address mapping according to bad page mapSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 24, 2016·2 cites·12 claims
- 2164US9059116B2Etch with pulsed biasJAIN AMIT·Filed 2011·Granted Jun 16, 2015·1 cites·15 claims
- 2263US8802571B2Method of hard mask CD control by Ar sputteringLEE WONCHUL·Filed 2011·Granted Aug 12, 2014·1 cites·19 claims
- 2363US2025218981A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2462US12477928B2Display moduleSAMSUNG DISPLAY CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 2560US8124538B2Selective etch of high-k dielectric materialBAE IN DEOG·Filed 2009·Granted Feb 28, 2012·2 cites·15 claims
- 2659US2024266170A1Pattern forming method, semiconductor memory device, and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2756US9607848B2Etch process with pre-etch transient conditioningLAM RES CORP·Filed 2016·Granted Mar 28, 2017·0 cites·12 claims
- 2855US9257296B2Etch process with pre-etch transient conditioningLAM RES CORP·Filed 2015·Granted Feb 9, 2016·0 cites·12 claims
- 2955US9142417B2Etch process with pre-etch transient conditioningLAM RES CORP·Filed 2012·Granted Sep 22, 2015·0 cites·18 claims
- 3054US2024276843A1Display module and method of manufacturing display moduleSAMSUNG DISPLAY CO LTD·Filed 2023·Application pending·0 cites
- 3154US2024354018A1Storage system with bad blocks, and operating method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3253US2024319890A1Electronic device including a plurality of storage devices and operating method of electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3352US2024211388A1Electronic device for timeout prevention and operation method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3451US11195837B2Semiconductor devices including support patternsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 7, 2021·0 cites·20 claims
- 3551US2025173076A1Storage system using mapping information and cloud system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3651US2023133763A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3750US9530658B2Continuous plasma etch processLAM RES CORP·Filed 2015·Granted Dec 27, 2016·0 cites·22 claims
- 3849US12408330B2Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 2, 2025·0 cites·20 claims
- 3948US11742212B2Directional deposition in etch chamberLAM RES CORP·Filed 2019·Granted Aug 29, 2023·0 cites·14 claims
- 4048US10901252B2Display deviceSAMSUNG DISPLAY CO LTD·Filed 2018·Granted Jan 26, 2021·0 cites·27 claims
- 4144US2020103708A1Display deviceSAMSUNG DISPLAY CO LTD·Filed 2019·Application pending·0 cites
- 4243US2014215133A1Memory system and related block management methodSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 4340US2019067616A1Organic light-emitting deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 4440US2018259704A1Display deviceSAMSUNG DISPLAY CO LTD·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →