Inventor · disambiguated record
Xinglong Chen
Also filed as: CHEN XINGLONG
56 granted patents·7 pending applications·2,978 citations·filing 2007–2021
99Inventor score
Files withAPPLIED MATERIALS INC42PETROCHINA CO LTD7SAMSUNG ELECTRONICS CO LTD3SHENYANG KINGSEMI CO LTD2XINJIANG TECHNICAL INST OF PHYSICS & CHEMISTRY CHINESE ACADEMY OF SCIENCES2
Top patents by PatentIndex Score
63 records- 0199US9144147B2Semiconductor processing system and methods using capacitively coupled plasmaAPPLIED MATERIALS INC·Filed 2013·Granted Sep 22, 2015·188 cites·11 claims
- 0298US10354843B2Chemical control features in wafer process equipmentAPPLIED MATERIALS INC·Filed 2017·Granted Jul 16, 2019·40 cites·20 claims
- 0398US10032606B2Semiconductor processing with DC assisted RF power for improved controlAPPLIED MATERIALS INC·Filed 2016·Granted Jul 24, 2018·94 cites·13 claims
- 0498US9991134B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2014·Granted Jun 5, 2018·100 cites·17 claims
- 0598US9978564B2Chemical control features in wafer process equipmentAPPLIED MATERIALS INC·Filed 2015·Granted May 22, 2018·106 cites·13 claims
- 0698US9892888B2Particle generation suppresor by DC bias modulationAPPLIED MATERIALS INC·Filed 2017·Granted Feb 13, 2018·26 cites·12 claims
- 0798US9704723B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2015·Granted Jul 11, 2017·114 cites·17 claims
- 0898US9659792B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2015·Granted May 23, 2017·125 cites·13 claims
- 0998US9593421B2Particle generation suppressor by DC bias modulationAPPLIED MATERIALS INC·Filed 2014·Granted Mar 14, 2017·63 cites·10 claims
- 1098US9449850B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2015·Granted Sep 20, 2016·135 cites·18 claims
- 1198US9384997B2Dry-etch selectivityAPPLIED MATERIALS INC·Filed 2015·Granted Jul 5, 2016·146 cites·20 claims
- 1298US9373517B2Semiconductor processing with DC assisted RF power for improved controlAPPLIED MATERIALS INC·Filed 2013·Granted Jun 21, 2016·137 cites·20 claims
- 1398US9362130B2Enhanced etching processes using remote plasma sourcesAPPLIED MATERIALS INC·Filed 2014·Granted Jun 7, 2016·138 cites·15 claims
- 1498US9184055B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2014·Granted Nov 10, 2015·181 cites·20 claims
- 1598US9153442B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2014·Granted Oct 6, 2015·220 cites·13 claims
- 1698US9132436B2Chemical control features in wafer process equipmentAPPLIED MATERIALS INC·Filed 2013·Granted Sep 15, 2015·198 cites·19 claims
- 1798US9093371B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2014·Granted Jul 28, 2015·184 cites·17 claims
- 1898US9023732B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2014·Granted May 5, 2015·187 cites·14 claims
- 1998US8969212B2Dry-etch selectivityAPPLIED MATERIALS INC·Filed 2013·Granted Mar 3, 2015·184 cites·20 claims
- 2097US10504697B2Particle generation suppresor by DC bias modulationAPPLIED MATERIALS INC·Filed 2017·Granted Dec 10, 2019·8 cites·13 claims
- 2197US10256079B2Semiconductor processing systems having multiple plasma configurationsAPPLIED MATERIALS INC·Filed 2013·Granted Apr 9, 2019·42 cites·23 claims
- 2297US10062587B2Pedestal with multi-zone temperature control and multiple purge capabilitiesAPPLIED MATERIALS INC·Filed 2016·Granted Aug 28, 2018·96 cites·18 claims
- 2396US9502218B2RPS assisted RF plasma source for semiconductor processingAPPLIED MATERIALS INC·Filed 2015·Granted Nov 22, 2016·12 cites·14 claims
- 2496US9267739B2Pedestal with multi-zone temperature control and multiple purge capabilitiesAPPLIED MATERIALS INC·Filed 2012·Granted Feb 23, 2016·52 cites·14 claims
- 2596US8894767B2Flow control features of CVD chambersCHUC KIEN N·Filed 2010·Granted Nov 25, 2014·107 cites·16 claims
- 2694US10283321B2Semiconductor processing system and methods using capacitively coupled plasmaYANG JANG GYOO·Filed 2011·Granted May 7, 2019·39 cites·15 claims
- 2794US10056233B2RPS assisted RF plasma source for semiconductor processingAPPLIED MATERIALS INC·Filed 2017·Granted Aug 21, 2018·7 cites·14 claims
- 2891US11024486B2Semiconductor processing systems having multiple plasma configurationsAPPLIED MATERIALS INC·Filed 2017·Granted Jun 1, 2021·6 cites·16 claims
- 2991US9741545B2RPS assisted RF plasma source for semiconductor processingAPPLIED MATERIALS INC·Filed 2016·Granted Aug 22, 2017·5 cites·17 claims
- 3086US12098783B2Gas flow control valve and mounting method for gas flow control valvePETROCHINA CO LTD·Filed 2021·Granted Sep 24, 2024·2 cites·10 claims
- 3186US10550472B2Flow control features of CVD chambersAPPLIED MATERIALS INC·Filed 2014·Granted Feb 4, 2020·2 cites·4 claims
- 3284US7789993B2Internal balanced coil for inductively coupled high density plasma processing chamberAPPLIED MATERIALS INC·Filed 2007·Granted Sep 7, 2010·8 cites·6 claims
- 3384US7572647B2Internal balanced coil for inductively coupled high density plasma processing chamberAPPLIED MATERIALS INC·Filed 2007·Granted Aug 11, 2009·10 cites·7 claims
- 3479US10424485B2Enhanced etching processes using remote plasma sourcesAPPLIED MATERIALS INC·Filed 2016·Granted Sep 24, 2019·2 cites·13 claims
- 3576US9768051B2Wafer clamping apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Sep 19, 2017·2 cites·18 claims
- 3672US8409355B2Low profile process kitRASHEED MUHAMMAD M·Filed 2008·Granted Apr 2, 2013·5 cites·23 claims
- 3770US12146219B2Flow control features of CVD chambersAPPLIED MATERIALS INC·Filed 2020·Granted Nov 19, 2024·0 cites·21 claims
- 3869US7848076B2Method and apparatus for providing an electrostatic chuck with reduced plasma penetration and arcingAPPLIED MATERIALS INC·Filed 2007·Granted Dec 7, 2010·3 cites·19 claims
- 3967US10170282B2Insulated semiconductor faceplate designsAPPLIED MATERIALS INC·Filed 2014·Granted Jan 1, 2019·1 cites·13 claims
- 4066US10529618B2Methods of manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 7, 2020·1 cites·17 claims
- 4165US11264213B2Chemical control features in wafer process equipmentAPPLIED MATERIALS INC·Filed 2019·Granted Mar 1, 2022·0 cites·20 claims
- 4262US2014271097A1Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 4360US8108981B2Method of making an electrostatic chuck with reduced plasma penetration and arcingLUBOMIRSKY DMITRY·Filed 2007·Granted Feb 7, 2012·1 cites·18 claims
- 4460US2016027673A1Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2015·Application pending·0 cites
- 4559US2010098882A1Plasma source for chamber cleaning and processAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 4659US2019139743A1Insulated semiconductor faceplate designsAPPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
- 4755US9202736B2Method for refurbishing an electrostatic chuck with reduced plasma penetration and arcingNARENDRNATH KADTHALA RAMAYA·Filed 2007·Granted Dec 1, 2015·1 cites·15 claims
- 4853US2008188090A1Internal balanced coil for inductively coupled high density plasma processing chamberAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 4952US9865474B2Etching method using plasma, and method of fabricating semiconductor device including the etching methodSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 9, 2018·0 cites·12 claims
- 5051US12038344B2Phase power device and fluid experiment systemPETROCHINA CO LTD·Filed 2021·Granted Jul 16, 2024·0 cites·14 claims
Showing the top 50 of 63 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →