Inventor · disambiguated record
Xiaomeng Chen
Also filed as: CHEN XIAOMENG
102 granted patents·23 pending applications·1,654 citations·filing 2000–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD70IBM18TAIWAN SEMICONDUCTOR MFG14HUAWEI TECH CO LTD5JENKEM TECH CO LTD BEIJING5
Top patents by PatentIndex Score
125 records- 0199US9711555B2Dual facing BSI image sensors with wafer level stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jul 18, 2017·31 cites·20 claims
- 0299US9257399B23D integrated circuit and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 9, 2016·232 cites·19 claims
- 0399US8802538B1Methods for hybrid wafer bondingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 12, 2014·269 cites·20 claims
- 0498US9443796B2Air trench in packages incorporating hybrid bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 13, 2016·221 cites·20 claims
- 0598US9142517B2Hybrid bonding mechanisms for semiconductor wafersTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Sep 22, 2015·247 cites·17 claims
- 0697US9960129B2Hybrid bonding mechanisms for semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 1, 2018·22 cites·17 claims
- 0797US6573606B2Chip to wiring interface with single metal alloy layer applied to surface of copper interconnectIBM·Filed 2001·Granted Jun 3, 2003·307 cites·8 claims
- 0896US10790189B23D integrated circuit and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 29, 2020·9 cites·20 claims
- 0996US10665449B2Integrate rinse module in hybrid bonding platformTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 26, 2020·5 cites·20 claims
- 1096US8816358B1Plasmonic nanostructures for organic image sensorsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 26, 2014·30 cites·20 claims
- 1195US11048294B2Liquid crystal display comprising a front camera disposed inside a through hole that forms a light channel and extends through the liquid crystal display, electronic device comprising the sameHUAWEI TECH CO LTD·Filed 2017·Granted Jun 29, 2021·16 cites·15 claims
- 1295US9646860B2Alignment systems and wafer bonding systems and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 9, 2017·19 cites·20 claims
- 1394US11231376B2Method for semiconductor wafer inspection and system thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 25, 2022·3 cites·20 claims
- 1494US6503834B1Process to increase reliability CuBEOL structuresIBM·Filed 2000·Granted Jan 7, 2003·79 cites·16 claims
- 1592US11037978B2Dual facing BSI image sensors with wafer level stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 15, 2021·2 cites·20 claims
- 1691US9446467B2Integrate rinse module in hybrid bonding platformTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 20, 2016·9 cites·19 claims
- 1790US9245991B2Semiconductor device, high electron mobility transistor (HEMT) and method of manufacturingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 26, 2016·8 cites·20 claims
- 1889US9837291B2Wafer processing method and apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 5, 2017·7 cites·20 claims
- 1989US9786628B2Air trench in packages incorporating hybrid bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 10, 2017·4 cites·20 claims
- 2089US8901609B1Transistor having doped substrate and method of making the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 2, 2014·12 cites·20 claims
- 2189US8237247B2CMOS devices incorporating hybrid orientation technology (HOT) with embedded connectorsKIM BYEONG Y·Filed 2009·Granted Aug 7, 2012·12 cites·15 claims
- 2288US10109756B2Backside illuminated photo-sensitive device with gradated buffer layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 23, 2018·3 cites·20 claims
- 2387US12068207B2Simultaneous multi-bandwidth optical inspection of semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 20, 2024·1 cites·20 claims
- 2487US2024178263A1Dual facing bsi image sensors with wafer level stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2586US12255062B2Integrate rinse module in hybrid bonding platformTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 18, 2025·0 cites·20 claims
- 2686US11281252B2Liquid crystal display comprising an optical component having a component body that is competely or partially disposed in a pin through-hole in a backlight and electronic device having the sameHUAWEI TECH CO LTD·Filed 2021·Granted Mar 22, 2022·1 cites·20 claims
- 2786US10756222B2Backside illuminated photo-sensitive device with gradated buffer layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 25, 2020·1 cites·19 claims
- 2886US10090196B23D integrated circuit and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 2, 2018·3 cites·20 claims
- 2986US10037968B2Alignment systems and wafer bonding systems and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 31, 2018·4 cites·20 claims
- 3086US8969882B1Transistor having an ohmic contact by screen layer and method of making the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 3, 2015·6 cites·20 claims
- 3184US11222896B2Semiconductor arrangement with capacitor and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 11, 2022·2 cites·20 claims
- 3283US9508722B2Semiconductor arrangment with capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 29, 2016·4 cites·20 claims
- 3383US9076854B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 7, 2015·4 cites·20 claims
- 3483US8975641B1Transistor having an ohmic contact by gradient layer and method of making the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 10, 2015·6 cites·20 claims
- 3583US2025315942A1Hot spot defect detecting method and hot spot defect detecting systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3682US11503208B2Intelligent assistant control method and terminal device for recommending a photographing mode to a userHUAWEI TECH CO LTD·Filed 2018·Granted Nov 15, 2022·3 cites·20 claims
- 3782US10453889B2Dual facing BSI image sensors with wafer level stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 22, 2019·2 cites·20 claims
- 3881US9093511B2Transistor having high breakdown voltage and method of making the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 28, 2015·4 cites·20 claims
- 3980US9548376B2Method of manufacturing a semiconductor device including a barrier structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 17, 2017·2 cites·20 claims
- 4079US12387318B2Hot spot defect detecting method and hot spot defect detecting systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 4179US9170325B2Distance measurements between computing devicesZHANG ZENGBIN·Filed 2012·Granted Oct 27, 2015·11 cites·20 claims
- 4279US2022310449A13D Integrated Circuit and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4378US11854795B2Integrate rinse module in hybrid bonding platformTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 4478US10809635B2Defect inspection method and defect inspection systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 20, 2020·2 cites·20 claims
- 4578US10269807B2Semiconductor arrangement having capacitor separated from active regionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·1 cites·20 claims
- 4678US2022208607A13D Integrated Circuit and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4777US11894408B2Dual facing BSI image sensors with wafer level stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 6, 2024·0 cites·20 claims
- 4877US9466663B2Semiconductor arrangement having capacitor separated from active regionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 11, 2016·2 cites·20 claims
- 4976US10497860B2Perpendicular magnetic random-access memory (MRAM) formation by direct self-assembly methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 3, 2019·3 cites·20 claims
- 5075US9887155B2Multiple metal layer semiconductor device and low temperature stacking method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Feb 6, 2018·3 cites·20 claims
Showing the top 50 of 125 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →