Inventor · disambiguated record
Xiang Li
Also filed as: LI XIANG · Li xiang ru
33 granted patents·15 pending applications·199 citations·filing 2007–2024
96Inventor score
Files withINVENSENSE INC12UNITED MICROELECTRONICS CORP10UNISANTIS ELECT SINGAPORE PTE4FUJIAN DEER TECHNOLOGY CO LTD3HUAWEI TECH CO LTD2
Top patents by PatentIndex Score
48 records- 0198US10488274B2Acoustic ambient temperature and humidity sensingINVENSENSE INC·Filed 2018·Granted Nov 26, 2019·17 cites·17 claims
- 0298US9933319B2Acoustic ambient temperature and humidity sensingINVENSENSE INC·Filed 2015·Granted Apr 3, 2018·20 cites·7 claims
- 0398US8692340B1MEMS acoustic sensor with integrated back cavityINVENSENSE INC·Filed 2013·Granted Apr 8, 2014·54 cites·23 claims
- 0495US9114977B2MEMS device and process for RF and low resistance applicationsINVENSENSE INC·Filed 2012·Granted Aug 25, 2015·12 cites·18 claims
- 0594US10355019B1Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jul 16, 2019·11 cites·15 claims
- 0694US9618405B2Piezoelectric acoustic resonator based sensorINVENSENSE INC·Filed 2014·Granted Apr 11, 2017·19 cites·25 claims
- 0791US9428379B2MEMS acoustic sensor with integrated back cavityINVENSENSE INC·Filed 2014·Granted Aug 30, 2016·8 cites·13 claims
- 0889US9153697B2Surrounding gate transistor (SGT) structureMASUOKA FUJIO·Filed 2011·Granted Oct 6, 2015·9 cites·11 claims
- 0989US8486785B2Surround gate CMOS semiconductor deviceMASUOKA FUJIO·Filed 2011·Granted Jul 16, 2013·12 cites·10 claims
- 1088USD976981SIndustrial robotBEIJING SILING ROBOT TECH CO LTD·Filed 2022·Granted Jan 31, 2023·14 cites·1 claims
- 1188US11377347B2Method for manufacturing semiconductor structure and planarization process thereofUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jul 5, 2022·2 cites·9 claims
- 1284US10276476B1Semiconductor device and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Apr 30, 2019·4 cites·10 claims
- 1381US9809451B2Capacitive sensing structure with embedded acoustic channelsINVENSENSE INC·Filed 2015·Granted Nov 7, 2017·2 cites·19 claims
- 1480US9216897B2Capacitive sensing structure with embedded acoustic channelsINVENSENSE INC·Filed 2013·Granted Dec 22, 2015·3 cites·21 claims
- 1576US10446473B1Semiconductor device and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Oct 15, 2019·2 cites·10 claims
- 1676US8609494B2Surround gate CMOS semiconductor deviceUNISANTIS ELECT SINGAPORE PTE·Filed 2013·Granted Dec 17, 2013·4 cites·2 claims
- 1775US11162857B2Torque-angle sensorBOSCH GMBH ROBERT·Filed 2020·Granted Nov 2, 2021·1 cites·10 claims
- 1871US9344808B2Differential sensing acoustic sensorINVENSENSE INC·Filed 2014·Granted May 17, 2016·3 cites·30 claims
- 1967US10147614B1Oxide semiconductor transistor and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Dec 4, 2018·1 cites·11 claims
- 2066US10160635B2MEMS device and process for RF and low resistance applicationsINVENSENSE INC·Filed 2017·Granted Dec 25, 2018·0 cites·10 claims
- 2166US2024402111A1Method for determining electric polarization of solid system, and electronic deviceBEIJING YOUZHUJU NETWORK TECH CO LTD·Filed 2024·Application pending·0 cites
- 2265US10508022B2MEMS device and process for RF and low resistance applicationsINVENSENSE INC·Filed 2017·Granted Dec 17, 2019·0 cites·6 claims
- 2365US10164426B2Sensing and detection of ESD and other transient overstress eventsFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Dec 25, 2018·1 cites·19 claims
- 2465US2023395887A1Recycling silicon from batteries with silicon-based active materialsENEVATE CORP·Filed 2022·Application pending·0 cites
- 2563US2024114808A1Phase-change storage unit, phase-change memory, electronic device, and preparation methodHUAWEI TECH CO LTD·Filed 2023·Application pending·0 cites
- 2662US9617141B2MEMS device and process for RF and low resistance applicationsINVENSENSE INC·Filed 2015·Granted Apr 11, 2017·0 cites·7 claims
- 2761US11517875B1Modified sodium fluoride adsorbent for special purpose, preparation and application thereofFUJIAN DEER TECHNOLOGY CO LTD·Filed 2022·Granted Dec 6, 2022·0 cites·5 claims
- 2860US2024405474A1Connector, Connector Module and Connector AssemblyTYCO ELECTRONICS SHANGHAI CO LTD·Filed 2024·Application pending·0 cites
- 2955US11707730B2Large cohesive energy adsorbent for fluoride removal, preparation and application thereofFUJIAN DEER TECHNOLOGY CO LTD·Filed 2021·Granted Jul 25, 2023·0 cites·10 claims
- 3055US2025031588A1Phase-change memory material, preparation method thereof, phase-change memory chip, and deviceHUAWEI TECH CO LTD·Filed 2024·Application pending·0 cites
- 3154US11239373B2Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2020·Granted Feb 1, 2022·0 cites·20 claims
- 3251US2016308013A1Semiconductor device and production methodUNISANTIS ELECT SINGAPORE PTE·Filed 2016·Application pending·0 cites
- 3350US11701599B2Control method for rectification and purification system of electronic-grade chlorine trifluorideFUJIAN DEER TECHNOLOGY CO LTD·Filed 2021·Granted Jul 18, 2023·0 cites·2 claims
- 3449US2015357428A1Surrounding gate transistor (sgt) structureUNISANTIS ELECT SINGAPORE PTE·Filed 2015·Application pending·0 cites
- 3548US11439997B2Neutral complex cleaning solution and regeneration method for denitration catalyst with calcium poisoningUNIV TSINGHUA·Filed 2017·Granted Sep 13, 2022·0 cites·7 claims
- 3644US12159917B2Method of manufacturing capacitor structureUNITED MICROELECTRONICS CORP·Filed 2021·Granted Dec 3, 2024·0 cites·16 claims
- 3744US2015191754A1Method for preparing short-chain fatty acid having high propanoic acid content by continuous fermentationUNIV TONGJI·Filed 2013·Application pending·0 cites
- 3843US2023118623A1Buffer layer on silicon carbide substrate, and method for forming buffer layerSEMICONDUCTOR MFG ELECTRONICS SHAOXING CORP·Filed 2022·Application pending·0 cites
- 3942US10403743B2Manufacturing method of oxide semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Sep 3, 2019·0 cites·18 claims
- 4042US2019233280A1Method for processing silicon wafer with through cavity structureSHENYANG SILICON TECH CO LTD·Filed 2018·Application pending·0 cites
- 4141US10748989B2Insulating layer structure for semiconductor product, and preparation method of insulating layer structureSHENYANG SILICON TECH CO LTD·Filed 2018·Granted Aug 18, 2020·0 cites·10 claims
- 4241US8836051B2Method for producing semiconductor device and semiconductor deviceUNISANTIS ELECT SINGAPORE PTE·Filed 2013·Granted Sep 16, 2014·0 cites·11 claims
- 4339US2012313189A1Method of preventing stiction of mems devicesHUANG KEGANG·Filed 2012·Application pending·0 cites
- 4438US2010307403A1(110) dislocation-free monocrystalline silicon and its preparation and the graphite heat system usedTIANJIN HUANOU SEMICONDUCTOR MATERIAL AND TECHNOLOGY CO LTD·Filed 2007·Application pending·0 cites
- 4537US2019081183A1Oxide semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Application pending·0 cites
- 4635US2019109199A1Oxide semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Application pending·0 cites
- 4735US2019189908A1Heterostructures for Electric Field Controlled Magnetic Tunnel JunctionsINSTON INC·Filed 2018·Application pending·0 cites
- 4833US10234106B2Double-prism assembly, multi-prism combinatorial structure and light fixtureGUANGZHOU GTD LIGHTING TECH CO LTD·Filed 2016·Granted Mar 19, 2019·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →