Inventor · disambiguated record
Xi Li
Also filed as: LI XI · Li xi ran
40 granted patents·6 pending applications·309 citations·filing 2006–2024
97Inventor score
Top patents by PatentIndex Score
46 records- 0196US7476578B1Process for finFET spacer formationIBM·Filed 2007·Granted Jan 13, 2009·51 cites·6 claims
- 0295US8278164B2Semiconductor structures and methods of manufacturing the sameLI XI·Filed 2010·Granted Oct 2, 2012·19 cites·19 claims
- 0395US7560360B2Methods for enhancing trench capacitance and trench capacitorIBM·Filed 2006·Granted Jul 14, 2009·34 cites·5 claims
- 0493US9495651B2Cohort manipulation and optimizationIBM·Filed 2013·Granted Nov 15, 2016·30 cites·15 claims
- 0592US7709320B2Method of fabricating trench capacitors and memory cells using trench capacitorsIBM·Filed 2006·Granted May 4, 2010·21 cites·26 claims
- 0689USD1039099SFloatLI XI·Filed 2024·Granted Aug 13, 2024·10 cites·1 claims
- 0789US7892928B2Method of forming asymmetric spacers and methods of fabricating semiconductor device using asymmetric spacersIBM·Filed 2007·Granted Feb 22, 2011·12 cites·28 claims
- 0888US10633851B2Assembled self-recovery circular concrete-filled steel-tube composite jointUNIV QINGDAO TECHNOLOGY·Filed 2018·Granted Apr 28, 2020·12 cites·14 claims
- 0987USD975788SGame tableLI XI·Filed 2020·Granted Jan 17, 2023·13 cites·1 claims
- 1086US8008160B2Method and structure for forming trench DRAM with asymmetric strapIBM·Filed 2008·Granted Aug 30, 2011·11 cites·17 claims
- 1185US7498271B1Nitrogen based plasma process for metal gate MOS deviceIBM·Filed 2008·Granted Mar 3, 2009·10 cites·2 claims
- 1283US9659267B2Cohort cost analysis and workload migrationIBM·Filed 2013·Granted May 23, 2017·5 cites·24 claims
- 1383US7749835B2Trench memory with self-aligned strap formed by self-limiting processIBM·Filed 2008·Granted Jul 6, 2010·7 cites·8 claims
- 1481US8209069B1Aircraft sensor anticipator systemMCLOUGHLIN FRANK A·Filed 2009·Granted Jun 26, 2012·17 cites·25 claims
- 1579US7888722B2Trench capacitors and memory cells using trench capacitorsIBM·Filed 2008·Granted Feb 15, 2011·7 cites·20 claims
- 1677US8765491B2Shallow trench isolation recess repair using spacer formation processCAI MING·Filed 2010·Granted Jul 1, 2014·6 cites·13 claims
- 1776US7919379B2Dielectric spacer removalIBM·Filed 2007·Granted Apr 5, 2011·5 cites·14 claims
- 1874US8604564B2Semiconductor structures and methods of manufacturing the sameLI XI·Filed 2012·Granted Dec 10, 2013·2 cites·18 claims
- 1973USD931104SDecanterSUNSUN ELECTRONIC TECH INC·Filed 2019·Granted Sep 21, 2021·12 cites·1 claims
- 2073US8829612B2Method of forming asymmetric spacers and methods of fabricating semiconductor device using asymmetric spacersCHENG KANGGUO·Filed 2011·Granted Sep 9, 2014·2 cites·23 claims
- 2172US7494891B2Trench capacitor with void-free conductor fillIBM·Filed 2006·Granted Feb 24, 2009·5 cites·3 claims
- 2271US8492280B1Method for simultaneously forming features of different depths in a semiconductor substrateHICHRI HABIB·Filed 2012·Granted Jul 23, 2013·3 cites·15 claims
- 2370USD973138SToy pianoLI XI·Filed 2020·Granted Dec 20, 2022·4 cites·1 claims
- 2467US9013008B2Semiconductor structures and methods of manufacturing the sameIBM·Filed 2013·Granted Apr 21, 2015·1 cites·16 claims
- 2567US7682922B2Post STI trench capacitorIBM·Filed 2007·Granted Mar 23, 2010·3 cites·9 claims
- 2666US8455327B2Trench capacitor with spacer-less fabrication processPEI CHENGWEN·Filed 2011·Granted Jun 4, 2013·1 cites·7 claims
- 2765US7893480B2Trench memory with self-aligned strap formed by self-limiting processIBM·Filed 2010·Granted Feb 22, 2011·1 cites·15 claims
- 2863US7858485B2Structure and method for manufacturing trench capacitanceIBM·Filed 2008·Granted Dec 28, 2010·2 cites·9 claims
- 2956USD1043848SToyLI XI·Filed 2022·Granted Sep 24, 2024·1 cites·1 claims
- 3056US2014262039A1Method of forming asymmetric spacers and methods of fabricating semiconductor device using asymmetric spacersIBM·Filed 2014·Application pending·0 cites
- 3155US2025375784A1A locking mechanism, a dispensing pump assembly, a container system and a method for using the sameSILGAN DISPENSING SYSTEMS WUXI CO LTD·Filed 2023·Application pending·0 cites
- 3254US9053956B2Trench capacitor with spacer-less fabrication processIBM·Filed 2013·Granted Jun 9, 2015·0 cites·6 claims
- 3354US2025367694A1DispenserSILGAN DISPENSING SYSTEMS WUXI CO LTD·Filed 2023·Application pending·0 cites
- 3450US8901005B2Method for simultaneously forming features of different depths in a semiconductor substrateHICHRI HABIB·Filed 2013·Granted Dec 2, 2014·0 cites·14 claims
- 3549US2008248625A1Methods for enhancing trench capacitance and trench capacitorCHENG KANGGUO·Filed 2008·Application pending·0 cites
- 3648USD1042835SMicroneedle instrumentBEIJING GLOBAL HUAYU TECH DEVELOPMENT CO LTD·Filed 2022·Granted Sep 17, 2024·1 cites·1 claims
- 3747US11549225B2Device for detecting compaction and shear strength characteristics of asphalt mixture during construction compactionUNIV CHANGSHA SCI & TECH·Filed 2020·Granted Jan 10, 2023·0 cites·9 claims
- 3846US8299573B2Trench capacitorPEI CHENGWEN·Filed 2010·Granted Oct 30, 2012·0 cites·20 claims
- 3946US7833872B2Uniform recess of a material in a trench independent of incoming topographyIBM·Filed 2007·Granted Nov 16, 2010·0 cites·1 claims
- 4045US7683416B2Post STI trench capacitorIBM·Filed 2007·Granted Mar 23, 2010·0 cites·8 claims
- 4143US11221286B2Method for detecting compaction and shear strength characteristics of asphalt mixture during construction compactionUNIV CHANGSHA SCI & TECH·Filed 2020·Granted Jan 11, 2022·0 cites·2 claims
- 4243US10895087B1Fabricated self-resilient energy-dissipation double-steel-plate slotted shear wall structureUNIV QINGDAO TECHNOLOGY·Filed 2018·Granted Jan 19, 2021·0 cites·16 claims
- 4343US7560387B2Opening hard mask and SOI substrate in single process chamberIBM·Filed 2006·Granted Jul 14, 2009·0 cites·19 claims
- 4442US8021945B2Bottle-shaped trench capacitor with enhanced capacitanceIBM·Filed 2009·Granted Sep 20, 2011·1 cites·14 claims
- 4542US2007172965A1Non-destructive trench volume determination and trench capacitance projectionCHENG KANGGUO·Filed 2006·Application pending·0 cites
- 4639US2013043559A1Trench formation in substrateIBM·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →